With ModCap HF, TDK adds a series that is particularly suitable for DC link applications in SiC-based converters. In combination with such very fast switching power modules, the components enable compact converters where a compact, robust design and highest power density are required.
This high frequency capability is made possible by the flat capacitor windings connected in parallel as well as the eight terminal contacts and a new type of internal busbar. Therefore, the components can be placed very close to the SiC power modules and thus absorb the high-frequency harmonics excellently up to the frequency range of several hundred kilohertz. Together with the extremely low stray inductance of 8 nH, this prevents the voltage at the power modules from overshooting too much when the current is switched off. As a result, snubber capacitors are generally not required. This, in turn, reduces the footprint and cost of new-generation inverter designs, especially those using SiC technology.
For both product families, biaxially oriented polypropylene (BOPP) is used as the dielectric, allowing a constant hotspot temperature of +90 °C until a new generation of dielectrics which TDK is currently developing enables hotspot temperatures of up to +125 °C. Simulation software is available to calculate the thermal behavior of the capacitors based on parameters such as frequency spectrum, maximum current, and customer-specific installation conditions.