TDK announces it won the IEC 1906 award

• Highly recognized for contributions to international standardization activities in electronics assembly technology (IEC/TC91)
• Led the establishment of IEC standards as the project leader for IEC standard revision in IEC/TC91
• Promoted international standardization activities for next-generation applications as co-convenor of IEC/TC91 WG3

TDK Corporation (TSE:6762) announces that TDK for the first time has won the IEC 1906 Award from the International Electrotechnical Commission (IEC), the organization responsible for establishing and revising international standards in the electrical and electronic technology fields. The IEC 1906 Award is presented to experts who have made significant contributions to standardization activities in electrical and electronic technology.

This award was granted in recognition of TDK’s significant contributions as the project leader for the revision of IEC 60068-2-83, “Solderability testing of electronic components for surface mounted devices (SMD) by the wetting balance method using solder paste” under the supervision of WG3 of IEC/TC91, the technical committee responsible for international standardization activities in electronics assembly technology within IEC. TDK actively led the project by coordinating discussions and opinions among experts from participating countries, and played a major role in establishing IEC standards originating from Japan, which was highly evaluated and led to the award. This revision will ensure the soldering quality of SMD and contribute to improving the reliability of electronic equipment.

"We are deeply honored to receive the IEC 1906 Award for the first time. TDK’s reliability technology for soldering for SMD has contributed to the international standardization of electronics assembly technology. We would like to express our sincere gratitude to all members of IEC/TC91 who have supported us in receiving this award,” said Hideyuki Nagai, award winner, Section-Head, Reliability Technology Section, Evaluation Department, Quality Assurance Group, Quality Assurance Headquarters, TDK Corporation.

As electronic devices continue to become smaller and more advanced, TDK has become the first Japanese component/module manufacturer to serve as co-convenor of WG3 within IEC/TC91, which is composed of global set manufacturers. Going forward, TDK will continue to lead the international standardization activities for advanced assembly technologies applicable to next-generation applications, contributing to the transformation of electronics assembly technology. 

Theme and Award

• Theme: Leading the development of an international standard as project leader for the revision of  IEC 60068-2-83 of IEC/TC91
• Award: IEC 1906 Award