TDK Corporation (TSE:6762) announces that TDK will start manufacturing advanced sensors for various Apple products in the US. Built on a partnership spanning more than 30 years with Apple, this initiative will allow both companies to reinforce their advanced sensors manufacturing capabilities via Japan–U.S. collaboration and, by producing at U.S. facilities, contribute to a more reliable sensor supply chain. In the context of Apple’s current American Manufacturing Program initiative, this is the first time a Japanese company will produce components for Apple in the US. 

TDK has been collaborating with Apple not only on the development of next-generation sensors to enhance mobile functionality, but also on many other devices such as electronic components and rechargeable batteries.  

“TDK is a long-time partner and we’re excited they’ve joined our American Manufacturing Program,” said Sabih Khan, Apple’s COO. “Apple is committed to working with suppliers — like TDK — to manufacture even more in the US, and this initiative is another powerful example of how much we can achieve together when we invest in advanced American manufacturing.” 

Regarding the mutual collaboration, TDK President and CEO Noboru Saito commented: “Based on the decade-long relationship with Apple, when Apple asked what more we could do in the United States beyond our existing relationship, we TDK saw that as an opportunity to grow our relationship even more, and in new ways. We are very proud to be working with Apple to accelerate US manufacturing. We share their commitment to do more in the US, and our teams are working side-by-side with theirs in the US.”  
 

TDK Corporation (TSE: 6762) has introduced the MT40 series of ThermoFuse varistors (ordering code B72240M), a new generation of surge protection components (SPC) that combine a compact design with advanced safety features. Thanks to their patented overmolding technology and integrated thermal disconnecting system, these SPCs provide robust protection up to 50 kA while minimizing size (38.0 x 15.2 x 40.9 mm; L x W x H). Consequently, the MT40 series is commonly used in inverters, industrial power supplies, outdoor lighting, telecommunications systems, and surge protection devices (SPDs).

Designed for extreme electrical conditions, the MT40 series has a peak surge current capability of up to 50 kA (8/20 μs pulse) and a short-circuit current rating of up to 200 kA. The series is recognized as a UL 1449 Type 1CA component assembly, designed for use in applications with AC voltages ranging from 150 V to 550 V and DC voltages spanning from 200 V to 750 V. Additional features, such as a galvanically insulated normally open micro-switch for remote monitoring and an optional visual indicator, enhance system integration and operational safety. These MT40 components operate in temperatures ranging from -40 °C to +85 °C.

Supporting sustainable design practices and aligning with TDK’s commitment to environmental responsibility, the MT40 series is encapsulated in a flame-retardant epoxy coating. Its RoHS compliance and lead-free materials underscore its eco-conscious profile while ensuring high reliability under demanding conditions. By combining innovation, safety, and sustainability, MT40 ThermoFuse varistors offer system designers a compact, future-proof solution for next-generation industrial and communication systems.

• TDK Showcases solutions for multiple applications including automotive, energy systems, solid-state transformers, optical solutions, data center, robotics and more
• TDK will be at booth #1419, March 23-25, 2026, in San Antonio, TX

TDK Corporation (TSE:6762) announces its participation at the 2026 Applied Power Electronics Conference (APEC) highlighting solutions for a broad range of applications on March 23-25, 2026, at Henry B. Gonzalez Convention Center in San Antonio, Texas. TDK Corporation of America and TDK-Lambda Americas will be located at booth #1419. 

TDK will highlight solutions shaping current and future power electronics technology.  

Technology highlights include:

Data Center Eco-System: TDK delivers power solutions across every layer of the data center infrastructure, from Optical Solutions, Uninterruptible Power Supply and Point-of-Load to Bus Converters and Power Supply Units. TDK products critical to keeping data center infrastructure efficient and reliable include varistors, ceramic capacitors, power line chokes, high-density power management µPOL, transformers for LAN, surge arrestors, NTC chip varistors, and power inductors and more to support the complex needs for data centers. 

Industrial & Energy: TDK offers high-performance, leading-edge solutions designed for demanding industrial applications such as EV fast charging, robotics and smart energy. Among the products that TDK offers are metalized polypropylene capacitors, EMI suppression capacitors, DC-DC converters, DIN rail power supplies to our block varistors, ultra-high voltage ceramic capacitors, thermistors and much more. 

Automotive: High-performance ADAS and xEV systems for automotive applications with components for telematics, battery management, onboard chargers, and more. For ADAS, featured products include inductors, ceramic chip capacitors, µPOL, chip-embedded DC-to-DC power modules (POL), wireless power transfer solutions, and more. For xEV, featured products include disk varistors, power and film capacitors, thermistors, chip beads, and common mode chokes.  

Power Solutions: Advanced AC-DC power supplies and DC-DC converters for innovative industrial, medical, and embedded applications. Products include the HWS3000G / GT, compact 3000W industrial programmable power supply offers Constant Voltage (CV) and Constant Current (CC) operation with single or three-phase inputs. DUSH960-1248 is a DC-UPS designed for DIN rail mount applications and features a wide programmable input and output voltage range and supports external battery capacities of up to 1000Ah. 

Programmable DC/AC Power Supplies: Reliable, high-efficiency, feature-rich programmable DC/AC power sources for leading-edge Industrial and Test & Measurement applications. The GENESYSTM DC Series (750W-15kW) provides general-purpose DC power while the GENESYSTM DC Series DC Series (1kW – 22.5kW) and Rack DC Power Systems (30kW-90kW) showcase advanced features and digital interfaces. These along with the GENESYSTM AC Series (2kVA-45kVA) which delivers high performance AC power for modern demanding test environments.   

Additional Technologies: Also highlighted at APEC will be the new major expansion of the TDK µPOL family of ultra‑compact, non‑isolated DC‑DC power modules for optical modules in AI edge systems and other space‑constrained designs.

TDK will also feature a diverse, wide range of wireless power transfer products to support different applications: low-output/medium-output for smartphones and laptops, higher output wireless feeding for industrial equipment and EVs (electric vehicles), and ultra-compact, thin-profile systems for wearable and/or other devices. 

Exhibitor Presentation: Technologies Powering the Shift to Solid-State Transformers: How TDK Technologies Enable Transition, presented by our expert Anirban Roy, Senior Manager, Field Applications Engineering. 

This informative exhibitor presentation at APEC 2026 will explore how TDK component technologies support SST design at both the component and system level with solutions that are space saving, improving performance, and using TDK’s materials expertise.  

Date: Tuesday, March 24 at 2:15pm in Expo Theater No. 3, Henry B. Gonzalez Convention Center

 

• TDK establishes Asia-Pacific Regional Headquarters (APAC RHQ) in India, effective 1 April 2026
• APAC RHQ will be operated by TDK Asia-Pacific Pvt. Ltd., a new legal entity to be established in India, and TDK Singapore Pte. Ltd., forming a dual-city administrative structure
• The RHQ is part of ‘TDK Transformation’, the company's Long-term Vision

TDK Corporation (TSE:6762) announces the establishment of its Asia-Pacific Regional Headquarters (APAC RHQ) in Bengaluru, India—the company’s fifth regional headquarters alongside Japan, Europe, the Americas, and China. The new legal entity, TDK Asia-Pacific Pvt. Ltd., together with TDK Singapore Pte. Ltd., will govern more than 20 TDK entities across India, Southeast Asia and Oceania—representing nearly 17 percent of TDK’s 105,000 team members. Effective 1 April 2026, the APAC RHQ will operate from a dual-city administrative structure: Bengaluru, India, and Singapore, together the epicenter of one of the world’s most consequential economic corridors and drive ‘TDK Transformation’.

Asia-Pacific is the growth market of this century. Home to nearly 40 percent of the world’s population, the region is projected by the IMF to grow at 4.5 percent in 2025, contributing roughly 60 percent of all incremental world output—even as global growth holds at a modest 3.2 percent. Within it, India stands decisively apart: at 6.6 percent GDP growth for FY2025/26 (IMF), the fastest-growing major economy on earth for the third consecutive year, and now the world’s fourth largest after surpassing Japan in 2025. For TDK, this is familiar terrain approached with new ambition. The company has operated in India for several decades, through its two principal business entities—Electronics Components Business Company (ECBC) and Energy Solutions Business Company (ESBC)—and their subsidiaries, with production facilities in West Bengal, Maharashtra, and Haryana. Today, TDK in India employs over 5,000 people.

"With the establishment of the Asia-Pacific RHQ, we are not simply expanding our footprint—we are strengthening the foundation for the future”, said Vaidyanathan Ramasarma, General Manager, APAC RHQ – TDK Corporation. “This region holds immense potential in technology, talent, and market development. Our mission is to unlock that potential responsibly, collaboratively, and strategically.”

The dual-city administrative structure will balance growth and governance equally in a region that demands both. Bengaluru anchors the growth agenda—India’s technology capital with one of the world’s deepest talent ecosystems in engineering, and foundational research, positions TDK to build new categories, not merely optimize existing ones. The APAC RHQ will invest in emerging technology domains, leveraging India’s tradition of frugal engineering and favorable unit economics for a growing global marketplace. Singapore anchors governance, compliance, and supply chain—a trusted, neutral fulcrum for a region of extraordinary complexity. Together, the two cities form a strategic dyad: one looking inward at the intricacies of regional operations, the other at the horizon of what is possible.

The APAC RHQ will strengthen market intelligence, government relations, and supply chain resilience across the region while driving internal efficiencies, workforce skilling, and disciplined process governance—the less visible but indispensable work of building a business that lasts. In particular, APAC RHQ will play a critical role in building TDK’s global R&D network. India’s scientific talent, its appetite for foundational research, and its unique ability to apply deep knowledge to real‑world constraints make it an indispensable part of our global R&D vision. The government of India’s urgency and appetite for foreign direct investment, its improving ease of doing business, and its ambitious national technology initiatives create conditions that are, for a company like TDK, genuinely rare.

For the past two years, a quiet but purposeful effort has been underway—building the relationships, the institutional trust, and the operational foundations needed for success. TDK’s nascent APAC team has been forging partnerships across academia, government, and industry in India, establishing the connective tissue of a long-term commitment. 

Through this APAC RHQ, TDK will strengthen its contributions to social transformation from India and Asia‑Pacific, while also accelerating our own transformation.
 

• TDK is represented from March 10 to 12 in Nuremberg, Germany, at booth 505 in hall 1
• Technologies ranging from sensor solutions, power supplies, and embedded motor controllers to flash storage solutions and microphones

TDK Corporation (TSE 6762) announces its participation in embedded world 2026, held from March 10 to 12 in Nuremberg, Germany. At booth 505 in hall 1, TDK will showcase a wide range of embedded solutions designed to meet evolving application demands. Visitors can engage directly with TDK experts to learn more about current technologies and system-level approaches. 

Technology highlights include:

Sensor solutions: Sensing solutions for a variety of applications across IoT, Automotive, wearables, hearables, AR/VR, gaming, smart home, and accessibility technology.

• 2D/3D Hall-effect position sensors:
  Enable precise position detection of valves, flaps, and actuators within the automotive thermal management system. They are robust against magnetic stray fields and provide accurate position information even in harsh automotive environments.
• Temperature and pressure sensors:
  Provide accurate temperature and pressure measurement directly in fluid circuits such as oil, coolant, and refrigerant lines. Designed for harsh automotive environments, these sensors combine fast response times, robust signal stability, and easy integration to support efficient and reliable thermal management.
• Digital MEMS microphones:
  Showcasing audio capture, acoustic activity detection, and spoken keyword detection.
• TMR & MEMS sensor fusion: 
  Tracking everything every time, an absolute orientation detection for accurate heading and navigation, using on-chip system-level sensor fusion of 6-axis IMU (Inertial Measurement Unit) and 3-axis magnetometer.
• Ultrasonic Time-of-Flight sensor in iSee One smart glass:
  Thanks to its obstacle detection capabilities and ultra-low power consumption, the ultrasonic ToF enhances accessibility for individuals with visual impairments in an ergonomic design of a smart glass.

Embedded motor controllers: Fully integrated motor controllers for the drive of small DC motors, e.g., in automotive thermal management applications such as pumps, valves, grille shutters, or fans.

• Embedded gate driver & motor control ICs:
  Support efficient control of BLDC motors driving pumps and actuators in thermal management applications. Integrated control and communication functions enable compact system design and reliable motor operation.

Power supply solutions: Advanced AC-DC power supplies and DC-DC converters for cutting-edge industrial, medical, and embedded applications.

• RGC series: 300 W rated ruggedized non-isolated DC-DC buck-boost converters with an input voltage of 9 V to 53 V.
• RGA series: 250 W rated ruggedized non-isolated DC-DC buck converters with an input voltage of 9 V to 40 V or 9 to 53 V
• CCG series: 6 W and 10 W rated DC-DC converters, suitable for through-hole or surface-mount placement.
• i7A series: non-isolated DC-DC buck converters with the industry-standard 1/16th brick footprint.

Flash storage solutions: Solid State Drives (SSDs) offering exceptional data reliability are ideal for applications like industrial equipment and edge computing, where stable operation is crucial.

• Solid State Drives (SSDs) featuring GBDriver series: moderately high-speed access and stable operation while securing data reliability.
• DRAM-less SSDs with a power backup circuit: minimizing data errors, ideal solution for industrial embedded systems.

These flash‑storage technologies are already being integrated into European railway infrastructure and will be showcased at embedded world together with their applications. The demonstration is presented in collaboration with IHI Corporation and features the “3D Laser Radar Level Crossing Obstacle Detection System”.