TDK Electronics · TDK Europe

Ultrasonic Sensor Module

Compact and robust

The compact ultrasonic sensor module detects objects using ultrasonic waves, which are transmitted and received with only one piezoelectric disc. Here, an integrated driver and signal processor is used for signal generation and processing. The very compact design transforms the ultrasonic sensor module into a highly robust and versatile component with excellent EMC characteristics, which thanks to the solid aluminum housing is also protected against dust and splash water. As such, it is ideally suitable for numerous industrial applications and applications in harsh environments.


 Benefit Robustness Pic

Mechanical and Electrical Robustness

  • Very compact dimensions
  • Aluminum housing enables stable structure
  • Dust and splash water protected due to closed membrane
  • High electromagnetic compatibility
 Benefit Features Pic

Characteristics and Features

  • Emitting and receiving of ultrasonic waves with only one single piezoelectric disc
  • Transducer including intelligent integrated controller in one module
  • Measuring range 15 cm to 200 cm
  • Field of view 60°
  • Low average power consumption of 5.5 mA @ 12 V supply voltage
  • Digital IO interface
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Advanced ASIC Technology Integrated

  • Advanced signal processing
  • Near field detection
  • Noise suppression
  • Programmable settings adjustable by customer
    • Pre-programmed EEPROM 
    • Additional internal RAM for customer use 

Basic Working Principle of Measurement

 Schema Pic
  • Time-of-flight sensor (in air) according

    = ½·tof·cair

    d: distance | tof: time-of-flight | cAIR: sound velocity in air
  • Integrated driver and signal processor controls piezo disk and calculates time of flight
  • Piezo disks emits and receives ultrasound waves
  • Time of flight signal to External Control Unit by Digital bidirectional IO
  • Distance calculated by ECU

Comparison to Existing Ultrasonic Sensors

 Conv sensor

Conventional Ultrasonic Sensor

 Transducer Pic

Transducer +


TDK Ultrasonic Sensor Module

Driver integrated

Fully integrated device

Parameter setting (EEPROM)

Product depending

Re-programmable by user

Volume [mm³]


>2,100 *



Weight [g]

~ 8 to 10

10 to 20 *



Protection class

Sensitive to dust and water

Product depending

Dust and water protected

More reliable

Integration effort




Optimized driver and transducer performance

* Estimated values from technical comparable products available in the market


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Product Presentation

(Note: Minimal measuring distance changed from 12 to 15 cm and operating frequency from 75 to 73.5 kHz.)

Product Overview

(Note: Minimal measuring distance changed from 12 to 15 cm and operating frequency from 75 to 73.5 kHz.)

Get Data Sheets and Search

PDF Diameter (mm) Thickness (mm) Capacitance (pF) Serial resonance frequency (kHz) Type
15 13 --- 73.5 X150P0754

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Frequently Asked Questions

Can the ultrasonic sensor module be operated with less than 12 V?

The minimum voltage for the sensor to start up is around 8 V. The nominal supply voltage is 12 V, so a DC-DC converter and a level shifter for the IO line will be required.

What is the operating temperature range?

Operating temperature range is between -40 °C to +85 °C. The functionality (max. distance) may be reduced at extreme temperatures.

What is the resolution of the measurement?

The resolution is depending on the circumstances and measurement environment. Under ideal conditions, an accuracy of about  4 mm can be reached but for the majority of scenarios about 1 cm is to be expected. 

How can the module be mounted?

To achive an ideal result, TDK recommends to mechanically decouple the ultrasonic sensor module from the chassis. This can be achieved by the use of a mounting supplement. Furter informations and step file proposals can be found in the product resources.

Can the module detect an object closer than 15 cm?

Object detection without distance measurement is possible up to 0 cm with one single module.
Object detection with distance measurement up to 2 cm is possible by usage of multiple ultrasonic sensor modules.

How does temperature affect the measurement?

The speed of sound in air depends on the temperature and can be approximated as c = 331 m/s + 0.6 * T. Since the output signal of the sensor is the time of flight, the temperature should be compensated.

How does the environment influence the measurement (rain, snow, etc)?

Heavy rain, snow or dust deposited on the membrane surface can reduce the acoustic signal which therefore can influence the measurement capability. Light rain or snowfall does not affect the measurement.

Is triangulation (3D-view) possible?

Using multiple ultrasonic sensor modules, triangulation is possible.

What colors of the module are available?

Currently only black color is available.

Can the module work behind coverage (i.e. behind a glass cover)?

As the module is working with ultrasonic sound, a "free" view on the target is required.

What is the housing made of?

The housing consists of a single piece of anodized aluminum without any joints.

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