• TDK establishes Asia-Pacific Regional Headquarters (APAC RHQ) in India, effective 1 April 2026
• APAC RHQ will be operated by TDK Asia-Pacific Pvt. Ltd., a new legal entity to be established in India, and TDK Singapore Pte. Ltd., forming a dual-city administrative structure
• The RHQ is part of ‘TDK Transformation’, the company's Long-term Vision

TDK Corporation (TSE:6762) announces the establishment of its Asia-Pacific Regional Headquarters (APAC RHQ) in Bengaluru, India—the company’s fifth regional headquarters alongside Japan, Europe, the Americas, and China. The new legal entity, TDK Asia-Pacific Pvt. Ltd., together with TDK Singapore Pte. Ltd., will govern more than 20 TDK entities across India, Southeast Asia and Oceania—representing nearly 17 percent of TDK’s 105,000 team members. Effective 1 April 2026, the APAC RHQ will operate from a dual-city administrative structure: Bengaluru, India, and Singapore, together the epicenter of one of the world’s most consequential economic corridors and drive ‘TDK Transformation’.

Asia-Pacific is the growth market of this century. Home to nearly 40 percent of the world’s population, the region is projected by the IMF to grow at 4.5 percent in 2025, contributing roughly 60 percent of all incremental world output—even as global growth holds at a modest 3.2 percent. Within it, India stands decisively apart: at 6.6 percent GDP growth for FY2025/26 (IMF), the fastest-growing major economy on earth for the third consecutive year, and now the world’s fourth largest after surpassing Japan in 2025. For TDK, this is familiar terrain approached with new ambition. The company has operated in India for several decades, through its two principal business entities—Electronics Components Business Company (ECBC) and Energy Solutions Business Company (ESBC)—and their subsidiaries, with production facilities in West Bengal, Maharashtra, and Haryana. Today, TDK in India employs over 5,000 people.

"With the establishment of the Asia-Pacific RHQ, we are not simply expanding our footprint—we are strengthening the foundation for the future”, said Vaidyanathan Ramasarma, General Manager, APAC RHQ – TDK Corporation. “This region holds immense potential in technology, talent, and market development. Our mission is to unlock that potential responsibly, collaboratively, and strategically.”

The dual-city administrative structure will balance growth and governance equally in a region that demands both. Bengaluru anchors the growth agenda—India’s technology capital with one of the world’s deepest talent ecosystems in engineering, and foundational research, positions TDK to build new categories, not merely optimize existing ones. The APAC RHQ will invest in emerging technology domains, leveraging India’s tradition of frugal engineering and favorable unit economics for a growing global marketplace. Singapore anchors governance, compliance, and supply chain—a trusted, neutral fulcrum for a region of extraordinary complexity. Together, the two cities form a strategic dyad: one looking inward at the intricacies of regional operations, the other at the horizon of what is possible.

The APAC RHQ will strengthen market intelligence, government relations, and supply chain resilience across the region while driving internal efficiencies, workforce skilling, and disciplined process governance—the less visible but indispensable work of building a business that lasts. In particular, APAC RHQ will play a critical role in building TDK’s global R&D network. India’s scientific talent, its appetite for foundational research, and its unique ability to apply deep knowledge to real‑world constraints make it an indispensable part of our global R&D vision. The government of India’s urgency and appetite for foreign direct investment, its improving ease of doing business, and its ambitious national technology initiatives create conditions that are, for a company like TDK, genuinely rare.

For the past two years, a quiet but purposeful effort has been underway—building the relationships, the institutional trust, and the operational foundations needed for success. TDK’s nascent APAC team has been forging partnerships across academia, government, and industry in India, establishing the connective tissue of a long-term commitment. 

Through this APAC RHQ, TDK will strengthen its contributions to social transformation from India and Asia‑Pacific, while also accelerating our own transformation.
 

• TDK is represented from March 10 to 12 in Nuremberg, Germany, at booth 505 in hall 1
• Technologies ranging from sensor solutions, power supplies, and embedded motor controllers to flash storage solutions and microphones

TDK Corporation (TSE 6762) announces its participation in embedded world 2026, held from March 10 to 12 in Nuremberg, Germany. At booth 505 in hall 1, TDK will showcase a wide range of embedded solutions designed to meet evolving application demands. Visitors can engage directly with TDK experts to learn more about current technologies and system-level approaches. 

Technology highlights include:

Sensor solutions: Sensing solutions for a variety of applications across IoT, Automotive, wearables, hearables, AR/VR, gaming, smart home, and accessibility technology.

• 2D/3D Hall-effect position sensors:
  Enable precise position detection of valves, flaps, and actuators within the automotive thermal management system. They are robust against magnetic stray fields and provide accurate position information even in harsh automotive environments.
• Temperature and pressure sensors:
  Provide accurate temperature and pressure measurement directly in fluid circuits such as oil, coolant, and refrigerant lines. Designed for harsh automotive environments, these sensors combine fast response times, robust signal stability, and easy integration to support efficient and reliable thermal management.
• Digital MEMS microphones:
  Showcasing audio capture, acoustic activity detection, and spoken keyword detection.
• TMR & MEMS sensor fusion: 
  Tracking everything every time, an absolute orientation detection for accurate heading and navigation, using on-chip system-level sensor fusion of 6-axis IMU (Inertial Measurement Unit) and 3-axis magnetometer.
• Ultrasonic Time-of-Flight sensor in iSee One smart glass:
  Thanks to its obstacle detection capabilities and ultra-low power consumption, the ultrasonic ToF enhances accessibility for individuals with visual impairments in an ergonomic design of a smart glass.

Embedded motor controllers: Fully integrated motor controllers for the drive of small DC motors, e.g., in automotive thermal management applications such as pumps, valves, grille shutters, or fans.

• Embedded gate driver & motor control ICs:
  Support efficient control of BLDC motors driving pumps and actuators in thermal management applications. Integrated control and communication functions enable compact system design and reliable motor operation.

Power supply solutions: Advanced AC-DC power supplies and DC-DC converters for cutting-edge industrial, medical, and embedded applications.

• RGC series: 300 W rated ruggedized non-isolated DC-DC buck-boost converters with an input voltage of 9 V to 53 V.
• RGA series: 250 W rated ruggedized non-isolated DC-DC buck converters with an input voltage of 9 V to 40 V or 9 to 53 V
• CCG series: 6 W and 10 W rated DC-DC converters, suitable for through-hole or surface-mount placement.
• i7A series: non-isolated DC-DC buck converters with the industry-standard 1/16th brick footprint.

Flash storage solutions: Solid State Drives (SSDs) offering exceptional data reliability are ideal for applications like industrial equipment and edge computing, where stable operation is crucial.

• Solid State Drives (SSDs) featuring GBDriver series: moderately high-speed access and stable operation while securing data reliability.
• DRAM-less SSDs with a power backup circuit: minimizing data errors, ideal solution for industrial embedded systems.

These flash‑storage technologies are already being integrated into European railway infrastructure and will be showcased at embedded world together with their applications. The demonstration is presented in collaboration with IHI Corporation and features the “3D Laser Radar Level Crossing Obstacle Detection System”.
 

TDK Corporation (TSE:6762) extends its X2 safety film capacitor portfolio with the new B3292xU/V series, 
now supporting higher voltages and offering compact lead spacings of 15 mm and 22.5 mm, with capacitance values from 47 nF to 1.8 µF. Rated at 350 V (AC) and robust against peak voltage pulses up to 2.5 kV 
(IEC 60384-14), the series is designed for interference suppression in demanding, space-constrained industrial and automotive environments in series with the mains. Typical applications are on-board chargers, EV charging systems, PV inverters, energy meters, and capacitive power supplies.

The entire series is now available with lead spacings from 15 mm to 52.5 mm, covering capacitance values from 47 nF to 20 µF. It passed the THB (temperature, humidity, bias) test at +85 °C, 85% RH, and rated voltage for 1000 h, meeting Grade III, Test Condition B requirements. In addition, the series offers AEC-Q200 compliance, excellent self-healing properties, and a maximum operating temperature of +110 °C, ensuring durability even under severe ambient conditions.

With their compact dimensions and high DC testing voltage (1505 V for 2 s), the B3292xU/V series provides a balanced solution of performance and size for next-generation industrial drives and automotive power electronics, supporting the growing need for efficient and space-optimized EMI suppression solutions.

For the B3292xU/V series, TDK offers a range of design tools and SPICE models.

TDK Corporation (TSE: 6762) introduces the new B43655 and B43656 series of aluminum electrolytic capacitors designed specifically for DC links in on-board chargers (OBCs) of electric vehicles. Both series are optimized for forced cooling operation, supporting the growing trend toward higher voltages and currents in next-generation OBC platforms. Due to their compact design and high ripple current capability, such capacitors are commonly used in applications requiring maximum efficiency and reliability in confined spaces. 

With a high voltage rating of 475 V and 500 V, as well as capacitances ranging from 110 µF to 880 µF, the B43655 series meets the requirements of 800 V battery architectures for modern e-mobility applications. Designed for base cooling and high ripple current density, these components offer a useful life of more than 3,000 hours at +105 °C. They also feature a maximum ripple current of 3.29 A at +105 °C and ESR values down to 100 mΩ to minimize power losses. The B43656 series, rated at 450 V, handles even higher currents of up to 4.42 A at +105 °C for demanding high-power OBC topologies. 

Both series are qualified according to AEC-Q200 Rev. E and are made with RoHS-compliant materials. They are available in compact snap-in designs ranging in diameter from 22 mm to 35 mm and in length from 25 mm to 60 mm, depending on the capacitance and voltage class. The B43655 and B43656 capacitors provide design engineers with robust, future-ready solutions for on-board chargers in electric vehicles, thanks to their enhanced electrical performance and reliability. 

The new B43655 and B43656 series will also be implemented in TDK’s web-based AlCap Useful Life Calculation Tool. 

• Guarantees operation in high‑temperature environments up to +175 °C
• Adopts AgPd terminals compatible with conductive‑glue mounting
• AEC‑Q200 compliant (automotive grade)

TDK Corporation (TSE:6762) announced today that it has expanded its NTCSP series of NTC thermistors. These components are designed for conductive‑glue mounting for operation in high‑temperature environments up to +175 °C. Mass production of this series began in February 2026.

To drive higher automotive performance, more powerful and heat-resistant power semiconductors are required. Consequently, electronic components mounted in these power modules must also be able to withstand higher temperatures. While the maximum guaranteed operating temperature for TDK's existing products was +150 °C, the company has now expanded its range to cover up to +175 °C.

This product is a high‑reliability device compliant with AEC‑Q200 and realizes a wide operating temperature range of -55 °C to +175 °C. It can be used for various temperature detection and temperature compensation applications across low to high temperature ranges. It is suitable for automotive applications such as anti‑lock braking systems (ABS), transmissions, and engines. By adopting AgPd (silver‑palladium) terminals compatible with conductive‑glue mounting, this series can operate at +175 °C; this was difficult to achieve with conventional solder mounting.

The NTCSP series offers 10 kΩ and 100 kΩ types in a 1.6 x 0.8 mm package.

TDK will continue to develop NTC thermistors to meet a wide variety of needs, including expansion of chip sizes, thermistor characteristics, and operating temperature ranges.