• The smallest size in the industry* in the 0201 size
• Achieves high-frequency characteristics through proprietary patterning and sintering technologies
• Lineup of inductances with fine increments, taking advantage of the features of the multilayer method
• Wide temperature range of -55 °C to +125 °C

TDK Corporation (TSE: 6762) announces the expansion of the MUQ0201022HA series* of high-frequency inductors. The 0201 size (0.25 x 0.125 x 0.2 mm; L x W x T) are the smallest inductors of their kind in the industry with the same electrical characteristics as the existing MHQ0402PSA series, which is one size larger at 0402 (0.4 x 0.2 mm; L x W). The lineup covers an inductance from 0.6 nH to 3.6 nH. Mass production of these new components began in May 2025.

As mobile devices such as smartphones and wearable devices become increasingly sophisticated and compact, there is a growing need for small-sized, high-performance components. By applying its proprietary patterning and sintering technologies, TDK has achieved high-frequency characteristics equivalent to or better than existing products while reducing the component mounting area by around half. TDK will further expand its line to meet the needs of customers.

*Source: TDK, as of May 2025

• Compatible with currents as high as 8 A
• Saves space by reducing components and footprint
• Highly reliable for use in high-temperature environments like automotive and industrial applications

TDK Corporation (TSE: 6762) has expanded its MPZ1608-PH series of large-current multilayer chip beads for automotive and commercial power supply lines (1.6 x 0.8 x 0.6 mm – L x W x H). Mass production of the product series began in May 2025.

These 1608-size chip beads for power supply lines achieve a rated current of 8 A, the industry’s highest value*. Chip beads are used as noise suppression components in power and signal circuits. In a circuit with a current of 8 A or more, usually two or more chip beads must be used in parallel. This has the disadvantage that the current is not evenly distributed between the ferrite beads. TDK’s new product simplifies the circuit structure because fewer components are required compared to conventional methods, and it improves the quality of power circuits.

The MPZ1608-PH series of products halves the component footprint in comparison with circuits using two conventional 1608-sized chip beads. Moreover, the highly reliable components with a specified operating temperature of up to +125 °C are designed to be used in high-temperature environments like automotive and industrial equipment applications.

With TDK’s proprietary materials and structural designs adapted to market needs, the company is committed to expanding its lineup of high rated current products in the automotive, industrial equipment, and consumer equipment areas. These chip beads will serve as EMC components contributing to the enhancement of the quality of power circuits.

*Source: TDK, as of May 2025

TDK Corporation (TSE: 6762) was recently named a 2025 Clarivate Top 100 Global Innovator, receiving particularly high evaluations for influence. For TDK, this is the eleventh time in total, and the eighth time in a row.

Since 2012, the Clarivate program has identified companies at the pinnacle of the global innovation landscape by measuring the ideation culture that produces patents and drives growth. Starting with more than 14,000 organizations, Clarivate selects the most impactful companies based on a wide variety of criteria, including the number of patents granted in the past five years, as well as indicators measuring influence, success, rarity, and geographic investment.

“We are greatly honored to be recognized as a Clarivate Top 100 Global Innovator for the eleventh time, and for the eighth consecutive year,” said Shuichi Hashiyama, Corporate Officer, CTO, and General Manager, Technology & Intellectual Property HQ. “The TDK Group has protected its five core technologies - “Materials technology”, “Process technology”, “Evaluation & Simulation technology”, “Product Design technology”, and “Production Engineering technology” - through intellectual property rights as technologies that support creative Monozukuri and has applied them to its business since its foundation. In recent years, by integrating these core technologies with software technologies, we have been striving to create new values that meet the needs of the times. We will continue to create innovations that have an impact on society and introduce new products and solutions that meet the needs of the times under its long-term vision “TDK Transformation”,” Hashiyama added.

The TDK Group’s Intellectual Property governance is based on Empowerment & Transparency, with an emphasis on the regional characteristics of each country and respect for the uniqueness of each base's intellectual property management at each site. At the same time, the diversity of best practices generated at each site is shared throughout the TDK Group, leading to growth as an organization. The company will continue to realize growth by making the most of its advantages as a global organization.

In 2024, TDK released several industry-leading innovations:

• edgeRX, an advanced machine health monitoring platform that leverages the power of AI on edge sensor devices. By integrating advanced AI algorithms, edge computing, and powerful sensor devices, edgeRX provides real-time machine health monitoring, predictive maintenance insights, and actionable alerts directly on machines.
• Spin-memristor, development of a neuromorphic element that can cut the power consumption of AI applications down to 1/100th of traditional devices by mimicking the energy-efficient operation of the human brain.
• The world’s first full-color laser control device for 4K smart glasses, a full-color laser control device required for AR/VR smart glasses using lithium niobate (LiNbO₃) thin film, increasing the color control speed by 10 times with voltage control enabled by lithium niobate thin film, compared to the conventional module’s electric current control.
• Developed a material for solid-state batteries with 100-times higher energy density.

• Under the joint claim “Accelerating transformation for a sustainable future,” TDK shows highlight solutions for green and digital transformation from May 6 to 8, 2025,  in the NürnbergMesse exhibition center in Nuremberg, Germany
• At PCIM in booth 350 in hall 9, visitors can explore the latest passive component and sensor solutions for wind and solar power, ESS, hydrolyzer, heat pumps, EV charging, electric mobility (xEV), and AI 
• At SENSOR+TEST in booth 204 in hall 1, visitors can explore the latest sensor technologies to optimize the performance and reliability of industrial and automotive solutions

TDK Corporation (TSE:6762) showcases its latest passive component and sensor innovations at this year’s PCIM and SENSOR+TEST, taking place in parallel from May 6 to 8, 2025, in the NürnbergMesse exhibition center in Nuremberg, Germany. “Accelerating transformation for a sustainable future” is TDK’s joint claim for both shows, where visitors can explore TDK’s solutions for both green and digital transformation in the application areas of automotive, industrial, home appliances, and artificial intelligence. TDK's exhibit at PCIM in hall 9, booth 350, features passive components and sensor solutions for applications such as energy and power conversion, heat pumps, EV charging, mobility (xEV), and AI. Just around the corner, in hall 1, booth 204, visitors at SENSOR+TEST can delve into the whole spectrum of sensor technologies from different TDK group companies. 

Solution highlights at PCIM, hall 9, booth 350:

• Electric Mobility (xEV): 
  TDK is showcasing a busbar design with our modular xEVCap as a DC link capacitor as well as a bidirectional 22-kW onboard charger. Innovative power magnetics like transformers with integrated resonance choke minimize losses and save valuable space in onboard chargers. The aluminum nitride (AlN) multilayer substrates and 3D-printed AlN liquid coolers allow a 400-kW traction inverter to fit into a space about the size of two decks of playing cards.

• Energy & Power Conversion (Wind, Solar, ESS, Hydrolyzer, etc.): 
  TDK will display a modular inverter solution based on CeraLink used as flying capacitors, as well as a 250-kW inverter block for commercial and agricultural vehicles. The company will also introduce the next generation of its award-winning ModCap; the ModCap High Performance is capable of operating at elevated temperatures of +105 °C without derating. Visitors can explore a wind power stack weighing 60 kg equipped with 15 capacitors from the MKP DC HF series in the DC link. Just as small as a sugar cube is the gate drive transformer EP9, which has an operational isolation voltage of 500 V for driving IGBTs and MOSFETs on the high side of a half bridge. 

• EV Charging:
  TDK presents various reference designs like a bidirectional 22-kW onboard charger as well as a modular hybrid inverter for 10 + 15 kW. The company will also showcase several new DC link and safety EMI capacitors, as well as high voltage contactors like the HVC50 for currents up to 750 A at 1500 V for megawatt charging stations. 

• Sensor Solutions: 
  To reduce costs by significantly lowering the number of components in heat pumps, TDK showcases integrated pressure and temperature sensors. Taking a real e-motor, the company illustrates its comprehensive portfolio of sensor solutions to drive the motor to the max without pushing it over the edge.

Presentations

• Niklas Edkvist, TDK Europe: Panel discussion on “Powering AI: What Market and Technology Trends in Powertrain?” on May 6 at 11:20 AM on the Technology Stage in hall 4, stand 435 

• David Olalla, TDK Electronics: “Practical Use of xEVCap: The Modular and Standard DC-Link Capacitor for the Main Powertrain Inverter” on May 8 at 10:10 AM in room Mailand

Product highlights at Sensor+Test, Booth 204, Hall 1:

• Hall-effect Automotive Sensors: 
  Visitors can explore more about new stray-field robust mainstream 2D Hall-effect sensors HAL/R 35xy for automotive applications, like steering wheel angles, brake and accelerator pedals, valve positions, and chassis detection. These are available in single-die (HAL 3550) and dual-die (HAR 3550) versions, with analog and digital outputs. 

• Embedded motor control solutions: 
  TDK will also display the new cost-efficient HVC 5481G programmable gate driver SoC for automotive actuators, fans, and pumps. They can drive an external power bridge of 6 N-channel FETs with sensor-based and sensorless algorithms from BEMF commutation to single-shunt FOC. 

• Analog & digital MEMS microphones:
  TDK showcases audio capture, acoustic activity detection, and spoken keyword detection.

• WeWALK Smart Cane 2: 
  Experience the multi-award-winning cane, featuring TDK’s microphone sensors, ultrasonic sensors, and motion sensors, to enhance accessibility for individuals with visual impairments, all while maintaining an ergonomic design.

• Ultrasonic sensor modules: 
  TDK presents a solution that detects objects and measures distances in challenging environments, including full sunlight, translucent targets, and vibration in autonomous mobile robots (AMR) or autonomous guided vehicles (AGV).

• Pressure sensors: 
  At the booth, visitors can learn more about combined pressure and temperature sensors for thermal management, as well as pressure sensors for fuel tank leakage detection and industrial applications. 

• Temperature sensors: 
  On display are also surface temperature sensors for industrial as well as automotive applications, including an e-motor busbar sensor, an e-motor small case series, clip-on sensors for heat pumps, and a sensor for high voltages.

TDK Corporation (TSE:6762) announces the HVC50, a high-voltage DC contactor designed for connecting or disconnecting lithium-ion batteries with up to 1500 V in traction applications, energy storage systems (ESS), and megawatt charging systems (MCS). With this component, TDK enables its customers to drive the green transformation towards an all-electric society and reduce carbon footprint.

In a single event, the HVC50 can disconnect DC voltages of up to 1500 V and DC currents of up to 1000 A in less than 30 ms. Continuously, it can carry up to 750 A. Weighing 1.7 kg and measuring 97.8 x 140 x 94.2 mm, this component is designed for the demanding requirements of industrial applications and commercial vehicles, combining reliability, safety, and easy integration.

The HVC50 features a ceramic arc chamber with a gas-filled design, ensuring rapid and safe current disconnection even under extreme conditions. Its integrated mirror contact, compliant with IEC 60947-4-1, enhances operational safety by providing precise switching feedback. Thanks to the bidirectional capability of the contactor, currents can flow both ways seamlessly, making it exceptionally versatile. A dual-coil design for operating voltages of 12 or 24 V ensures energy-efficient operation. The making power is 50 W, whereas the steady-state power is just 6 W, because after some 200 ms, one of the two coils can be switched off.

Certified to CE, UKCA, and UL standards, the HVC50 contactor aligns with global safety and performance benchmarks, supporting its use in various regions, including Europe, the US, and Asia. By addressing the growing demand for efficient and reliable power in ESS and MCS, the HVC50 is poised to accelerate the adoption of sustainable energy solutions and high-capacity charging infrastructures worldwide.