• New 1000 V product with a capacitance of 22 nF in the 3225 case size with C0G characteristics of low-resistance soft termination type for automotive and general applications
• Contributes to greater reliability in applications, reduction of component count, and miniaturization
• Qualified based on AEC-Q200

TDK Corporation (TSE:6762) announced today it expanded its CN series of low-resistance soft-termination MLCCs. This product achieves an industry-leading* 22 nF capacitance in the 3225 case size (3.2 x 2.5 x 2.5 mm – L x W x T) and C0G characteristics at 1000 V. Mass production of the product series began in September 2025. The capacitors of the CN series are industry-first products that are equivalent to regular products in terms of their terminal resistance due to the optimization of their resin electrode structure.

In recent years, there has been an increase in the use of multiple resonance capacitors placed in series-parallel circuits for resonance applications such as LLC resonant circuits and wireless charging. As applications become more powerful, they require more resonance capacitance, which increases the demand for high-voltage, large-volume capacitors. To improve reliability in these applications, components with resin electrodes effectively prevent placement cracks resulting from external stress. However, the increased resistance value of resin electrodes has been an issue.

This led TDK to develop the CN series with optimized resin electrode structures, resulting in significantly lower resistance values. In addition to the low losses and capacitance stability over temperature and voltage variations of C0G products, these resin electrode structures achieve both high reliability against external stress and reduced loss, making them ideal for use as resonator and snubber capacitors. 

The optimization of product and process designs has made it possible to manufacture these products, which helps increase reliability and application to high-voltage circuits and enhances the reliability of the applications. TDK will continue to expand its product line to meet the needs of its customers.

* As of September 2025, according to TDK
 

• Offers acquired and clearly visualized complex motion data of the javelin throw that was previously invisible
• Contributes to athletes’ skill improvement and creates new spectator experiences
• As an official partner of World Athletics, TDK will continue to contribute to the evolution of sports through its unique technologies

TDK Corporation (TSE:6762) announces the successful visualization of javelin throw data through its technology collaboration with World Athletics, announced in June 2025. By applying TDK advanced sensor technology, it has made previously unseen information about the javelin throw visible, aiming to further enhance the appeal of the sport and contribute to the technical improvement of the javelin and the throwing technique of the athletes.

TDK will exhibit at the National Stadium during the World Athletics Championships in Tokyo from September 13-21, 2025. TDK’s booth will showcase prototypes of sensor-equipped javelins and future-oriented sample javelins with embedded sensors.

This project began from the shared desire of TDK and World Athletics to evolve athletics through technology and communicate its appeal to more people. By utilizing TDK’s high-precision sensor technology, it is taking on the challenge of acquiring and clearly visualizing complex motion data generated during the moment of javelin release and flight (such as launch angle, rotation, speed, altitude, and flight trajectory). Currently, TDK is in the experimental stage of attaching its sensors to actual javelins and throwing them, and has confirmed that the data acquired and analyzed by TDK sensors can be visualized. Moving forward, it will work to acquire and analyze even more accurate and detailed data.

https://www.tdk.com/en/featured_stories/tdkwithin/entry-01-javelinthrow.html keyboard_arrow_right

A major contributor to data acquisition is TDK’s cutting-edge, ultra-miniature high-precision InvenSense 6-axis MEMS motion sensor. The ultra-low power, miniature sensor (approx. 13 mg, 2.5 mm x 3 mm x 0.81 mm) detects position, speed, and angle. By combining multiple sensors, TDK has also made it possible to acquire data such as launch angle, posture, rotation, and altitude, which were previously unable to be visualized.

The data visualized by these sensors provides athletes with a new means to deeply understand their own performance and improve their throwing technique. Additionally, by presenting the data in an easy-to-understand visual format, TDK aims to help spectators better understand the javelin throw, discover new appeal, and experience the athletes’ extraordinary physical abilities in a new way.

The collaboration is one of TDK’s initiatives to realize its Long-term Vision, “TDK Transformation,” and embodies the new brand identity tagline “In Everything, Better.” In particular, through co-creation with partners, TDK will accelerate projects under the concept of “TDK Sensing Within,” utilizing its sensor technology in final products and solutions to drive social transformation. 

Since 1983, TDK has contributed to the development of track and field as an official partner of World Athletics, and it will continue to promote further evolution in sports through its unique technologies.

Guided by TDK’s Corporate Motto to “Contribute to culture and industry through creativity,” it has established TDK Long-term Vision TDK Transformation starting from the fiscal year 2025. This vision reflects TDK’s commitment to contributing to social transformation and continuously evolving ourselves to realize a sustainable future. By accelerating technological advancement and social change through electronic devices that combine its unique materials, process, and software technologies, TDK aims to contribute to a sustainable future, continually transform itself, and become the No.1 partner for growth together with customers worldwide.

World Athletics Chief Information Officer, Mr. An:
“TDK has been a valued partner supporting World Athletics for over 40 years. We are delighted that this technology collaboration has been realized for the first time. Sensor technology is highly compatible with athletics, and I see great potential in its ability to visualize athletes’ movements and efforts as data.”

TDK Corporation Project Team:
“Through numerous discussions and experiments with World Athletics officials, our understanding of the javelin throw—a previously unexplored field for TDK—has deepened. We are delighted that our sensor technology is able to acquire and visualize data that was previously invisible. We will continue to refine our technology and contribute to the transformation of the sport.”

TDK Corporation (TSE:6762) and its wholly-owned subsidiary TDK Electronics AG informed the management board of Tronic’s Microsystems on July 9, 2025, of its decision to file a public tender offer followed by a mandatory squeeze-out for the shares of Tronic’s Microsystems SA at a price of €5.56 per share (the “Draft Offer”). TDK Electronics AG, the majority shareholder of Tronic’s, holds 87.34% of Tronic’s share capital. The concert formed between TDK Electronics AG and Thales AVS France SAS holds 97.44% of Tronic’s share capital.

The Draft Offer is part of an initiative to simplify the shareholding of Tronic’s, through the acquisition of the outstanding capital not currently held by TDK Electronics AG and Thales AVS France SAS (2.56% of Tronic’s), with TDK Electronics AG as the sole offeror. The Draft Offer is in line with Tronic’s strategy, which no longer requires the listing of the company on Euronext Growth^® in Paris, taking into account the very low liquidity of the stock. The Draft Offer also aims to reduce the costs associated with the listing. As a reminder, TDK Electronics AG has financed Tronic’s in recent years and plans to recapitalize Tronic’s up to a maximum of €7,000,000 by March 31, 2026, as Tronic’s equity has been less than half of its share capital since 2023.

Therefore, TDK Electronics AG is offering Tronic’s shareholders who tender their shares to the offer the opportunity to obtain immediate liquidity for their entire stake.

As Tronic’s is unable to establish an ad-hoc committee as referred to in III of Article 261-1, III of the AMF General Regulation, Tronic’s submitted on July 10, 2025, to the French stock market authority (Autorité des marchés financiers, AMF) the appointment of BM&A, represented by Pierre Béal, as independent expert. The AMF financiers informed Tronic’s on July 23, 2025, that it did not oppose this appointment.

The Offer period will be ten trading days and is expected to take place before the end of the second half of 2025. Prior to the opening of the Offer, the AMF will publish a timetable notice, and Euronext Paris will publish a notice announcing the terms and opening of the Offer.

As the conditions for a mandatory squeeze-out have already been met, the offer will be followed by a mandatory squeeze-out procedure for Tronic’s shares on Euronext Growth^®. As part of the mandatory squeeze-out, the Tronic’s shares that have not been tendered to the Offer will be transferred to TDK in exchange for cash compensation equal to the Offer price, i.e., €5.56 per share.

This Offer will not be subject to any financing condition, as TDK has the necessary funds to fully finance the cash Offer.

The draft TDK tender offer document was filed today with the AMF and is available in the investors section of TDK's website, www.tdk.com.

Additional information regarding the transaction

The draft information memorandum prepared by TDK Electronics AG and filed today with the AMF is available in the Investors section of TDK's website. The public will be informed of the filing of the public tender offer documents, which will subsequently be published by TDK Electronics AG and Tronic’s. In accordance with French law, the documentation related to the public buyout offer aimed at Tronic’s will include the tender offer document prepared by TDK, incorporating the terms and conditions of the offer, as well as the draft response memorandum prepared by Tronic’s, including the independent expert's report and the reasoned opinion of the supervisory board, and will be subject to review by the AMF.

TDK Corporation (TSE:6762) introduces the B3270xP, a series of ultra-small, metallized polypropylene (MKP) film capacitors tailored for power factor correction (PFC) stages in power supplies for consumer electronics. With their compact design and self-healing properties, these components are engineered for use in adapters and power supplies for devices such as laptops and gaming consoles. Their minimized footprint addresses the increasing demand for space-efficient solutions in high-density circuit designs. 

The B3270xP series is available in three lead spacing variants – 10 mm (B32701P), 15 mm (B32702P), and 22.5 mm (B32703P) – with rated DC voltages of 450 V, capacitance values ranging from 0.47 µF to 2.2 µF, and an ESR of 10 mΩ to 25 mΩ at 100 kHz. These capacitors operate up to a +110°C case temperature (with voltage derating above +85°C), delivering consistent performance over a service life of 50,000 hours at rated voltage and +85 °C. In addition, they exhibit a dissipation factor tan δ of up to 1.0 ∙ 10⁻³ at 1 kHz. TDK provides LTspice models for these components. 

Designed with parallel wire leads and halogen-free options upon request, the components meet RoHS compliance and are offered in bulk, ammo pack, or reel configurations. Their plastic housing and epoxy resin sealing meet UL 94 V-0 standards, ensuring flame retardance and mechanical durability. 

• TDK’s subsidiary, Tronics Microsystems, expands into vibration sensor solutions, targeting process and asset monitoring to support predictive maintenance and industrial IoT applications 

• Building on two decades of MEMS expertise, the company leverages its legacy in inertial sensors to engineer high-precision vibration sensor solutions 

• Strategic evolution aligns with Tronics’ mission and vision, reinforcing its role in digitally transforming transportation, energy, and industrial sectors through smart sensing solutions 

• Live demonstrations planned at electronica India (Sept 17–19) and sps – Expo in Nuremberg (Nov 25–27), showcasing the new vibration sensor technology 

  TDK Corporation (TSE:6762) announces that its subsidiary, Tronics Microsystems ‒ a leading provider of high-performance inertial MEMS sensor solutions ‒ is expanding its product portfolio to include vibration sensor solutions aimed at process and asset monitoring applications. This strategic development represents a major milestone in the company’s evolution and underscores its dedication to driving the digital transformation across industrial sectors. 

  For over two decades, Tronics has pioneered in delivering high-performance MEMS inertial sensor solutions for precise motion sensing, positioning, and navigation in aerospace, railway, and energy applications. Leveraging decades of experience in MEMS R&D, manufacturing, and test, the company builds on that legacy to introduce vibration sensor technologies for monitoring and predictive maintenance of critical processes and assets. 

  Mission 

  To be a provider of MEMS inertial sensor solutions for precise motion sensing, positioning, navigation, and condition monitoring of critical assets in transportation, energy, and industry. 

  Vision 

  To contribute to the digital transformation of transportation, energy, and industry by providing digital inertial and vibration sensors solutions.  

  A story of evolution 

  As industries evolve, digitally transforming towards Industrial IoT and more, so does the need for smarter systems that can continuously sense not just motion, but also the health of machines themselves through vibration spectrum monitoring. Tronics is then currently introducing vibration sensor solutions that bring a new layer of digital transformation and intelligence to industrial systems. 

  “Expanding offers into the vibration sensor market is a natural and strategic evolution for the Company, rooted in our MEMS DNA for high-end industrial applications. We did not just package an off-the-shelf basic accelerometer for our vibration sensors. Listening to the condition-based monitoring demand, we engineered innovative MEMS solutions with the same precision and reliability that define our inertial products and services,” said Julien Bon, CEO, Tronics Microsystems.  

  Tronics is currently completing the development of its first generation of vibration sensor solution for process and assets monitoring, enabling customers to design highly accurate quality control and predictive maintenance solutions. 

  See it in action! 

  Tronics is proud to announce that this innovative development will be showcased live at electronica India on September 17-19 in Bengaluru [TDK booth D01, Hall 3] and sps – Expo on November 25-27 in Nuremberg [TDK booth 334, Hall 10]. Emmanuel Bercier, Innovation Marketing Manager, will demonstrate the technology and discuss how Tronics is shaping the future of machine health monitoring through smart IoT sensor solutions.