TDK Corporation (TSE:6762) has expanded its B43645, B43657, B43658, B43659, B43660, and B43661 series of ultra-compact snap-in aluminum electrolytic capacitors to meet the specific needs of advanced AI server power supply units (PSUs) and high-performance SMPS applications. Additionally, the rated DC voltages were raised to 500 V. With diameters ranging from just 22 mm to 35 mm and lengths between 25 mm and 100 mm, these capacitors deliver high voltage capability in an exceptionally compact form factor. For high-performance power supplies, this translates to higher power densities, improved reliability, and greater design flexibility—critical for supporting the continuous, high-load operation typical in AI data centers. This enables smaller, more efficient systems without compromising electrical or thermal performance. 

These extended-voltage series cover capacitances from 80 µF to 2060 µF, handle high ripple currents up to 5.39 A, and deliver a service life of up to 5,000 h at +105 °C. Their ultra-compact CV design minimizes footprint, while robust aluminum-can construction with PET sleeve, secure snap-in pins, and integrated pressure relief ensures durability. All types are RoHS-compliant and vibration-tested per IEC 60068-2-6. 

The web-based AlCap Tool quickly and easily calculates accurate lifetime under application-specific conditions. 

• New 100 V SMD component with X7R characteristics has a capacitance of 10 μF in the 3225 format 

• Offering low resistance and soft termination for automotive (AEC-Q200) and general applications 

• Contributes to higher reliability, reduction of component count, and miniaturization 

TDK Corporation (TSE:6762) announced today that it has expanded its CN series of low-resistance soft-termination SMD MLCCs. This 100-V component with X7R characteristics achieves an industry-leading* rated capacitance of 10 μF in the 3225 format (3.2 x 2.5 x 2.5 mm – L x W x T). Mass production of these new components began in September 2026. The CN series is TDK’s proprietary product line, equivalent to the regular product line in terms of terminal resistance, due to the optimization of its resin electrode structure.  

In recent years, there has been an increase in the use of 48 V applications in AI servers, humanoid robots, xEVs, and various industrial equipment within the AI ecosystem. The goal has been to reduce power loss and the weight of wire harnesses. Consequently, 100 V-rated MLCCs that are used in power lines must have even larger capacitance. On the other hand, in soft-termination products, which are increasingly being adopted as a measure against MLCC cracks caused by external stress, the increased ESR (equivalent series resistance) resulting from the addition of the resin layer has been an issue. 

This led TDK to develop the CN series with optimized resin electrode structures. Thanks to the optimized material selection and product design, these components achieve twice the capacitance of TDK’s conventional capacitors of the same size while significantly reducing ESR. These new products make it possible to halve the number of MLCCs used and the mounting area. This helps reduce component count and miniaturization of sets and is also effective in enhancing reliability in 48-V power lines, e.g., in AI servers. TDK will continue to expand its product line to meet the diverse needs of its customers. 

* As of September 2026, according to TDK 

*CNA is for automotive, and CNC is for commercial. 

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• The new edgeRX Pro sensor node expands the capabilities of TDK SensEI's flagship edgeRX platform.
• Enhanced performance delivers higher sampling frequency, stronger AI models, and broader sensor support.
• Magnetometer and acoustic sensing unlock new opportunities for industrial monitoring and analytics.
• Always-on operation is enabled through flexible wired or long-life battery power options.

TDK Corporation (TSE:6762) today announced the launch of the TDK SensEI edgeRX Pro, a new high-performance sensor node that expands its predictive maintenance platform, edgeRX.

edgeRX Pro integrates vibration, acoustic, magnetic, temperature, and rotational motion sensing, leveraging an integrated 6-axis IMU and edge AI processing in a compact, IP67-rated enclosure. In addition to battery operation, it also supports USB wired power, with USB power prioritized when connected, enabling flexible operation for evaluation and permanent installation use cases. Designed for harsh industrial environments, edgeRX Pro enables long-term monitoring with up to 10 years of battery life.  

“edgeRX Pro gives customers greater flexibility in how they deploy predictive maintenance at scale,” said Sundeep Ahluwalia, Chief Product Officer at TDK SensEI. “By incorporating acoustic and magnetometer sensing, edgeRX Pro addresses a wider range of predictive maintenance applications. Support for wired power enables higher sampling rates and more robust AI models, while up to 10 years of battery life allows for scalable, low-maintenance deployments across industrial environments.”

The sensor enhances platform capabilities with higher sampling frequencies, more robust on-device analytics, and expanded sensing inputs—including a 6-axis IMU, magnetometer, and digital microphone—to improve detection of subtle anomalies and deliver deeper insights for predictive maintenance. By adding acoustic and magnetic sensing to the edgeRX platform, edgeRX Pro enables a broader range of industrial applications, including compressed air leak detection, acoustic anomaly detection, rotational and alignment analysis, oil and gas leak detection, and rail component and bearing anomaly detection, while providing a more comprehensive view of asset health and performance.

Main applications

• Manufacturing (Lithium Battery, Semiconductor, Precision Machining, Iron & Steel)

• Energy & Utilities (Electric Power, Natural Gas, Oil & Gas)

• HVAC & Smart Buildings

• Warehousing & Industrial Facilities
   

• TDK acquired assets from OQmented to strengthen AR display technology portfolio.
• The acquisition adds valuable IP, engineering expertise, and MEMS-based laser beam scanning technology.
• Purchase supports TDK’s strategy to develop advanced, vertically integrated display solutions for future smart glasses, combining TDK’s eye intent technology, Full-color Laser Module (FCLM), MEMS mirror, and other internal TDK technologies to build a smart glass display system under TDK AIsight.  

TDK Corporation (TSE:6762) announces that it has acquired assets from OQmented (legal name: Kiitz Technologies GmbH), a German-based company known for its expertise in MEMS-based laser beam scanning and advanced display technologies. By combining TDK’s eye intent technology, FCLM, MEMS mirror, and other technologies, TDK aims to build a display system that will significantly influence the performance of smart glasses.

The transaction strengthens the TDK group company TDK AIsight, TDK’s augmented reality (AR) display business, and supports the company’s strategy to develop next-generation optical solutions for smart glasses and other immersive display applications.

Through the acquisition, TDK gains access to intellectual property, engineering know-how, and key technical capabilities that complement its existing expertise in MEMS, optics, electronics, and system integration. The acquired assets are expected to accelerate TDK’s efforts to build a vertically integrated light engine platform for AR display systems.

Within the AI ecosystem, TDK offers a broad portfolio of components supporting the smart glasses market, which is expected to grow steadily over the medium to long term. In June of 2025, to further enhance its capabilities in this field, TDK acquired SoftEye, Inc., a U.S.-based systems solutions company developing custom chips, cameras, software, and algorithms for smart glasses. The following year, TDK established TDK AIsight to accelerate the development of its smart glasses solutions business and support the realization of AI glasses that deliver intuitive and compelling user experiences.

“By bringing OQmented’s capabilities into TDK AIsight, we are reinforcing our position in a highly promising market segment,” said Te-Won, CEO at TDK AIsight. “This acquisition enhances our ability to develop innovative display solutions and support the growing demand for high-performance AR devices.”

OQmented’s technology portfolio is particularly aligned with TDK’s focus on display innovation, including MEMS mirror technology, laser beam scanning, and display engine development. With this acquisition, TDK aims to further strengthen its foundation for commercialization and manufacturing of advanced light engine solutions.
The integration of these assets will support TDK’s broader ambition to create complete display systems that can be scaled for future consumer, automotive, industrial, and mobility applications.

TDK Corporation (TSE: 6762) has expanded its axial/soldering star-aluminum electrolytic capacitor lineup with 125 V-rated components to the B43693/B43793 series (125 V to 250 V) and upgraded the 63-V series of existing B41687/B41787 (25 V to 63 V). This complements the product spectrum, addressing the increasing demand for compact and high-ripple-current DC-link capacitor banks with battery voltages ranging from 48-V battery systems to 120 V. These are frequently used in applications such as small xEVs and micromobility platforms, as well as industrial systems like forklifts, electric boats, and humanoid robots.

The B43693/B43793 series eliminates the need for connecting capacitors in series by supporting higher DC-link voltages within a single component. This can simplify capacitor-bank design and enhance system robustness and efficiency. Supporting ripple currents of up to 21.6 A, the components operate at temperatures of up to +140 °C. Capacitance values range from 56 µF to 650 µF, housed in can sizes from 16 x 25 mm to 21 x 49 mm (diameter x length). The 125-V variant is generally used for 96-V system designs constrained by space, exposed to high thermal stress, and subject to dynamic load conditions requiring stable energy buffering.

The B41687/B41787 series shares the same axial/soldering-star construction, providing design standardization across voltage classes. They operate at up to +150 °C and offer capacitance values from 510 µF to 4800 µF.

All four series are characterized by low equivalent series resistances (ESR) and high ripple current capabilities, reducing power losses and improving thermal efficiency within the DC-link stage of inverters, for example. Their mechanical design supports harsh environmental conditions, offering standard vibration resistance up to 20 g, with options for up to 60 g upon request. Axial-lead and soldering star terminals provide flexible mounting configurations, including horizontal and vertical mounting on PCBs and busbars.

Furthermore, by optimized mounting to a heat sink, 125-V capacitors of the B43693/B43793 series achieve more than double the standard ripple currents, allowing customers to drastically reduce the size and cost of capacitor banks. For example, the specified ripple current of an 18 x 30 mm component jumps from 5.2 A (at +105 °C ambient temperature) to 11.1 A when the aluminum case is maintained at +105 °C via a heat sink. This offers designers critical advantages in power density, reduced ESR, fewer pieces per bank, and consequently lower assembly costs without sacrificing reliability.