TDK Electronics · TDK Europe

Compact and robust ultrasonic sensor module

The compact ultrasonic sensor module detects objects using ultrasonic waves, which are transmitted and received with only one piezoelectric disc. Here, an integrated driver and signal processor is used for signal generation and processing. The very compact design transforms the ultrasonic sensor module into a highly robust and versatile component with excellent EMC characteristics, which thanks to the solid aluminum housing is also protected against dust and splash water. As such, it is ideally suitable for numerous industrial applications and applications in harsh environments.


Benefits

 Benefit Robustness Pic

Mechanical and electrical robustness

  • Very compact dimensions
  • Aluminum housing enables stable structure
  • Dust and splash water protected due to closed membrane
  • High electromagnetic compatibility
 Benefit Features Pic

Characteristics and features

  • Emitting and receiving of ultrasonic waves with only one single piezoelectric disc
  • Transducer including intelligent integrated controller in one module
  • Measuring range 12 cm to 200 cm
  • Field of view 60°
  • Low average power consumption of 5.5 mA @ 12 V supply voltage
  • Digital IO interface
 Benefit ASIC Pic

Advanced ASIC technology integrated

  • Advanced signal processing
  • Near field detection
  • Noise suppression
  • Programmable settings adjustable by customer
    • Pre-programmed EEPROM 
    • Additional internal RAM for customer use 

Basic working principle of measurement

 Schema Pic
  • Time-of-flight sensor (in air) according

    d=½·tof·cAIR

    d: distance | tof: time-of-flight | cAIR: sound velocity in air
  • Integrated driver and signal processor controls piezo disk and calculates time of flight
  • Piezo disks emits and receives ultrasound waves
  • Time of flight signal to External Control Unit by Digital bidirectional IO
  • Distance calculated by ECU



Comparison to existing ultrasonic sensors

 Conv sensor

Conventional Ultrasonic Sensor

 Transducer Pic

Transducer +
ASIC

 Illustration

TDK Ultrasonic Sensor Module

Driver integrated

Fully integrated device

Parameter setting (EEPROM)

Product depending

Re-programmable by user

Volume [mm³]

>10,000

>2,100 *

1290

Smaller

Weight [g]

~ 8 to 10

10 to 20 *

2.3

Lighter

Protection class

Sensitive to dust and water

Product depending

Dust and water protected

More reliable

Integration effort

Low

High

Low

Optimized driver and transducer performance

* Estimated values from technical comparable products available in the market


Applications

 Level Sensing Pic
 Bots Pic
 Robot Pic

Voice over product presentation

  • Technology comparison of distance measurement
  • Applications
  • Benefits
  • Working principle of measurement
  • Sensing properties
  • Comparison to existing ultrasonic sensors
  • Summary and outlook

Get data sheets

PDF Diameter (mm) Thickness (mm) Serial resonance frequency (kHz) Type
file_pdf_box
15 13 75 X150P0754

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