• Under the joint claim “Accelerating transformation for a sustainable future,” TDK shows highlight solutions for green and digital transformation from May 6 to 8, 2025,  in the NürnbergMesse exhibition center in Nuremberg, Germany
• At PCIM in booth 350 in hall 9, visitors can explore the latest passive component and sensor solutions for wind and solar power, ESS, hydrolyzer, heat pumps, EV charging, electric mobility (xEV), and AI 
• At SENSOR+TEST in booth 204 in hall 1, visitors can explore the latest sensor technologies to optimize the performance and reliability of industrial and automotive solutions

TDK Corporation (TSE:6762) showcases its latest passive component and sensor innovations at this year’s PCIM and SENSOR+TEST, taking place in parallel from May 6 to 8, 2025, in the NürnbergMesse exhibition center in Nuremberg, Germany. “Accelerating transformation for a sustainable future” is TDK’s joint claim for both shows, where visitors can explore TDK’s solutions for both green and digital transformation in the application areas of automotive, industrial, home appliances, and artificial intelligence. TDK's exhibit at PCIM in hall 9, booth 350, features passive components and sensor solutions for applications such as energy and power conversion, heat pumps, EV charging, mobility (xEV), and AI. Just around the corner, in hall 1, booth 204, visitors at SENSOR+TEST can delve into the whole spectrum of sensor technologies from different TDK group companies. 

Solution highlights at PCIM, hall 9, booth 350:

• Electric Mobility (xEV): 
  TDK is showcasing a busbar design with our modular xEVCap as a DC link capacitor as well as a bidirectional 22-kW onboard charger. Innovative power magnetics like transformers with integrated resonance choke minimize losses and save valuable space in onboard chargers. The aluminum nitride (AlN) multilayer substrates and 3D-printed AlN liquid coolers allow a 400-kW traction inverter to fit into a space about the size of two decks of playing cards.

• Energy & Power Conversion (Wind, Solar, ESS, Hydrolyzer, etc.): 
  TDK will display a modular inverter solution based on CeraLink used as flying capacitors, as well as a 250-kW inverter block for commercial and agricultural vehicles. The company will also introduce the next generation of its award-winning ModCap; the ModCap High Performance is capable of operating at elevated temperatures of +105 °C without derating. Visitors can explore a wind power stack weighing 60 kg equipped with 15 capacitors from the MKP DC HF series in the DC link. Just as small as a sugar cube is the gate drive transformer EP9, which has an operational isolation voltage of 500 V for driving IGBTs and MOSFETs on the high side of a half bridge. 

• EV Charging:
  TDK presents various reference designs like a bidirectional 22-kW onboard charger as well as a modular hybrid inverter for 10 + 15 kW. The company will also showcase several new DC link and safety EMI capacitors, as well as high voltage contactors like the HVC50 for currents up to 750 A at 1500 V for megawatt charging stations. 

• Sensor Solutions: 
  To reduce costs by significantly lowering the number of components in heat pumps, TDK showcases integrated pressure and temperature sensors. Taking a real e-motor, the company illustrates its comprehensive portfolio of sensor solutions to drive the motor to the max without pushing it over the edge.

Presentations

• Niklas Edkvist, TDK Europe: Panel discussion on “Powering AI: What Market and Technology Trends in Powertrain?” on May 6 at 11:20 AM on the Technology Stage in hall 4, stand 435 

• David Olalla, TDK Electronics: “Practical Use of xEVCap: The Modular and Standard DC-Link Capacitor for the Main Powertrain Inverter” on May 8 at 10:10 AM in room Mailand

Product highlights at Sensor+Test, Booth 204, Hall 1:

• Hall-effect Automotive Sensors: 
  Visitors can explore more about new stray-field robust mainstream 2D Hall-effect sensors HAL/R 35xy for automotive applications, like steering wheel angles, brake and accelerator pedals, valve positions, and chassis detection. These are available in single-die (HAL 3550) and dual-die (HAR 3550) versions, with analog and digital outputs. 

• Embedded motor control solutions: 
  TDK will also display the new cost-efficient HVC 5481G programmable gate driver SoC for automotive actuators, fans, and pumps. They can drive an external power bridge of 6 N-channel FETs with sensor-based and sensorless algorithms from BEMF commutation to single-shunt FOC. 

• Analog & digital MEMS microphones:
  TDK showcases audio capture, acoustic activity detection, and spoken keyword detection.

• WeWALK Smart Cane 2: 
  Experience the multi-award-winning cane, featuring TDK’s microphone sensors, ultrasonic sensors, and motion sensors, to enhance accessibility for individuals with visual impairments, all while maintaining an ergonomic design.

• Ultrasonic sensor modules: 
  TDK presents a solution that detects objects and measures distances in challenging environments, including full sunlight, translucent targets, and vibration in autonomous mobile robots (AMR) or autonomous guided vehicles (AGV).

• Pressure sensors: 
  At the booth, visitors can learn more about combined pressure and temperature sensors for thermal management, as well as pressure sensors for fuel tank leakage detection and industrial applications. 

• Temperature sensors: 
  On display are also surface temperature sensors for industrial as well as automotive applications, including an e-motor busbar sensor, an e-motor small case series, clip-on sensors for heat pumps, and a sensor for high voltages.

TDK Corporation (TSE:6762) announces the HVC50, a high-voltage DC contactor designed for connecting or disconnecting lithium-ion batteries with up to 1500 V in traction applications, energy storage systems (ESS), and megawatt charging systems (MCS). With this component, TDK enables its customers to drive the green transformation towards an all-electric society and reduce carbon footprint.

In a single event, the HVC50 can disconnect DC voltages of up to 1500 V and DC currents of up to 1000 A in less than 30 ms. Continuously, it can carry up to 750 A. Weighing 1.7 kg and measuring 97.8 x 140 x 94.2 mm, this component is designed for the demanding requirements of industrial applications and commercial vehicles, combining reliability, safety, and easy integration.

The HVC50 features a ceramic arc chamber with a gas-filled design, ensuring rapid and safe current disconnection even under extreme conditions. Its integrated mirror contact, compliant with IEC 60947-4-1, enhances operational safety by providing precise switching feedback. Thanks to the bidirectional capability of the contactor, currents can flow both ways seamlessly, making it exceptionally versatile. A dual-coil design for operating voltages of 12 or 24 V ensures energy-efficient operation. The making power is 50 W, whereas the steady-state power is just 6 W, because after some 200 ms, one of the two coils can be switched off.

Certified to CE, UKCA, and UL standards, the HVC50 contactor aligns with global safety and performance benchmarks, supporting its use in various regions, including Europe, the US, and Asia. By addressing the growing demand for efficient and reliable power in ESS and MCS, the HVC50 is poised to accelerate the adoption of sustainable energy solutions and high-capacity charging infrastructures worldwide.
 

• A photo-spintronic conversion element capable of responding at ultra-high speeds of 20 picoseconds using light with 800 nm wavelengths, 10X faster than conventional semiconductor-based photo detectors 

• Concepted and developed by TDK, the magnetic device can detect both near-infrared and visible light

• Successfully demonstrated operation in collaboration with Nihon University in Japan, known for fundamental physics research 

• It can be applied to photoelectronic conversion technology, which is expected to improve data processing speed and reduce power consumption, both critical for further AI evolution 

TDK Corporation (TSE:6762) announces that it has developed the world’s first* “Spin Photo Detector,” a photo-spintronic conversion element combining optical, electronic, and magnetic elements that can respond at an ultra-high speed of 20 picoseconds (20 × 10⁻¹² s) using light with a wavelength of 800 nm [1] – more than 10X faster than conventional semiconductor-based photo detectors. This new device is expected to be a key driver for implementing photoelectric conversion technology that boosts data transmission and data processing speed, particularly in AI applications, while simultaneously reducing power consumption. 

Transferring mass amounts of data at higher speeds and with lower power consumption is an inevitable need as AI evolves. To process data and make calculations, data is currently transferred between CPU/GPU chips as well as from and to memory by electrical signals. Therefore, there is an increasing need for optical communication and optical interconnects, which offer high speeds that do not decrease with interconnect distance. Photoelectronic conversion technology is also gaining global interest as a very compact fusion of both optical and electronic elements. 

To address these challenges, TDK adapted its magnetic tunnel junction (MTJ) technology, which is currently used in billions of HDD heads, for photonics. One of the major advantages of this technology is that it does not require crystal growth using a single crystal substrate, and the device can be formed regardless of the substrate material. Comparatively, conventional semiconductor-based photo detectors have physical limitations at shorter wavelengths. Because the Spin Photo Detector has a completely different operating principle and uses an electron heating phenomenon, it can operate at ultra-high speeds even when the wavelength is shortened [1]. In addition, the operating wavelength range is wide, and it has been confirmed that it can operate from visible light to near-infrared light. TDK has successfully demonstrated the Spin Photo Detector with Nihon University in Japan, a research pioneer for the measurement of ultrafast phenomena of magnetic material.  

Additionally, with the ability to detect visible light at high speeds, the spin photo detector will be useful in applications projected for future growth, such as devices for AR/VR smart glasses ([2], [3]) and high-speed image sensors. While conventional semiconductor photo-sensing devices have weak cosmic-ray resistance, MTJ elements are also known for their strong cosmic-ray resistance and are expected to be used as light-detecting elements in aerospace applications. In the future, based on these results, TDK will improve the perfection of the high-speed light detection element to further pursue its usefulness. 

*Source: TDK, as of April 2025

TDK Corporation (TSE:6762) announces that its subsidiary Tronics Microsystems will exhibit at booth #2569 at the Offshore Technology Conference 2025 from May 5-8, 2025. The event will take place at NRG Park in Houston, Texas, and will feature a wide range of innovative solutions for the future of offshore energy.

Tronics will showcase its high-performance MEMS inertial sensors and spotlight a high-temperature MEMS accelerometer for inclination measurement in directional drilling applications. Leveraging a strong track record in serving demanding aerospace and railway markets, Tronics will demonstrate how its industry-unique closed-loop sensor’s architecture paves the way to a new generation of drilling guidance tools operating under high temperature, vibrations, and shock conditions.

Attendees can also look forward to a live demo of a miniature north-seeking MEMS gyroscope enabling precise azimuth measurement in downhole survey tools

• New 100 V product for automotive applications with 10 μF capacitance in 3225 case size (achieving large capacitance)
• Contributing to the reduction of component count and the miniaturization of sets
• Qualified based on AEC-Q200 

TDK Corporation (TSE: 6762) has expanded its CGA series for automotive multilayer ceramic capacitors (MLCCs) to 10 µF at 100 V in 3225 size (3.2 x 2.5 x 2.5 mm – L x W x H), with X7R characteristics (Class Ⅱ dielectric). This is the industry’s highest capacitance* for a 100-V rated product in 3225 size and this temperature characteristic. Mass production of the product series began in April 2025.

While power consumption has increased and high-current systems have become more widespread in recent years with the increasing sophistication of ECUs, there is also demand for lighter vehicles (with lighter wiring harnesses), and the use of 48 V battery systems is becoming increasingly widespread. With this, there has been an increasing demand for high-capacity 100-V products, such as smoothing and decoupling capacitors used in power lines. 

CGA series 100-V products achieve twice the capacity of conventional products of the same size thanks to optimized material selection and product design. This new product makes it possible to halve the number of MLCCs used and the mounting area, contributing to the reduction of component count and miniaturization of sets. TDK will further expand its lineup to meet the needs of customers. 

*Source: TDK, as of April 2025