TDK Corporation (TSE: 6762) presents the B82722V6*B040 series of new compact high-voltage, current-compensated ring-core double chokes. Designed primarily for rated DC voltages of up to 1250 V (630 V AC), these compact common-mode chokes (23 x 15.5 x 24 mm) effectively suppress EMI in next-generation applications. These include power converters, industrial motor drives, and switch-mode power supplies that often deploy SiC and GaN power semiconductors and feature elevated DC bus voltages, where insulation coordination and PCB space are critical.

The series covers nominal inductance values ranging from 3.3 mH to 22 mH, with rated currents between 0.85 A and 3.0 A at a rated ambient temperature of +70 °C. Multilayer solid insulation construction and testing with voltages of 3,750 V (line-to-line) ensure robust electrical isolation. Thanks to the special automated winding technique, these chokes feature high resonance frequency characteristics and a typical stray inductance of around 0.6%, helping to suppress symmetrical interference.

The epoxy coating of the ferrite core and the plastic header comply with UL 94 V-0. The design fulfills the latest IEC 60938-2 and IEC/UL 60939-3 safety requirements for EMI chokes and filters. Suitable for wave soldering and offered in a compact vertical design, the B82722V6*B040 series enables engineers to realize 1250 V DC high-voltage architectures without increasing the PCB footprint.

TDK Corporation (TSE: 6762) has introduced the MT40 series of ThermoFuse varistors (ordering code B72240M), a new generation of surge protection components (SPC) that combine a compact design with advanced safety features. Thanks to their patented overmolding technology and integrated thermal disconnecting system, these SPCs provide robust protection up to 50 kA while minimizing size (38.0 x 15.2 x 40.9 mm; L x W x H). Consequently, the MT40 series is commonly used in inverters, industrial power supplies, outdoor lighting, telecommunications systems, and surge protection devices (SPDs).

Designed for extreme electrical conditions, the MT40 series has a peak surge current capability of up to 50 kA (8/20 μs pulse) and a short-circuit current rating of up to 200 kA. The series is recognized as a UL 1449 Type 1CA component assembly, designed for use in applications with AC voltages ranging from 150 V to 550 V and DC voltages spanning from 200 V to 750 V. Additional features, such as a galvanically insulated normally open micro-switch for remote monitoring and an optional visual indicator, enhance system integration and operational safety. These MT40 components operate in temperatures ranging from -40 °C to +85 °C.

Supporting sustainable design practices and aligning with TDK’s commitment to environmental responsibility, the MT40 series is encapsulated in a flame-retardant epoxy coating. Its RoHS compliance and lead-free materials underscore its eco-conscious profile while ensuring high reliability under demanding conditions. By combining innovation, safety, and sustainability, MT40 ThermoFuse varistors offer system designers a compact, future-proof solution for next-generation industrial and communication systems.

TDK Corporation (TSE:6762) extends its X2 safety film capacitor portfolio with the new B3292xU/V series, 
now supporting higher voltages and offering compact lead spacings of 15 mm and 22.5 mm, with capacitance values from 47 nF to 1.8 µF. Rated at 350 V (AC) and robust against peak voltage pulses up to 2.5 kV 
(IEC 60384-14), the series is designed for interference suppression in demanding, space-constrained industrial and automotive environments in series with the mains. Typical applications are on-board chargers, EV charging systems, PV inverters, energy meters, and capacitive power supplies.

The entire series is now available with lead spacings from 15 mm to 52.5 mm, covering capacitance values from 47 nF to 20 µF. It passed the THB (temperature, humidity, bias) test at +85 °C, 85% RH, and rated voltage for 1000 h, meeting Grade III, Test Condition B requirements. In addition, the series offers AEC-Q200 compliance, excellent self-healing properties, and a maximum operating temperature of +110 °C, ensuring durability even under severe ambient conditions.

With their compact dimensions and high DC testing voltage (1505 V for 2 s), the B3292xU/V series provides a balanced solution of performance and size for next-generation industrial drives and automotive power electronics, supporting the growing need for efficient and space-optimized EMI suppression solutions.

For the B3292xU/V series, TDK offers a range of design tools and SPICE models.

TDK Corporation (TSE: 6762) introduces the new B43655 and B43656 series of aluminum electrolytic capacitors designed specifically for DC links in on-board chargers (OBCs) of electric vehicles. Both series are optimized for forced cooling operation, supporting the growing trend toward higher voltages and currents in next-generation OBC platforms. Due to their compact design and high ripple current capability, such capacitors are commonly used in applications requiring maximum efficiency and reliability in confined spaces. 

With a high voltage rating of 475 V and 500 V, as well as capacitances ranging from 110 µF to 880 µF, the B43655 series meets the requirements of 800 V battery architectures for modern e-mobility applications. Designed for base cooling and high ripple current density, these components offer a useful life of more than 3,000 hours at +105 °C. They also feature a maximum ripple current of 3.29 A at +105 °C and ESR values down to 100 mΩ to minimize power losses. The B43656 series, rated at 450 V, handles even higher currents of up to 4.42 A at +105 °C for demanding high-power OBC topologies. 

Both series are qualified according to AEC-Q200 Rev. E and are made with RoHS-compliant materials. They are available in compact snap-in designs ranging in diameter from 22 mm to 35 mm and in length from 25 mm to 60 mm, depending on the capacitance and voltage class. The B43655 and B43656 capacitors provide design engineers with robust, future-ready solutions for on-board chargers in electric vehicles, thanks to their enhanced electrical performance and reliability. 

The new B43655 and B43656 series will also be implemented in TDK’s web-based AlCap Useful Life Calculation Tool. 

TDK Corporation (TSE: 6762) announces the B3271xP series of DC link film capacitors, offering high thermal robustness for demanding automotive and industrial power electronics. With a maximum operating temperature of +125 °C and no power derating up to +105 °C, the series ensures stable capacitance and reliable energy buffering even in tightly packed inverter environments. This performance is particularly relevant for xEV traction inverters, onboard chargers, and DC-DC converters, where elevated ambient temperatures and continuous ripple loads are common.

The B3271xP series covers capacitance values from 0.47 µF to 110 µF and rated DC voltages from 600 V to 1200 V, enabling flexible design-in for frequency converters, high-end industrial power supplies, and solar inverters. Its polypropylene (MKP) dielectric provides inherently low losses, high ripple current capability, and excellent self-healing behavior, maintaining efficiency and extending system lifetime under harsh electrical stress.

Engineered with a flame-retardant plastic case and epoxy sealing (UL 94 V-0), the components are available with lead spacings of 27.5 mm, 37.5 mm, and 52.5 mm, and in 2-pin or, on request, 4-pin configurations to support mechanical stability and low-inductance layouts. Typical ESR values down to the single-digit milliohm range and high current capability at 10 kHz contribute to robust DC link filtering and reduced thermal rise.

Compliant with AEC-Q200E and UL 810 (construction), the B3271xP series delivers the reliability expected in automotive platforms while supporting global industrial requirements. Its combination of high-temperature endurance, broad electrical performance, and compact dimensions helps engineers optimize converter designs for efficiency, stability, and long-term durability.

For the B3271xP series, TDK provides various SPICE model libraries and the web-based Capacitor Life And Rating Application (CLARA) tool.

• µPOL module F1525 delivers 25 A each, up to 200 A when stacking multiple units, for a compact and low-height form factor in vertical power delivery designs
• Ultra-fast transient response, ultra-low DC ripple, and low spectral noise
• Integrates MOSFETs, inductors, and control in a thermally enhanced 3D structure with analog and digital interfaces

TDK Corporation (TSE: 6762) expanded its µPOL family of non-isolated DC-DC power modules by adding the FS1525. This just 3.82 mm high point-of-load (PoL) converter delivers up to 25 A and is engineered to meet the demanding requirements of AI servers, edge computing, and data center systems. By stacking or paralleling several FS1525 modules, they can deliver 200 A combined in vertical power delivery designs. This is a novel approach in which the PoL converters are located directly under the FPGA/SoC or ASIC on the backside of the PCB.

Leveraging advanced 3D chip-embedded package technology, the FS1525 integrates all critical components—including controller, driver, MOSFETs, digital core, memory banks, bypass capacitors, and power inductor—into a single component with a footprint of 7.65 x 6.80 mm (L x W). The thermally enhanced architecture with a thermal impedance of 1.4 K/W delivers superior current performance, outperforming conventional solutions at high ambient temperatures while simplifying PCB routing and enabling high-density power architectures.

Supporting input voltages from 4.5 V to 16 V and an adjustable output range from 0.6 V to 1.8 V, the FS1525 is optimized for powering modern low-voltage AI processors, including the core voltage of 3-nm to 6-nm ASICs, and SERDES rails with sub-5mV peak-to-peak ripple. Its low spectral noise performance matches well with DSPs, imaging, and advanced Automated Test Equipment (ATE) applications. Being scalable up to 200 A and designed for vertical power delivery designs, the new µPOL enhances thermal performance and maximizes board space efficiency.

FS1525 has a fast transient response, low ripple, and true differential remote sensing to ensure accurate voltage regulation at the point of load. Digital programmability via I²C and PMBus enables real-time telemetry, adaptive tuning, and fault management for voltage, current, and temperature monitoring, critical for dynamic AI workloads. The module also offers analog Vout settings tailored to leading FPGA/SoCs and ASICs, supporting advanced features such as Altera’s SmartVID for Agilex FPGA series.

The new µPOL module integrates seamlessly with modern computing form factors, including PCIe, VPX, SMARC, and 1U to 3U rack systems, providing high flexibility for system designers. It is already deployed in proven designs for FPGA/SoCs such as Altera Agilex™, AMD Versal™ Edge, and AMD-Xilinx platforms, including Zynq UltraScale+ MPSoC and Versal ACAP, widely used in AI and machine learning applications.

As part of TDK’s comprehensive µPOL portfolio spanning 1 A to 200 A, the FS1525 offers a unified system-level power solution. With plug-and-play simplicity and no external compensation required, it accelerates development cycles, reduces design complexity, and lowers overall system cost. More than a power module, the FS1525 represents a complete power ecosystem designed to drive the future of intelligent computing. Evaluation boards for 25 A and 50 A are in stock at DigiKey and Mouser. Stackable boards for 100 A and 200 A are available upon request.

Versal is a registered trademark of AMD

Agilex is a registered trademark of Altera

Design collateral for ease of design

• FS1525 Starter Design schematics and PCB layout at Ultra Librarian, URL:
   https://www.ultralibrarian.com/partners/tdk
• FS1525 SIMPLIS model and PDN libraries for top FPGAs/SoCs, URL:
   https://www.us.tdk.com/news_center/upol/index.php
• FS1525 Evaluation boards from 25A, 50A, 100A, and 200A

TDK Corporation (TSE:6762) announces the extension of its high-performance MEMS inertial sensors portfolio with Tronics AXO315®T1, a high-temperature MEMS accelerometer with ±14 g input range and a digital interface for measurement while drilling (MWD) applications operating up to +175 °C.

With this launch, TDK is taking the next step in temperature robustness, following the release of the Tronics AXO315T0 in June 2025 — its first digital MEMS accelerometer to be qualified for oil and gas applications at temperatures of up to +150 °C. This confirms the company's position as a leading provider of high-reliability MEMS inertial sensors for precise downhole navigation in extreme environments.

The AXO315T1 is powered by TDK’s unique closed-loop architecture, which has already been proven on several Tronics sensors. This architecture enables a 10x improvement in vibration rectification error compared to traditional open-loop MEMS accelerometers. The device is a cost-effective, digital, and low-SWaP (Size, Weight, and Power) alternative to quartz accelerometers for inclination measurement in directional drilling tools operating in harsh temperature and vibration conditions.

With a lifetime of more than 1000 hours at +175 °C, it paves the way for a new generation of MWD tools to meet the accuracy and productivity requirements of complex and unconventional drilling operations.

AXO315T1 sensors and evaluation boards are available for sampling and customer evaluations.