TDK expands inline structure and low-resistance type MEGACAP with metal frame for automotive

• Automotive-grade inline structure MEGACAP, qualified based on automotive standard AEC-Q200 
• Low resistance achieved by optimizing metal frame materials
• Lineup includes 99 nF/1000 V with Class 1 and 47 μF/100 V with Class 2 dielectric

TDK Corporation (TSE:6762) has extended the automotive-grade CA series of MEGACAP with a metal frame. Mass production of the product series began in September 2024.

In recent years, there has been significant progress in the development of automobiles with electric powertrains, such as hybrid- (HEVs) and battery-electric vehicles (BEVs), and of highly efficient charging technologies. Both are helping to reduce greenhouse gas emissions. In such applications, the power consumption of various subsystems including inverters, onboard chargers (OBCs), and wireless power transfer (WPT) systems is increasing, and MLCCs must handle high currents and have large capacitance.

To meet these needs, TDK developed the CA series, the largest MLCCs in the industry* (6.00 x 5.60 x 6.40 mm) with a metal frame and 3-line type structure. For these, TDK provides now an extensive lineup including 99 nF/1000 V with a Class 1 dielectric and 47 μF/100 V with a Class 2 dielectric.

To handle high currents, TDK has reduced the equivalent series resistance (ESR) compared to the previous products by optimizing the materials of the metal frame. To enable high capacitance, TDK has created the largest MLCCs in the industry with a 3-line type structure and metal frame. This helps reduce the number of components and miniaturize devices. TDK will further expand its lineup to meet the needs of customers.

*As of September 2024, according to TDK