The Chinese automotive supplier Shinry Technologies has presented TDK with its “Excellent Quality Award.” This is in recognition of the high quality of TDK’s products, including capacitors and electroceramic products, as well as the long-standing, successful partnership with TDK. 

Shinry Technologies, headquartered in Shenzhen, specializes in the development and production of core components for electric and fuel cell vehicles. Its product portfolio includes on-board chargers (OBCs), DC/DC converters, and high-power charging systems, all of which are critical to electric mobility. 

For these products, Shinry Technologies primarily sources MLCCs, aluminum electrolytic capacitors, film capacitors, CeraLink capacitors, and NTCs from factories in China, Japan, and Austria. 

“To meet our quality commitment, we have implemented a strict quality management system that extends from raw material procurement through production processes to final inspections and customer service,” says Makoto Kondo, Senior Vice President and DGM of TDK Greater China Sales Division. He adds: “This award is a great encouragement for every team member. We will continue to adhere to the principle of ‘Quality First, Customer Foremost’, increase our investment in technology, and optimize our supply chain to continue providing our partners with high-quality and competitive products and services.”

• TDK presents DigiKey with the “Global Best Performance Award” 2025
• Award recognizes strong business performance and long-standing collaboration
• Signs of a recovery in the distribution business

TDK Corporation (TSE:6762) has honored the globally active high-service distributor DigiKey with this year’s “Global Best Performance Award,” thereby recognizing its outstanding business performance and the successful collaboration over the past year. DigiKey impressed in particular with its strong international orientation and its ability to reliably serve customers worldwide. Of particular importance was the fact that DigiKey is firmly established in the Chinese and U.S. markets. In addition, the company has the capability to supply developers, design houses, as well as medium-sized enterprises with small quantities, thereby enabling production ramp-ups.

“DigiKey is extremely honored to receive the 2025 Global Best Performance award from TDK,” said Jason Simoneau, Vice President, Passives and Multimarket Semiconductor at DigiKey. “Our long-standing partnership with TDK has provided customers around the globe with exceptional technologies to create innovative products that accelerate progress. We look forward to continued collaboration and growth centered on TDK’s comprehensive, innovation-driven portfolio of cutting-edge electronics.”

“I am very pleased with the outstanding performance of DigiKey as one of our long-standing partners with whom we collaborate strategically,” says Dietmar Jäger, General Manager Distribution & EMS Sales Division. “This shows that even in a challenging market environment, success is possible with a strong team,” adds Dietmar Jäger.

Electronics distribution is currently showing clear signs of a recovery. “The delivery of small quantities to small customers can be an early indicator of a broader market recovery,” says Dietmar Jäger. “We are well positioned with our products for the markets we serve through distribution, particularly AI applications in China and industrial applications in the U.S.” China remains the most important market, followed by the U.S. and Europe.

• Ultra-compact micro POL module FS3303 delivers 3 A in a 2.5 × 2.5 mm footprint with only 1.2 mm height, enabling high-density power for optical modules and AI edge systems
• High efficiency up to 95% with operation up to +90 °C (and +125 °C with derating), supporting low-voltage rails from 0.4 V to 3.3 V for ASICs, SoCs, DSPs, and AI chipsets
• Integrates controller, driver, MOSFETs, and inductor in TDK’s advanced 3D chip-embedded package, minimizing external components and maximizing board space savings

TDK Corporation (TSE: 6762) today announced the FS3303, the first member of a major expansion of its micro POL family of ultra‑compact, non‑isolated DC‑DC power modules for optical modules in AI edge systems and other space‑constrained designs. Despite its small footprint of just 2.5 x 2.5 mm and a height of only 1.2 mm, the FS3303 can deliver 3 A at ambient temperatures of up to +90 °C (up to +125 °C with derating) and boasts a peak efficiency of around 95%. The FS3303-0400-AL is in full production and is sampling at major distributors.

The FS3303 and the upcoming high‑performance point‑of‑load (POL) converter lineup spans 3 A to 80 A output across 0.3 V to 3.3 V rails. They enable next‑generation optical networking and AI accelerator platforms to push performance without sacrificing board space. An example is compact optical modules, which are scaling from 10 Gbit/s to 1.6 Tbit/s. The new portfolio delivers height profiles between 1.2 mm and 1.7 mm.

Engineered for low‑voltage rails, the FS3303 supports input voltages from 2.7 V to 6 V and output voltages from 0.4 V to 3.3 V. This makes it a versatile solution for ASICs, SoCs, DSPs, and emerging AI chipsets requiring tight regulation and high transient performance.

The FS3303 leverages TDK’s proprietary 3D chip‑embedded packaging technology, integrating the controller, driver, MOSFETs, and power inductor. This architecture minimizes external components and delivers a complete DC‑DC solution with exceptional area and height savings—ideal for next‑generation optical transceivers and edge AI modules.

• Under the motto “The power in your design”, TDK highlights technologies that enable more powerful and energy-efficient systems from June 9 to 11, 2026, at the NürnbergMesse exhibition center in Nuremberg, Germany 

• On booth 350 in hall 9, visitors can explore the latest passive component and sensor solutions for wind and solar power, industrial drives, railway traction, EV charging, electric mobility, and AI data centers 

TDK Corporation (TSE: 6762) will showcase its recent advancements in passive components and sensor solutions at this year's PCIM on booth 350 in hall 9. The fair will take place from June 9 to 11, 2026, at the NürnbergMesse exhibition center in Nuremberg, Germany. TDK’s theme for the trade show is “The power in your design,” emphasizing how TDK enables partners and customers to design more powerful systems for industrial applications, the green energy sector, automotive, and AI data centers. 

Exhibition highlights 

The power in industrial and green energy

• TDK will showcase an inverter power stack from Ingenieurbüro Hoffmann, powered by 3-kV-rated ModCap capacitors from TDK and 3.3 kV SiC MOSFETs. The system is designed primarily for energy storage systems and heavy-duty vehicles. 

• Another highlight is a 2L-B6I inverter equipped with TDK’s MKP DC-link film capacitors from the B25697* series and Infineon CoolSiC™ 2.3 kV SiC MOSFETs in XHP™ 2 modules. This reference design illustrates how TDK supports customers in developing high-performance solutions for energy storage systems, wind and solar inverters, DC fast chargers, and solid-state transformers (SSTs). 

• To demonstrate TDK’s ability to respond to evolving market needs, visitors can also explore a Dispenser Blade of the EcoG Powerblock for EV charging. Each blade integrates one 4-in-1 HVC module instead of four discrete high-voltage contactors, simplifying assembly and maintenance. 

• Also on display is a 280 kW eCAV (commercial, construction, and agricultural vehicles) traction inverter reference design from Infineon, featuring TDK’s xEVCap in the DC link. 

• Visitors can learn more about how TDK supports efficient and reliable thermal management with its temperature and pressure sensors. These can be implemented directly in fluid circuits, offering fast response times, robust signal stability, and easy integration.

The power in automotive 

• Using a state-of-the-art traction motor, TDK will showcase its temperature and pressure sensors alongside embedded motor controllers and Hall- and TMR-based magnetic-field sensors – including current sensors – supporting a broad range of e-motor functions such as rotor position sensing, resolver replacement, and current measurement. The newly released TMR TAS magnetic sensors deliver zero-latency, high-bandwidth analog sensing in a compact footprint, offering a powerful and cost-effective alternative to inductive and resolver solutions.  

• In cooperation with Infineon and Shin‑Etsu Silicones Europe, TDK will exhibit a 300 kW traction inverter demonstrator, featuring four xEVCap film capacitors in the DC link and the CarXield as an EMC filter. Infineon contributed the reference inverter platform based on EconoDUAL™ 3 power modules, and Shin‑Etsu provided adhesives and gap fillers used for mechanical fixation and thermal coupling. 

• The new smart AlN multilayer substrates demo will give visitors a close-up view of this advanced thermal management technology. Key characteristics of AlN (aluminum nitride) include its high thermal conductivity compared to other ceramic substrate materials and its coefficient of thermal expansion (CTE), which closely matches today’s power semiconductor materials, including silicon and silicon carbide (SiC). 

• On the booth, visitors can see the “Tiny Power Box 2”. This 11-kW bidirectional on-board charging (OBC) unit from Silicon Austria Labs is equipped with dozens of CeraLink capacitors from TDK. This OBC supports both three-phase and single-phase operation (at lower power) and incorporates a DC-DC converter with an isolated 14-V output. 

• Another automotive highlight is Infineon’s cost-competitive IDEA traction inverter reference design, featuring TDK’s xEVCap in the DC link, TDK’s InsuGate transformers for driving the transistor gates, and the IDPAK discrete products from Infineon. 

The power in AI data centers 

The claim “From grid to core” underpins TDK’s approach to serve the entire power infrastructure for AI data centers with passive components, sensor solutions, and DC-DC converters. Besides the core application, the PSU (power supply unit), AI-related UPS (uninterruptible power supply), and BESS (battery energy storage system) are booming. The same applies to the point-of-load conversion next to the processor. For all these sub-applications, TDK has a comprehensive portfolio of solutions. And looking into the future, the solid-state transformer (SST) technology is in the starting blocks. 

• On the booth, visitors can explore how TDK’s ultra-compact aluminum electrolytic snap-in capacitors enable Infineon’s PSU reference designs to deliver 8 kW and 12 kW to AI servers in a very small footprint. 

• TDK will also showcase how the MKP DC-link capacitors align well with the modular concept of SSTs. 

• Another highlight is the high-voltage contactors like the HVC29, ensuring safety in 800 V DC distribution environments. 

• Also on display will be TDK's µPOL converters. This modular point-of-load solution can be stacked to deliver up to 200 A for FPGAs, SoCs, or ASICs, and is suitable for vertical power delivery architectures in AI systems. 

The power in EMC testing 

TDK is in the final phase of constructing a significantly larger EMC lab in Regensburg, Germany. The new accredited site will cover almost 1,700 square meters, including 1,100 square meters dedicated to laboratories and measuring stations. It will also include a showroom and a large customer area with meeting rooms. At PCIM, visitors can learn more about the new lab and TDK’s EMC services. 

At the booth, visitors can also explore TDK’s own absorbers, including tiles and pyramids, as well as sine-wave filters for up to 720 A and 2-line filters for power electronics applications of up to 1500 V/1600 A. 

The power in expertise 

TDK experts will share detailed technical insights into key technologies for e-mobility, energy storage, AI data centers, and solid-state transformers. The presentations demonstrate how TDK’s component and system expertise helps customers address design challenges and accelerate the development of next-generation power electronics.  

• David Olalla, xEVCap Next Level: Capacitor Bank and Thermo-Mechanical Evaluation of a Powertrain Inverter, June 10, 4:15 PM, E-Mobility & Energy Storage Stage, Hall 6, Booth 220 

• Anirban Roy, Technologies Powering the Shift to Solid-State Transformers: How TDK Technologies Enable the Transition, June 11, 10:00 AM, AI & Data Centers Stage, Hall 5, Booth 320 

• Alberto Espinar, xEVCap Next Level: Capacitor Bank and Thermo-Mechanical Evaluation of a Powertrain Inverter, June 11, 11:15 AM, Poster Session, Hall 4A 
   

Further information on TDK’s appearance at PCIM can be found at www.tdk-electronics.tdk.com/en/3474864/company/tradeshows-events/pcim

• State-of-the-art solutions for measuring electromagnetic compatibility (EMC)

• Focus on automotive and industrial electronics

After nine months of construction, the new EMC laboratory of TDK Electronics in Regensburg is celebrating its topping-out ceremony. This traditional event marks the completion of the building’s rough construction, and includes a heartfelt thank you to the craftspeople involved for their work, as well as a light meal for everyone. A total of about 50 guests attended, including employees from the architectural firm, various construction companies, and the City of Regensburg’s Economic Development Office.

Dr. Stefan Weber, project manager for the construction of the new EMC laboratory, thanked everyone involved for their work and support. “I am very pleased that we are able to celebrate the topping-out ceremony for our new EMC laboratory here today. The interior work is also progressing well, so I am confident that we will be able to officially open the laboratory this fall.” 

Juergen Roumen, Deputy General Manager of the Magnetics Business Group, to which the laboratory belongs, went on to emphasize that the new facility would serve as a central hub for working with customers to quickly and efficiently resolve any electromagnetic compatibility (EMC) issues. “The new laboratory will thus serve as a starting point for many innovative projects.” 

EMC as an indicator of safety and quality 

Covering an area of approximately 1,700 square meters, the new facility offers both internal and external customers state-of-the-art capabilities for measuring electromagnetic compatibility. EMC refers to the ability of electrical devices to function properly in their environment without interfering with other devices or being interfered with by them. The increasing amount of electronics in both the private and industrial sectors makes EMC a critical factor in safety and quality. 

The laboratory comprises three anechoic chambers of different sizes, in which vehicles, industrial applications, and RF and wireless applications can be tested. All chambers utilize state-of-the-art TDK anechoic technology and measurement systems. The EMC laboratory thus also serves as a showroom for the technologies and services TDK offers in this field, ranging from the design and planning of the facilities and their equipment to turnkey solutions.