TDK Corporation (TSE: 6762) presents the B82722V6*B040 series of new compact high-voltage, current-compensated ring-core double chokes. Designed primarily for rated DC voltages of up to 1250 V (630 V AC), these compact common-mode chokes (23 x 15.5 x 24 mm) effectively suppress EMI in next-generation applications. These include power converters, industrial motor drives, and switch-mode power supplies that often deploy SiC and GaN power semiconductors and feature elevated DC bus voltages, where insulation coordination and PCB space are critical.

The series covers nominal inductance values ranging from 3.3 mH to 22 mH, with rated currents between 0.85 A and 3.0 A at a rated ambient temperature of +70 °C. Multilayer solid insulation construction and testing with voltages of 3,750 V (line-to-line) ensure robust electrical isolation. Thanks to the special automated winding technique, these chokes feature high resonance frequency characteristics and a typical stray inductance of around 0.6%, helping to suppress symmetrical interference.

The epoxy coating of the ferrite core and the plastic header comply with UL 94 V-0. The design fulfills the latest IEC 60938-2 and IEC/UL 60939-3 safety requirements for EMI chokes and filters. Suitable for wave soldering and offered in a compact vertical design, the B82722V6*B040 series enables engineers to realize 1250 V DC high-voltage architectures without increasing the PCB footprint.

• The filters achieve industry-leading* noise attenuation in the high-frequency range exceeding 5 GHz
• A newly developed low-distortion ferrite material significantly reduces audio distortion by minimizing performance variations in the audio line of small consumer devices
• Reduces attenuation of audio signals with lower resistance than conventional products, achieving a wide dynamic range

TDK Corporation (TSE:6762) has announced its latest noise suppression filters of the MAF0603GWY series. These measure only 0.6 mm x 0.3 mm x 0.3 mm (L x W x H) for use in small consumer devices like smartphones and wearables. Mass production of the new product series is set to begin in April 2026.

Electromagnetic noise radiated from audio lines in smartphones, wearable devices, and the like interferes with the built-in antenna and can reduce the receiver sensitivity. The common countermeasure is chip beads. While effective at suppressing noise, they have the drawback of degrading the audio quality on the audio line, which users may find annoying.

The new MAF0603GWY series of noise suppression filters resolves this drawback by employing a newly developed, proprietary low-distortion ferrite material. It introduces just minimal change to audio-line characteristics and significantly reduces audio distortion, eliminating the sound-quality degradation that occurs when chip beads are used. It provides industry-leading high attenuation in the 5-GHz band (impedance up to 3220 Ω at 5 GHz), effectively suppressing noise. Compared with conventional products, it also features lower resistance to reduce attenuation of audio signals and realizes a wide dynamic range.

TDK will continue to contribute to the industry by offering a broad lineup of noise suppression filters and technical support that reconcile audio-quality preservation with electromagnetic-noise countermeasures for mobile and wearable devices with communication functions.

*    As of April 2026, according to TDK.

TDK Corporation (TSE:6762) announces that TDK will start manufacturing advanced sensors for various Apple products in the US. Built on a partnership spanning more than 30 years with Apple, this initiative will allow both companies to reinforce their advanced sensors manufacturing capabilities via Japan–U.S. collaboration and, by producing at U.S. facilities, contribute to a more reliable sensor supply chain. In the context of Apple’s current American Manufacturing Program initiative, this is the first time a Japanese company will produce components for Apple in the US. 

TDK has been collaborating with Apple not only on the development of next-generation sensors to enhance mobile functionality, but also on many other devices such as electronic components and rechargeable batteries.  

“TDK is a long-time partner and we’re excited they’ve joined our American Manufacturing Program,” said Sabih Khan, Apple’s COO. “Apple is committed to working with suppliers — like TDK — to manufacture even more in the US, and this initiative is another powerful example of how much we can achieve together when we invest in advanced American manufacturing.” 

Regarding the mutual collaboration, TDK President and CEO Noboru Saito commented: “Based on the decade-long relationship with Apple, when Apple asked what more we could do in the United States beyond our existing relationship, we TDK saw that as an opportunity to grow our relationship even more, and in new ways. We are very proud to be working with Apple to accelerate US manufacturing. We share their commitment to do more in the US, and our teams are working side-by-side with theirs in the US.”  
 

TDK Corporation (TSE: 6762) has introduced the MT40 series of ThermoFuse varistors (ordering code B72240M), a new generation of surge protection components (SPC) that combine a compact design with advanced safety features. Thanks to their patented overmolding technology and integrated thermal disconnecting system, these SPCs provide robust protection up to 50 kA while minimizing size (38.0 x 15.2 x 40.9 mm; L x W x H). Consequently, the MT40 series is commonly used in inverters, industrial power supplies, outdoor lighting, telecommunications systems, and surge protection devices (SPDs).

Designed for extreme electrical conditions, the MT40 series has a peak surge current capability of up to 50 kA (8/20 μs pulse) and a short-circuit current rating of up to 200 kA. The series is recognized as a UL 1449 Type 1CA component assembly, designed for use in applications with AC voltages ranging from 150 V to 550 V and DC voltages spanning from 200 V to 750 V. Additional features, such as a galvanically insulated normally open micro-switch for remote monitoring and an optional visual indicator, enhance system integration and operational safety. These MT40 components operate in temperatures ranging from -40 °C to +85 °C.

Supporting sustainable design practices and aligning with TDK’s commitment to environmental responsibility, the MT40 series is encapsulated in a flame-retardant epoxy coating. Its RoHS compliance and lead-free materials underscore its eco-conscious profile while ensuring high reliability under demanding conditions. By combining innovation, safety, and sustainability, MT40 ThermoFuse varistors offer system designers a compact, future-proof solution for next-generation industrial and communication systems.

• TDK Showcases solutions for multiple applications including automotive, energy systems, solid-state transformers, optical solutions, data center, robotics and more
• TDK will be at booth #1419, March 23-25, 2026, in San Antonio, TX

TDK Corporation (TSE:6762) announces its participation at the 2026 Applied Power Electronics Conference (APEC) highlighting solutions for a broad range of applications on March 23-25, 2026, at Henry B. Gonzalez Convention Center in San Antonio, Texas. TDK Corporation of America and TDK-Lambda Americas will be located at booth #1419. 

TDK will highlight solutions shaping current and future power electronics technology.  

Technology highlights include:

Data Center Eco-System: TDK delivers power solutions across every layer of the data center infrastructure, from Optical Solutions, Uninterruptible Power Supply and Point-of-Load to Bus Converters and Power Supply Units. TDK products critical to keeping data center infrastructure efficient and reliable include varistors, ceramic capacitors, power line chokes, high-density power management µPOL, transformers for LAN, surge arrestors, NTC chip varistors, and power inductors and more to support the complex needs for data centers. 

Industrial & Energy: TDK offers high-performance, leading-edge solutions designed for demanding industrial applications such as EV fast charging, robotics and smart energy. Among the products that TDK offers are metalized polypropylene capacitors, EMI suppression capacitors, DC-DC converters, DIN rail power supplies to our block varistors, ultra-high voltage ceramic capacitors, thermistors and much more. 

Automotive: High-performance ADAS and xEV systems for automotive applications with components for telematics, battery management, onboard chargers, and more. For ADAS, featured products include inductors, ceramic chip capacitors, µPOL, chip-embedded DC-to-DC power modules (POL), wireless power transfer solutions, and more. For xEV, featured products include disk varistors, power and film capacitors, thermistors, chip beads, and common mode chokes.  

Power Solutions: Advanced AC-DC power supplies and DC-DC converters for innovative industrial, medical, and embedded applications. Products include the HWS3000G / GT, compact 3000W industrial programmable power supply offers Constant Voltage (CV) and Constant Current (CC) operation with single or three-phase inputs. DUSH960-1248 is a DC-UPS designed for DIN rail mount applications and features a wide programmable input and output voltage range and supports external battery capacities of up to 1000Ah. 

Programmable DC/AC Power Supplies: Reliable, high-efficiency, feature-rich programmable DC/AC power sources for leading-edge Industrial and Test & Measurement applications. The GENESYSTM DC Series (750W-15kW) provides general-purpose DC power while the GENESYSTM DC Series DC Series (1kW – 22.5kW) and Rack DC Power Systems (30kW-90kW) showcase advanced features and digital interfaces. These along with the GENESYSTM AC Series (2kVA-45kVA) which delivers high performance AC power for modern demanding test environments.   

Additional Technologies: Also highlighted at APEC will be the new major expansion of the TDK µPOL family of ultra‑compact, non‑isolated DC‑DC power modules for optical modules in AI edge systems and other space‑constrained designs.

TDK will also feature a diverse, wide range of wireless power transfer products to support different applications: low-output/medium-output for smartphones and laptops, higher output wireless feeding for industrial equipment and EVs (electric vehicles), and ultra-compact, thin-profile systems for wearable and/or other devices. 

Exhibitor Presentation: Technologies Powering the Shift to Solid-State Transformers: How TDK Technologies Enable Transition, presented by our expert Anirban Roy, Senior Manager, Field Applications Engineering. 

This informative exhibitor presentation at APEC 2026 will explore how TDK component technologies support SST design at both the component and system level with solutions that are space saving, improving performance, and using TDK’s materials expertise.  

Date: Tuesday, March 24 at 2:15pm in Expo Theater No. 3, Henry B. Gonzalez Convention Center