TDK Corporation (TSE: 6762) announces the expansion of its NTC temperature sensor portfolio with the M704 (ordering code: B57704M0103A001) and M705 (ordering code: B57705M0103A001) series, engineered for reliable temperature measurement in high-voltage environments. With voltage ratings of up to 4000 V (AC) for the M704 and 2500 V (AC) for the M705, these probe assemblies enable safe and precise monitoring in demanding applications such as UPS and PSU systems in data centers, charging stations, and PV inverters. By combining electrical robustness with ease of assembly, TDK helps designers achieve safe and efficient system operation.

Both sensors feature an R25 of 10 kΩ, a B25/100 value of 3988 K (±1 percent), and a resistance tolerance of ±2 percent. The M704 is specified for a temperature range from -40 °C to +125 °C, while the M705 extends this range up to +180 °C. The M704, with its compact plastic case and 3.5 mm lead spacing, supports automated PCB integration and fast assembly. In contrast, the M705 provides a low thermal time constant of approximately 6.2 s on a metal plate, enabling fast thermal response. It also features a metal-tag ring lug design that ensures excellent thermal coupling and flexible screw-on mounting across various mechanical interfaces.

Together, these portfolio extensions provide robust, application-focused temperature sensing solutions for high-voltage systems where safety, reliability, and installation efficiency are paramount.

TDK Corporation (TSE: 6762) has introduced the compact B3201*A5/B5/C5 series of Y1 safety capacitors designed to suppress EMI in demanding automotive and industrial applications. The metallized polypropylene (MKP) film capacitors are rated for AC voltages of 500 V and DC voltages of up to 1500 V. Featuring a maximum operating temperature of up to +125 °C (with derating), they combine a space-saving footprint with AEC-Q200 Rev. E compliance and high robustness under severe ambient conditions. Typical applications include xEV power electronics, on-board chargers, EV charging infrastructure, industrial drives, power supplies, renewable energy converters, and energy storage systems.

This series offers capacitance values ranging from 0.47 to 33 nF and is available with lead spacings of 15 and 22.5 mm. The smaller B32012 variants measure 5.0 x 10.5 x 18.0 mm, and the B32013 types extend the capacitance range to 33 nF. The compact dimensions help developers implement reliable line-to-ground filtering where PCB space is limited. Parallel wire leads support conventional through-hole mounting. The components are available untaped or in ammo-pack and reel configurations.

The capacitors are rated for continuous operation at 500 V (AC) and 1500 V (DC), respectively, at temperatures of up to +110 °C. At operating temperatures above +110 °C and up to the maximum of +125 °C, the operating voltage must be derated by 1.5% per degree Celsius. Operation within this elevated temperature range is limited to a maximum of 1000 hours.

For applications exposed to heat and humidity, the B3201*A5/B5/C5 series is tested at +85 °C, 85% relative humidity, and 500 V (AC) for 500 hours (THB test). Their self-healing MKP construction supports reliable operation under electrical stress, while the plastic case and epoxy resin sealing meet UL 94 V-0 flammability requirements. The series is approved according to IEC/EN/UL 60384-14, CSA E60384-14, and GB/T 6346.14.

• Discover how TDK technologies are enabling the AI ecosystem at electronica 2026
• Explore innovations that bring greater intelligence, efficiency, and sustainability to key industries
• Experience how the new TDK tagline “In Everything, Better” comes to life across AI Infrastructure & ICT Devices, Automotive, and Industrial & Renewable Energy

TDK Corporation (TSE:6762) will showcase its latest technologies enabling the AI ecosystem at electronica 2026 in Munich, Germany, from November 10 to 13. TDK will be in Hall B5, Stand 520. Guided by its new tagline “In Everything, Better,” TDK powers the next generation of artificial intelligence with its solutions in AI Infrastructure & ICT Devices, Automotive, and Industrial & Renewable Energy, leading to greater intelligence, higher efficiency, and better sustainability. In addition to TDK’s main booth, TDK-Lambda will showcase its latest power supply solutions in Hall A5, Stand 503, and ICsense will showcase its innovations in Hall C4, Stand 100. For more information, visit electronica.tdk.com.

“Artificial intelligence is entering a new phase,” notes Noboru Saito, President and CEO of TDK Corporation. “As AI becomes increasingly embedded across infrastructure, intelligent systems, and devices, the need for energy efficiency, sensing, computing, and connectivity continues to grow. Through our expertise across the AI ecosystem, we are enabling this transformation while creating new value for our customers and society.”

As artificial intelligence expands beyond digital environments into the physical world, it increasingly relies on seamless interactions among infrastructure, intelligent systems, and devices. Consequently, the demand for advanced sensing, connectivity, energy, and computing technologies will grow. TDK, a global leader in electronics solutions for the smart society, is helping build the foundation for this transformation through its broad portfolio of technologies. These technologies support applications ranging from renewable energy and AI infrastructure to industrial automation, automotive, and intelligent devices.

TDK technologies, products, and solutions support every stage of the AI value chain—from data centers and semiconductor manufacturing to edge devices, smart glasses, and intelligent industrial systems—thereby accelerating the adoption of AI across society.

Highlights on the booth

AI Infrastructure & ICT Devices

• Solid-state transformer: This technology is used to transform medium-voltage AC (10 kV to 35 kV) to lower AC or DC voltages. In the case of AI data centers, the preferred output is 800V (DC). Such a system consists of several nodes in series on the input side, connected in parallel at their output. Many different components are used in a modular and scalable solid-state transformer (SST). It features not only silicon carbide (SiC) devices and proprietary high-frequency modules, but also a lot of passive components, ensuring bidirectional power flow with higher efficiency and reduced grid strain in a compact form factor.

• Data center cooling: TDK offers a variety of sensor technologies for coolant distribution units (CDUs). With power per rack expected to reach 1 MW within the next few years, reliable cooling is essential for AI servers and data centers. The portfolio includes temperature and pressure sensors for the cooling circuit, as well as tunnel magnetoresistance (TMR) sensors for angle detection in valve control motors.

• Optical transceiver: This mock-up demonstrates TDK’s ability to supply key components and sensors for optical transceivers used in AI and general server communications. It combines TDK’s aluminum nitride (AlN) substrates, thin-film capacitors, power inductors, bondable and thin-film negative temperature coefficient (NTC) thermistors, and DC-DC converters in a single system.

• Dexterous robotic hand: Powered by TDK’s advanced sensor technology and AI-driven smart perception, the Nibotics Dexterous Hand redefines precision in robotic manipulation. With human-like dexterity and the ability to sense pressure, force, slip, texture, shape, and temperature in real time, the hand can perform complex handling tasks with uncompromising control, performance, and sophistication. This sets a new standard for physical AI in industrial automation.

• Meta-optic mirror for smart glasses: TDK’s award-winning meta-optic mirror uses a precisely engineered nanostructure to enable an ultra-thin optical system for stylish, lightweight smart glasses. Images are projected directly onto the retina through a mirror only 150 nm thick, embedded in an eyeglass lens, delivering a clear, focus-free augmented reality (AR) experience without visible rainbow artifacts. This mirror eliminates the need for a larger conventional curved mirror.

• Tactile zoom for smart glasses: Imagine adjusting the camera zoom of smart glasses and feeling the zoom levels through instant, crisp tactile cues rather than relying solely on vision. The Haptic Slider Zoom demo uses TDK’s piezo technology to create crisp, highly responsive haptic feedback in a compact form factor. The result is a natural, interactive user experience and an example of how advanced haptics can make future smart glasses more intuitive and user-friendly.

• Sensors in smart glasses: TDK MEMS sensors and software are a critical bridge between physical AI and the real world. MEMS and TMR sensing technologies, together with advanced sensor fusion software, enable precise motion tracking and orientation sensing, as well as immersive user experiences in next-generation wearables.

• MEMS microphones for wearables: In wearable devices where audio is the main interface for artificial intelligence, such as AI pins or smart glasses, TDK MEMS microphones provide the high sound fidelity and noise suppression algorithms required to enable audio AI applications. They include an Acoustic Activity Detect feature that allows AI processors to operate at ultra-low power.

• Haptic glove with augmented reality glasses: Haptic feedback makes AR and virtual reality (VR) even more immersive, as it engages additional human senses. TDK’s multilayer piezo ceramic PowerHap actuators can render surface textures precisely, as demonstrated impressively by WEART’s TouchDIVER glove.

Automotive

• Traction inverter demonstrator: This demonstrator unites key TDK technologies to create efficient, high-performance electric drive systems. One highlight is the new AC-phase current sensor CUR 3020. It provides highly accurate current measurements, supporting efficient inverter operation and helping to extend vehicle range. The demonstrator also integrates high-capacitance-density DC-link capacitors, which ensure stable current flow and a compact design. EMC filters achieve electromagnetic compatibility, and magnetic rotor position sensors provide precise motor commutation.

• Building the backbone of the software-defined vehicle: Common-mode chokes and power-over-coax inductors from TDK enable reliable high-speed connectivity, signal integrity, and efficient power delivery for the growing number of cameras and sensors in Zonal ECU architectures.

• High-brightness RGB laser beam scanning projector: TDK showcases a compact, MEMS-based laser beam scanning technology that enables bright, high-contrast, full-color projections. Designed for high optical performance, a small footprint, and low power consumption, this technology opens new ways to present information to drivers and passengers through intuitive human-machine interfaces in software-defined vehicles.

Industrial & Renewable Energy

• Predictive maintenance by AI-driven analytics: With edgeRX and edgeRX Vision, TDK showcases a solution that makes predictive maintenance possible by using AI-driven analytics to identify potential equipment issues before they result in failures or unplanned downtime. edgeRX delivers actionable insights that empower teams to move from reactive maintenance to a proactive, data-driven approach. This approach can help reduce maintenance costs and improve resource efficiency, while also extending equipment life and increasing reliability through early detection of wear, degradation, and performance anomalies.

• Advanced vibration monitoring for rotating equipment: VIBO from TDK is an industrial IoT edge vibration sensor combining a 20 kHz bandwidth, a digital architecture, a Modbus interface, and embedded intelligence for advanced condition-based monitoring. Thanks to these features, the sensor system can identify subtle, early-stage mechanical defects, including bearing, gearbox, and cavitation issues, before they affect system performance. Designed for demanding industrial environments and manufacturing processes, VIBO provides predictive maintenance insights that maximize uptime and minimize maintenance costs for motors, compressors, vacuum systems, pumps, and industrial robots.

• Programmable power sources: Suitable for 19-inch rack mounting, the GENESYS AC programmable power sources from TDK offer 2 kVA and 3 kVA in the 1U format and 6 kVA and 9 kVA in the 3U format. Units can be paralleled to increase output power. The series provides 1-phase and 3-phase outputs, with adjustable AC voltages from 0 V to 350 V at frequencies from 16 Hz to 1.2 kHz (up to 5 kHz for the PRO series) and ±500 V (DC). Avionics and IEC test libraries are available.

• EMC Services: In early 2027, TDK will officially open a completely new accredited EMC lab in Regensburg, Germany. At electronica, visitors can learn more about this new lab and TDK’s worldwide EMC services. Besides this new European facility, TDK operates several accredited EMC labs in all major regions, including Japan, China, and the United States.

Porsche Formula E Partnership

Through its partnership with the Porsche Formula E Team and Porsche Coanda Esports Racing Team, TDK brings the world of electric racing to electronica 2026. Visitors can experience the Porsche Coanda Esports racing simulator firsthand and learn more about the technologies shaping the next generation of electric mobility.

Careers at TDK: TDK’s HR team will be at the booth to talk with anyone interested in working for TDK.

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Noboru Saito, President and CEO TDK Corporation

TDK Corporation (TSE: 6762) has expanded its surface-mount multilayer varistor (MLV) product family with the standard X series (CT0402*X, CT0603*X, CT0805*X, CT1206*X, CT1210*X, CT1810*X, and CT2220*X) for industrial applications. These new SMD MLVs not only protect electronics against overvoltages, maintaining high reliability and performance in a compact size, but also help customers reduce their CO₂ footprint by up to 30 percent. Based on a tailored, innovative ceramic composition, these components can be sintered at lower temperatures than standard MLVs, reducing energy usage. Additionally, the raw material itself has a smaller CO₂ footprint.

The X series targets power supplies, factory automation, industrial IoT, and sensor interfaces where miniaturization and electrical robustness are required, including harsh environments. This follows the release and ramp-up of the X1 series for automotive applications based on the same technology platform.

Spanning case sizes from EIA0402 to EIA2220, the X series offers RMS voltage ratings from 3.5 to 40 V and varistor voltages from 8 to 350 V. They provide clamping voltages from 24 to 450 V and withstand electrostatic discharge (ESD) up to 15 kV air discharge according to IEC 61000-4-2. For surge protection, peak current handling ranges from 1 A in the smallest footprint up to 800 A. Customer-specific adjustments are possible.

These varistors respond to voltage transients within 0.5 ns and offer capacitance values as low as 6 pF, preserving signal integrity in high-speed data lines. The components operate reliably in a temperature range of -55 to +125 °C. With packaging options that support high-volume automated assembly, the X series integrates seamlessly into modern SMT processes.

By combining compact dimensions, fast response times, and robust electrical ratings, the X series enhances the resilience of electronic designs, contributing to longer service life and improved system reliability across a diverse set of industrial applications.

• Now available for worldwide distribution, PositionSense is a 2-chip 9-axis sensor solution for absolute orientation detection and fast sensor calibration
• Enables the ultimate positioning accuracy for smart glasses, smartphones, AI wearables, humanoid robots, drones, and any device requiring precise location
• Integrates TDK’s ultra-low power 6-axis IMU and 3-axis TMR-based magnetometer with on-chip sensor fusion software

TDK Corporation announces worldwide distribution availability of its InvenSense PositionSenseTM – a two-chip nine-axis sensor solution that enables next-gen positioning accuracy and navigation for applications in wearables, robotics, drones, mobile devices, and more. The PositionSense ‘Smart Perception’ solution integrates TDK’s lowest-power 6-axis IMU and TMR-based 3-axis magnetometer with on-chip sensor fusion and calibration software to enable fast, accurate orientation tracking and position detection.  

“When your device uses PositionSense, users are always on track and never lost – even in a city, field, factory, or location without a satellite connection,” said Joseph Bousaba, CEO of InvenSense, a TDK group company. “Whether for people using their smart glasses, watches, or phone for directions, or for a humanoid navigating a warehouse floor, our PositionSense sensor solution ensures highly accurate and reliable navigation for physical AI devices.” 

The speed and precision of PositionSense’s absolute orientation detection come from the custom integration of its components: 

• TDK 6-axis SmartMotion^® IMU, the lowest-power IMU with high-performance MEMS technology and vibration-resistant gyroscope
• TDK 3-axis magnetometer, based on tunnel magneto resistance (TMR) sensor technology, the lowest-power magnetometer with high-sensitivity and accuracy, along with magnetic field shock resistance
• TDK on-chip sensor fusion software, enabling fast and accurate 9-axis sensor calibration

PositionSense is available in four hardware configurations, all with on-chip sensor fusion, gyro-assisted calibration, and an easy-to-integrate design for always-on sensing.   

• ICM-45608 + ICT-15318 keyboard_arrow_right With I2C/SPI/I3C support at 1.8V VDDIO, this PositionSense solution is ideal for IoT applications with a 16g/2000dps Accel/Gyro full-scale range. 

• ICM-45608 + ICT-15312 keyboard_arrow_right With I2C/SPI support at 1.2V VDDIO, this PositionSense solution is ideal for battery-powered and power-sensitive applications with 16g/2000dps Accel/Gyro full-scale range. 

• ICM-45689 + ICT-15318 keyboard_arrow_right With the IMU’s extended ±4000 dps gyroscope and ±32 g accelerometer full-scale range, this PositionSense solution improves measurement headroom for high-dynamic motion, while offering I2C/SPI/I3C support with 1.8V VDDIO.  

• ICM-45689 + ICT-15312 keyboard_arrow_right With the IMU’s extended ±4000 dps gyroscope and ±32 g accelerometer full-scale range, this PositionSense solution improves measurement headroom for high-dynamic motion, while offering I2C/SPI support with 1.2V VDDIO.