• The new edgeRX Pro sensor node expands the capabilities of TDK SensEI's flagship edgeRX platform.
• Enhanced performance delivers higher sampling frequency, stronger AI models, and broader sensor support.
• Magnetometer and acoustic sensing unlock new opportunities for industrial monitoring and analytics.
• Always-on operation is enabled through flexible wired or long-life battery power options.

TDK Corporation (TSE:6762) today announced the launch of the TDK SensEI edgeRX Pro, a new high-performance sensor node that expands its predictive maintenance platform, edgeRX.

edgeRX Pro integrates vibration, acoustic, magnetic, temperature, and rotational motion sensing, leveraging an integrated 6-axis IMU and edge AI processing in a compact, IP67-rated enclosure. In addition to battery operation, it also supports USB wired power, with USB power prioritized when connected, enabling flexible operation for evaluation and permanent installation use cases. Designed for harsh industrial environments, edgeRX Pro enables long-term monitoring with up to 10 years of battery life.  

“edgeRX Pro gives customers greater flexibility in how they deploy predictive maintenance at scale,” said Sundeep Ahluwalia, Chief Product Officer at TDK SensEI. “By incorporating acoustic and magnetometer sensing, edgeRX Pro addresses a wider range of predictive maintenance applications. Support for wired power enables higher sampling rates and more robust AI models, while up to 10 years of battery life allows for scalable, low-maintenance deployments across industrial environments.”

The sensor enhances platform capabilities with higher sampling frequencies, more robust on-device analytics, and expanded sensing inputs—including a 6-axis IMU, magnetometer, and digital microphone—to improve detection of subtle anomalies and deliver deeper insights for predictive maintenance. By adding acoustic and magnetic sensing to the edgeRX platform, edgeRX Pro enables a broader range of industrial applications, including compressed air leak detection, acoustic anomaly detection, rotational and alignment analysis, oil and gas leak detection, and rail component and bearing anomaly detection, while providing a more comprehensive view of asset health and performance.

Main applications

• Manufacturing (Lithium Battery, Semiconductor, Precision Machining, Iron & Steel)

• Energy & Utilities (Electric Power, Natural Gas, Oil & Gas)

• HVAC & Smart Buildings

• Warehousing & Industrial Facilities
   

• TDK acquired assets from OQmented to strengthen AR display technology portfolio.
• The acquisition adds valuable IP, engineering expertise, and MEMS-based laser beam scanning technology.
• Purchase supports TDK’s strategy to develop advanced, vertically integrated display solutions for future smart glasses, combining TDK’s eye intent technology, Full-color Laser Module (FCLM), MEMS mirror, and other internal TDK technologies to build a smart glass display system under TDK AIsight.  

TDK Corporation (TSE:6762) announces that it has acquired assets from OQmented (legal name: Kiitz Technologies GmbH), a German-based company known for its expertise in MEMS-based laser beam scanning and advanced display technologies. By combining TDK’s eye intent technology, FCLM, MEMS mirror, and other technologies, TDK aims to build a display system that will significantly influence the performance of smart glasses.

The transaction strengthens the TDK group company TDK AIsight, TDK’s augmented reality (AR) display business, and supports the company’s strategy to develop next-generation optical solutions for smart glasses and other immersive display applications.

Through the acquisition, TDK gains access to intellectual property, engineering know-how, and key technical capabilities that complement its existing expertise in MEMS, optics, electronics, and system integration. The acquired assets are expected to accelerate TDK’s efforts to build a vertically integrated light engine platform for AR display systems.

Within the AI ecosystem, TDK offers a broad portfolio of components supporting the smart glasses market, which is expected to grow steadily over the medium to long term. In June of 2025, to further enhance its capabilities in this field, TDK acquired SoftEye, Inc., a U.S.-based systems solutions company developing custom chips, cameras, software, and algorithms for smart glasses. The following year, TDK established TDK AIsight to accelerate the development of its smart glasses solutions business and support the realization of AI glasses that deliver intuitive and compelling user experiences.

“By bringing OQmented’s capabilities into TDK AIsight, we are reinforcing our position in a highly promising market segment,” said Te-Won, CEO at TDK AIsight. “This acquisition enhances our ability to develop innovative display solutions and support the growing demand for high-performance AR devices.”

OQmented’s technology portfolio is particularly aligned with TDK’s focus on display innovation, including MEMS mirror technology, laser beam scanning, and display engine development. With this acquisition, TDK aims to further strengthen its foundation for commercialization and manufacturing of advanced light engine solutions.
The integration of these assets will support TDK’s broader ambition to create complete display systems that can be scaled for future consumer, automotive, industrial, and mobility applications.

TDK Corporation (TSE: 6762) has expanded its axial/soldering star-aluminum electrolytic capacitor lineup with 125 V-rated components to the B43693/B43793 series (125 V to 250 V) and upgraded the 63-V series of existing B41687/B41787 (25 V to 63 V). This complements the product spectrum, addressing the increasing demand for compact and high-ripple-current DC-link capacitor banks with battery voltages ranging from 48-V battery systems to 120 V. These are frequently used in applications such as small xEVs and micromobility platforms, as well as industrial systems like forklifts, electric boats, and humanoid robots.

The B43693/B43793 series eliminates the need for connecting capacitors in series by supporting higher DC-link voltages within a single component. This can simplify capacitor-bank design and enhance system robustness and efficiency. Supporting ripple currents of up to 21.6 A, the components operate at temperatures of up to +140 °C. Capacitance values range from 56 µF to 650 µF, housed in can sizes from 16 x 25 mm to 21 x 49 mm (diameter x length). The 125-V variant is generally used for 96-V system designs constrained by space, exposed to high thermal stress, and subject to dynamic load conditions requiring stable energy buffering.

The B41687/B41787 series shares the same axial/soldering-star construction, providing design standardization across voltage classes. They operate at up to +150 °C and offer capacitance values from 510 µF to 4800 µF.

All four series are characterized by low equivalent series resistances (ESR) and high ripple current capabilities, reducing power losses and improving thermal efficiency within the DC-link stage of inverters, for example. Their mechanical design supports harsh environmental conditions, offering standard vibration resistance up to 20 g, with options for up to 60 g upon request. Axial-lead and soldering star terminals provide flexible mounting configurations, including horizontal and vertical mounting on PCBs and busbars.

Furthermore, by optimized mounting to a heat sink, 125-V capacitors of the B43693/B43793 series achieve more than double the standard ripple currents, allowing customers to drastically reduce the size and cost of capacitor banks. For example, the specified ripple current of an 18 x 30 mm component jumps from 5.2 A (at +105 °C ambient temperature) to 11.1 A when the aluminum case is maintained at +105 °C via a heat sink. This offers designers critical advantages in power density, reduced ESR, fewer pieces per bank, and consequently lower assembly costs without sacrificing reliability.

• TDK  and LG Innotek form a strategic partnership,  with TDK collaborating on LG Innotek’s development of next-generation vision and haptic sensor modules for humanoid robots and other physical AI applications
• Integrated with TDK sensors, LG Innotek modules will act as the ‘eyes’ and ‘skin’ of robots, to maximize recognition and tactile performance

TDK Corporation (TSE: 6762) announces that it has entered into a strategic partnership in the field of Physical AI with LG Innotek (President & CEO: Moon Hyuksoo), a leading global materials and electronic components company. Under this partnership, the two companies will combine LG Innotek’s optical and ultra-precision module design technologies with TDK’s broad portfolio of sensor technologies to jointly develop a range of Physical AI solutions, including next-generation visual sensing modules and tactile sensing modules for humanoid robots. Through this collaboration, TDK aims to contribute its technologies and sensors to help build the “Body of AI.”

With this partnership, the two companies plan joint advanced research to integrate LG Innotek’s vision sensing modules with TDK’s various sensors, including InvenSense inertial and position sensors and microphones. Through this collaboration, the two companies plan to launch a next‑generation vision sensing module that offers expanded functionality and significantly improves recognition performance compared to existing solutions.

LG Innotek CEO Moon Hyuksoo said, “In the robotics industry, multi-sensing (the integration of numerous sensors) is expected to emerge as a key capability. Through our collaboration with TDK, which offers a broad portfolio of sensor technologies, we aim to help shape the ecosystem for core robotic components.”
He added, "We will continue to expand partnerships with technology leaders, further strengthen the core technologies for robots' vision and hands, and accelerate our efforts to secure a leading position in the Physical AI market."

TDK President and CEO Noboru Saito said, “We are pleased for TDK to join hands with LG Innotek, a world‑class leader in physical AI sensing. By combining TDK’s diverse fundamental technologies and sensors with LG Innotek’s core capabilities, we will add value for customers and bring truly revolutionary products to the global market.”

TDK Corporation (TSE:6762) presents the EP21 series (ordering code: B82552J*J021) of flat-wire double chokes. These components are designed for common-mode EMI filtering and are available in an SMD format with dimensions of only 23.8 x 17.7 mm and heights ranging from 21.6 to 22.3 mm. To minimize board space, these components feature underbody termination. They can be used as common-mode chokes for applications such as DC-DC converters or other low-voltage EMC protection circuits. Their four-pin design enhances mechanical reliability.

They can handle rated voltages of 48 V (AC) or 80 V (DC) and rated currents of 20.3 to 35 A without derating up to +70 °C. However, if the temperature exceeds +70 °C, derating is required. The DC resistance is as low as 0.44 mΩ, while the rated inductance ranges from 160 to 640 µH, with an average stray inductance as low as 200 nH. Depending on the type, the maximum impedance occurs at frequencies between 500 kHz and 3 MHz.