• µPOL module F1525 delivers 25 A each, up to 200 A when stacking multiple units, for a compact and low-height form factor in vertical power delivery designs
• Ultra-fast transient response, ultra-low DC ripple, and low spectral noise
• Integrates MOSFETs, inductors, and control in a thermally enhanced 3D structure with analog and digital interfaces

TDK Corporation (TSE: 6762) expanded its µPOL family of non-isolated DC-DC power modules by adding the FS1525. This just 3.82 mm high point-of-load (PoL) converter delivers up to 25 A and is engineered to meet the demanding requirements of AI servers, edge computing, and data center systems. By stacking or paralleling several FS1525 modules, they can deliver 200 A combined in vertical power delivery designs. This is a novel approach in which the PoL converters are located directly under the FPGA/SoC or ASIC on the backside of the PCB.

Leveraging advanced 3D chip-embedded package technology, the FS1525 integrates all critical components—including controller, driver, MOSFETs, digital core, memory banks, bypass capacitors, and power inductor—into a single component with a footprint of 7.65 x 6.80 mm (L x W). The thermally enhanced architecture with a thermal impedance of 1.4 K/W delivers superior current performance, outperforming conventional solutions at high ambient temperatures while simplifying PCB routing and enabling high-density power architectures.

Supporting input voltages from 4.5 V to 16 V and an adjustable output range from 0.6 V to 1.8 V, the FS1525 is optimized for powering modern low-voltage AI processors, including the core voltage of 3-nm to 6-nm ASICs, and SERDES rails with sub-5mV peak-to-peak ripple. Its low spectral noise performance matches well with DSPs, imaging, and advanced Automated Test Equipment (ATE) applications. Being scalable up to 200 A and designed for vertical power delivery designs, the new µPOL enhances thermal performance and maximizes board space efficiency.

FS1525 has a fast transient response, low ripple, and true differential remote sensing to ensure accurate voltage regulation at the point of load. Digital programmability via I²C and PMBus enables real-time telemetry, adaptive tuning, and fault management for voltage, current, and temperature monitoring, critical for dynamic AI workloads. The module also offers analog Vout settings tailored to leading FPGA/SoCs and ASICs, supporting advanced features such as Altera’s SmartVID for Agilex FPGA series.

The new µPOL module integrates seamlessly with modern computing form factors, including PCIe, VPX, SMARC, and 1U to 3U rack systems, providing high flexibility for system designers. It is already deployed in proven designs for FPGA/SoCs such as Altera Agilex™, AMD Versal™ Edge, and AMD-Xilinx platforms, including Zynq UltraScale+ MPSoC and Versal ACAP, widely used in AI and machine learning applications.

As part of TDK’s comprehensive µPOL portfolio spanning 1 A to 200 A, the FS1525 offers a unified system-level power solution. With plug-and-play simplicity and no external compensation required, it accelerates development cycles, reduces design complexity, and lowers overall system cost. More than a power module, the FS1525 represents a complete power ecosystem designed to drive the future of intelligent computing. Evaluation boards for 25 A and 50 A are in stock at DigiKey and Mouser. Stackable boards for 100 A and 200 A are available upon request.

Versal is a registered trademark of AMD

Agilex is a registered trademark of Altera

Design collateral for ease of design

• FS1525 Starter Design schematics and PCB layout at Ultra Librarian, URL:
   https://www.ultralibrarian.com/partners/tdk
• FS1525 SIMPLIS model and PDN libraries for top FPGAs/SoCs, URL:
   https://www.us.tdk.com/news_center/upol/index.php
• FS1525 Evaluation boards from 25A, 50A, 100A, and 200A

TDK Corporation (TSE: 6762) was recently named a 2026 Clarivate Top 100 Global Innovator, receiving particularly high evaluations for influence and rarity. For TDK, this is the twelfth time in total, and the ninth time in a row to receive this prestigious award.

Since 2012, the Clarivate program has identified companies at the pinnacle of the global innovation landscape by measuring the ideation culture that produces patents and drives growth. Clarivate measures patent influence, success, rarity, geographic investment, and other factors based on rigorous research utilizing proprietary analyses derived from Derwent World Patents Index (DWPI) and patent data from around the world.

“We are greatly honored to be recognized as a Clarivate Top 100 Global Innovator for the twelfth time, and for the ninth consecutive year,” said Shuichi Hashiyama, CTO and Director at TDK Corporation. “In the TDK Group’s Medium-term Plan, which started in the fiscal year March 2025, one of the major themes is evolving TDK’s unique 'Ferrite Tree,' namely the strengthening of 'pre-financial capital' that will become a source of financial capital in the future. Intellectual property is an important element of our ‘pre-financial capital,’ and TDK promotes intellectual property activities in conjunction with the overall management and business strategies of TDK. The TDK Group actively promotes collaboration not only within the group but also beyond industry and sector boundaries, and in order to respond swiftly to increasingly complex and sophisticated technological demands, we will continue to work on providing new technologies and solutions required by our customers and society,” Hashiyama added.

The TDK Group's intellectual property governance is based on Empowerment & Transparency, and practices decentralized intellectual property management that respects the circumstances and characteristics of each country and region. Intellectual property activities go beyond merely acquiring rights; they are linked to management and business strategies, aiming to directly connect IP investment to the creation of business value through contract optimization, market and technology analysis, and engagement with stakeholders, including investors. The diverse best practices accumulated at each region are shared and deployed globally, leveraging IP intelligence and networks to enhance the organization’s technological capabilities and drive business growth. As a global company, TDK will continue to maximize regional strengths and achieve sustainable growth.

In 2025, TDK released several industry-leading innovations:

• Spin Photo Detector, the world’s first photo-spintronic conversion element combining optical, electronic, and magnetic elements that can respond at an ultra-high speed of 20 picoseconds (20 × 10⁻¹² s) using light with a wavelength of 800 nm – more than 10X faster than conventional semiconductor-based photo detectors, it can be applied to photoelectronic conversion technology, which is expected to improve data processing speed and reduce power consumption, both critical for further AI evolution.
• edgeRX Vision, an ultra-fast, AI-powered defect detection system that analyzes customer product images or movies and is capable of identifying components as small as 1 mm with exceptional precision, it boosts production efficiency by reducing false positives and minimizing downtime, operating at speeds of up to 2,000 parts per minute.
• Analog reservoir AI chip, jointly developed a prototype using an analog electronic circuit that mimics the cerebellum with Hokkaido University, specializing in time-changing information, and achieves low power consumption and fast computation in ultra-low-power products such as the edge, which directly handles sensor data.
• PositionSenseTM, a 2-chip 9-axis sensor solution for absolute orientation detection and fast sensor calibration at ultra-low power consumption, integrating TDK’s 6-axis IMU and TDK’s 3-axis TMR-based magnetometer, on-chip sensor fusion software, and off-chip pedestrian dead reckoning (PDR) software, enabling next-gen positioning accuracy for wearables, AR glasses, smartphones, and similar devices.

TDK Corporation (TSE:6762) announces the extension of its high-performance MEMS inertial sensors portfolio with Tronics AXO315®T1, a high-temperature MEMS accelerometer with ±14 g input range and a digital interface for measurement while drilling (MWD) applications operating up to +175 °C.

With this launch, TDK is taking the next step in temperature robustness, following the release of the Tronics AXO315T0 in June 2025 — its first digital MEMS accelerometer to be qualified for oil and gas applications at temperatures of up to +150 °C. This confirms the company's position as a leading provider of high-reliability MEMS inertial sensors for precise downhole navigation in extreme environments.

The AXO315T1 is powered by TDK’s unique closed-loop architecture, which has already been proven on several Tronics sensors. This architecture enables a 10x improvement in vibration rectification error compared to traditional open-loop MEMS accelerometers. The device is a cost-effective, digital, and low-SWaP (Size, Weight, and Power) alternative to quartz accelerometers for inclination measurement in directional drilling tools operating in harsh temperature and vibration conditions.

With a lifetime of more than 1000 hours at +175 °C, it paves the way for a new generation of MWD tools to meet the accuracy and productivity requirements of complex and unconventional drilling operations.

AXO315T1 sensors and evaluation boards are available for sampling and customer evaluations.

TDK Corporation (TSE: 6762) announces the new ModCap UHP (B25648A) series of DC link capacitors, setting a new benchmark for power electronic applications. 'UHP' stands for 'Ultra-High Performance', and this series enables continuous operation at hotspot temperatures of up to +105 °C without power derating. Compared to previous ModCap generations, which required derating starting at +90 °C, the new design enables higher current density and a longer lifetime in challenging conditions.

By combining a new high-temperature dielectric with a modular design, the ModCap UHP series extends the lifetime of capacitors to 200,000 hours at +105 °C and supports a 20% higher current density. With a DC voltage rating of 1350 V to 1800 V and a capacitance ranging from 470 µF to 880 µF, the series is optimized for SiC semiconductor-based inverters that require low inductances (ESL of 8 nH) and high-frequency performance.

These capacitors target fast-growing sectors, including renewable energy (solar and wind power, electrolyzer), energy storage, and inverters for railway and industrial drives. Their cubic design (205 x 90 x 170 mm; L x W x H) simplifies busbar integration, thereby increasing power density in compact converters and reducing the need for additional snubber capacitors.

Beyond performance, the ModCap UHP advances sustainability and safety. The dielectric film is ISCC-certified bio-circular BOPP, while the housing complies with UL94 V-0 and EN 45545-2 HL3 R23 fire standards. UL recognition is pending.

For ModCap, TDK offers a set of different engineering tools, including a SPICE library, the web-based Capacitor Life and Rating Application (CLARA), and the web-based CAP Thermal for thermal simulation.

• TDK’s new custom motion sensors, with on-chip sensor fusion and machine learning capability, enable edge intelligence for AI glasses, TWS ear buds, smart watches, fitness bands, and other IoT devices 

• The three newest IMUs from TDK can run motion tracking/detection algorithms on-chip and offload the computation power needed for motion tracking from SoC/MCU to local sensor for short system latency and low power consumption 

• Customers using the newest TDK IMUs include products on display at CES at TDK booth #15803 

TDK Corporation (TSE:6762) announces a suite of InvenSense SmartMotion® custom sensing solutions for more intuitive user experiences with TWS ear buds, AI glasses, augmented reality eyewear, smart watches, fitness bands, and other IoT devices. Combining leading MEMS sensor innovation with sensor fusion software, the three newest IMUs are based on TDK’s latest ultra-low power, high-performance ICM-456xx family that offers edge intelligence for the next generation of consumer technology at the highest motion tracking accuracy.  

“The challenge in today's wearable market is delivering features like seamless augmented reality (AR) or high-fidelity spatial audio without sacrificing the compact, stylish form factor and all-day battery life,” said Pankaj Aggarwal, VP & GM of the Consumer and Industrial Motion, InvenSense, a TDK group company. “Our ICM-456xx family with BalancedGyro™ technology and on-chip intelligence solves this problem. It ensures that every user head turn, every UI gesture, and every AR overlay is instantaneous, stable, and incredibly power efficient.” 

Instead of relying on power-hungry central processors, SmartMotion® on-chip software enables computational work related to motion tracking to be offloaded to the motion sensor itself, so that intelligence decisions may be made locally – allowing other parts of the system to remain in low-power mode. The sensor fusion algorithm and machine learning capability provide seamless motion sensing with minimum software effort by the customer. 

The newest SmartMotion® solutions, based on the ICM-456xx family of 6-axis IMUs, include: 

• SmartMotion ICM-45606 for TWS applications including ear buds, headphones and other hearable products. This next-generation VibeSense360 TWS solution supports on-chip sensor fusion with high yaw accuracy, vocal vibration detection, and machine learning for sensing user gestures and activity detection. This part number will be available at distributors by the end of Q1.  

• SmartMotion ICM-45687 for wearable and IoT technology is now available via sales inquiry. The IMU-45687 enables on-chip algorithms like bring-to-see, wake-on-motion, and tap, plus machine learning for activity classification and user gesture detection.  
   

• SmartMotion for Smart Glasses ICM-45685, first announced September 16, 2025, now also enables new features, sensing whether users are putting glasses on or taking glasses off (wear detection) and vocal vibration detection (VVD) for identifying the source of the speech through its on-chip sensor fusion algorithms. This custom sensing solution also enables high-precision head orientation tracking, optical/electronic image stabilization, intuitive UI control, posture recognition, and real-time translation – all at ultra-low power.  

The new SmartMotion ICM-45685 is part of an array of TDK custom sensing solutions for Smart Glasses that includes TMR sensors for hinge angle detection, MEMS microphones for voice-activated AI, Ultrasonic Time-of-Flight sensors for precise wear detection and gesture tracking, and PositionSense 9-axis solution with IMU+TMR magnetometer and software for absolute orientation detection and navigation.  

Select SmartMotion sensor solutions in the ICM-456xx are available via distributors, with the above-mentioned custom solutions now available via direct sales inquiry. Inquire via invensense.tdk.com/smartmotion or inv.sales.us@tdk.com.