TDK Corporation (TSE: 6762) presents the B82722V6*B040 series of new compact high-voltage, current-compensated ring-core double chokes. Designed primarily for rated DC voltages of up to 1250 V (630 V AC), these compact common-mode chokes (23 x 15.5 x 24 mm) effectively suppress EMI in next-generation applications. These include power converters, industrial motor drives, and switch-mode power supplies that often deploy SiC and GaN power semiconductors and feature elevated DC bus voltages, where insulation coordination and PCB space are critical.

The series covers nominal inductance values ranging from 3.3 mH to 22 mH, with rated currents between 0.85 A and 3.0 A at a rated ambient temperature of +70 °C. Multilayer solid insulation construction and testing with voltages of 3,750 V (line-to-line) ensure robust electrical isolation. Thanks to the special automated winding technique, these chokes feature high resonance frequency characteristics and a typical stray inductance of around 0.6%, helping to suppress symmetrical interference.

The epoxy coating of the ferrite core and the plastic header comply with UL 94 V-0. The design fulfills the latest IEC 60938-2 and IEC/UL 60939-3 safety requirements for EMI chokes and filters. Suitable for wave soldering and offered in a compact vertical design, the B82722V6*B040 series enables engineers to realize 1250 V DC high-voltage architectures without increasing the PCB footprint.

TDK Corporation (TSE:6762) has introduced the G series of surge protection components, comprising the G14 (ordering code: B72214G) and the G20 (B72220G). Integrating a metal oxide varistor (MOV) and a gas discharge tube (GDT) into a single hybrid design and connecting them in series leverages the strengths of both elements. This configuration reduces leakage current to virtually zero, extends the lifetime of the whole component, and provides superior surge protection compared to using either element separately in parallel. These new components are commonly used in power supplies, chargers, appliances, surge protection devices, and communication systems that demand both efficiency and reliability.

Innovation through series hybrid design:

• Zero standby leakage current: With the GDT isolating the MOV during normal operation, leakage currents are virtually eliminated, maximizing efficiency.

• Extended MOV lifetime: The MOV is only engaging when the GDT has fired, drastically reducing stress and aging.

• Reliable surge handling: When fired, the GDT quickly becomes low resistive and acts as the "first line of defense." Meanwhile, the MOV clamps residual voltages, absorbs remaining energy, and eliminates follow-current to prevent the GDT from reigniting.

• Compact integration: A single hybrid device simplifies design and reduces board space compared to discrete solutions.

The G series is available in two leaded versions: G14 and G20, which refer to MOV disk diameters of 14 mm and 20 mm, respectively. G14 models support AC operating voltages from 50 V to 680 V, while G20 versions extend this range to 750 V. The maximum surge current capability for a single pulse (8/20 µs) is 6,000 A (G14) and 10,000 A (G20), absorbing up to 200 J (G14) or 490 J (G20) of energy. Their operating temperature range is specified as -40 °C to +105 °C.

TDK Corporation (TSE:6762) has expanded its ultra-low clamping voltage TVS diode lineup with three new models in the SD0201 series, tailored for high-speed consumer electronics interfaces. These TVS diodes offer compact protection for USB Type-C, HDMI, DisplayPort, and Thunderbolt connections in smartphones, laptops, tablets, wearables, and networking devices.

Each component comes in a 0201 chip-scale package (CSP), measuring just 0.58 x 0.28 x 0.15 mm (L x W x H) for space-constrained designs. Having working voltages of ±1 V, ±2 V, and ±3.6 V, the new TVS diodes safeguard sensitive circuits from electrostatic discharge (ESD) and transient surges. This means they meet IEC 61000-4-2 standards with ESD discharge robustness up to ±15 kV and support surge current handling up to 7 A, depending on the variant. Their symmetrical design enables bidirectional protection and thus flexible PCB routing, while very low leakage currents and dynamic resistance as low as 0.16 Ω enhance application-level efficiency.

The individual components differ in their DC working voltage and parasitic capacitance: the SD0201SL-S1-ULC101 (ordering code B74121U1036M060) has a working voltage of ±3.6 V and a parasitic capacitance of 0.65 pF, the SD0201-S2-ULC105 (B74121U1020M060) of ±2 V and 0.7 pF, and the SD0201SL-S1-ULC104 (B74121U2010M060) of ±1 V and 0.15 pF. A LTspice model library for SEED simulations for TVS diodes is available for download.

TDK’s new ultra-low clamping voltage TVS diodes are engineered to meet the challenges in today and tomorrow’s consumer electronics, ensuring reliable performance and safeguarding sensitive electronic devices from damaging transients.

• New 100-V product for commercial applications with 1 μF capacitance in 1608 case size (achieving large capacitance)
• Contributes to the reduction of component count and the miniaturization of sets

TDK Corporation (TSE: 6762) has expanded its C series for commercial multilayer ceramic capacitors (MLCCs) to 1 µF at 100 V in the 1608 size (1.6 x 0.8 x 0.8 mm – L x W x H), with X7R characteristics. This is the industry’s highest capacitance* for a 100-V-rated product in this size and this temperature characteristic. Mass production of the product series began in June 2025.

In recent years, 48-V systems have become increasingly common for AI servers, energy storage systems, and a wide range of industrial equipment to improve system efficiency and reduce power loss. This has led to a growing demand for 100 V-rated MLCCs used as capacitors on power lines.

This new 100-V product of the C series achieves ten times the capacity of conventional products of the same size, thanks to optimized material selection and product design. Therefore, it makes it possible to reduce the number of MLCCs used and the mounting area, contributing to the reduction of component counts and miniaturization of sets. TDK will further expand its lineup to meet the needs of customers.

*Source: TDK, as of June 2025

• The smallest size in the industry* in the 0201 size
• Achieves high-frequency characteristics through proprietary patterning and sintering technologies
• Lineup of inductances with fine increments, taking advantage of the features of the multilayer method
• Wide temperature range of -55 °C to +125 °C

TDK Corporation (TSE: 6762) announces the expansion of the MUQ0201022HA series* of high-frequency inductors. The 0201 size (0.25 x 0.125 x 0.2 mm; L x W x T) are the smallest inductors of their kind in the industry with the same electrical characteristics as the existing MHQ0402PSA series, which is one size larger at 0402 (0.4 x 0.2 mm; L x W). The lineup covers an inductance from 0.6 nH to 3.6 nH. Mass production of these new components began in May 2025.

As mobile devices such as smartphones and wearable devices become increasingly sophisticated and compact, there is a growing need for small-sized, high-performance components. By applying its proprietary patterning and sintering technologies, TDK has achieved high-frequency characteristics equivalent to or better than existing products while reducing the component mounting area by around half. TDK will further expand its line to meet the needs of customers.

*Source: TDK, as of May 2025

• Compatible with currents as high as 8 A
• Saves space by reducing components and footprint
• Highly reliable for use in high-temperature environments like automotive and industrial applications

TDK Corporation (TSE: 6762) has expanded its MPZ1608-PH series of large-current multilayer chip beads for automotive and commercial power supply lines (1.6 x 0.8 x 0.6 mm – L x W x H). Mass production of the product series began in May 2025.

These 1608-size chip beads for power supply lines achieve a rated current of 8 A, the industry’s highest value*. Chip beads are used as noise suppression components in power and signal circuits. In a circuit with a current of 8 A or more, usually two or more chip beads must be used in parallel. This has the disadvantage that the current is not evenly distributed between the ferrite beads. TDK’s new product simplifies the circuit structure because fewer components are required compared to conventional methods, and it improves the quality of power circuits.

The MPZ1608-PH series of products halves the component footprint in comparison with circuits using two conventional 1608-sized chip beads. Moreover, the highly reliable components with a specified operating temperature of up to +125 °C are designed to be used in high-temperature environments like automotive and industrial equipment applications.

With TDK’s proprietary materials and structural designs adapted to market needs, the company is committed to expanding its lineup of high rated current products in the automotive, industrial equipment, and consumer equipment areas. These chip beads will serve as EMC components contributing to the enhancement of the quality of power circuits.

*Source: TDK, as of May 2025

TDK Corporation (TSE:6762) unveils the EPCOS EP9 series (ordering code: B82804E), which is more compact than the existing E10EM series of surface-mount transformers designed specifically for IGBT and FET gate driver circuits. Engineered for high performance in demanding e-mobility and industrial applications with 500 V system voltage, these components offer exceptional insulation, minimal coupling capacitance, and high thermal resilience. With this new series, TDK is driving the green transformation towards a more electric and sustainable future.

The EP9 series is built on a MnZn ferrite core with SMD L-pin construction, delivering a height of just 11 mm and a footprint of 13 x 11 mm. These transformers operate across a wide temperature range of −40 °C to +150 °C, ensuring durability under harsh conditions. With a coupling capacitance of only 2 pF, complying with the AEC-Q200 Rev. E standard, and creepage and clearance of at least 5 mm, these surface-mount components are generally used in automotive applications and other demanding environments.

The transformers support topologies such as half-bridge and push-pull converters with typical operational frequency of 100 to 400 kHz and turns ratios optimized for specific applications. These components are available in tape-and-reel packaging, ensuring ease of assembly for high-volume production environments.

A sample kit is available under order number B82804X1, containing six transformers of each version.