TDK Corporation (TSE:6762) presents its new EPCOS B3264xH series of double-sided metallized polypropylene film capacitors (MMKP). These components are designed to meet the demands of high-frequency applications with high pulse stress of up to 6,500 V/µs, where traditional solutions may fall short. They excel in resonant circuits, particularly the popular LLC topology. Due to their compact form factor and AEC-Q200 compliance, these components are generally used in onboard chargers (OBCs) and DC-DC converters in xEVs, as well as in uninterruptible power supplies (UPS), industrial switch-mode power supplies (SMPS), and electronic ballasts.

These capacitors offer a rated DC voltage range from 630 V to 2000 V and cover capacitance values from 2.2 µF up to 470 µF. They are engineered with a special dielectric system combining polypropylene and double-sided metallized PET film, delivering high pulse strength and exceptional current handling capabilities. Rated for continuous operation from -55 °C to +125 °C, the series ensures long-term reliability even under harsh environmental conditions.

The B3264xH capacitors stand out with their high insulation resistance, low dissipation factor, and robust self-healing properties, resulting in a service life of 200,000 hours at +85 °C and full rated voltage. These components are available in three lead spacing variants (10 mm, 15 mm, and 22.5 mm), enabling flexible integration into space-constrained circuit layouts.

By combining high performance with automotive-grade reliability, TDK’s B3264xH series helps designers optimize efficiency and longevity in advanced power electronics systems across both automotive and industrial sectors.

For the B3264xH, corresponding simulation models for various Spice versions and ANYSYS are available for download here.

• New 100-V product for commercial applications with 1 μF capacitance in 1608 case size (achieving large capacitance)
• Contributes to the reduction of component count and the miniaturization of sets

TDK Corporation (TSE: 6762) has expanded its C series for commercial multilayer ceramic capacitors (MLCCs) to 1 µF at 100 V in the 1608 size (1.6 x 0.8 x 0.8 mm – L x W x H), with X7R characteristics. This is the industry’s highest capacitance* for a 100-V-rated product in this size and this temperature characteristic. Mass production of the product series began in June 2025.

In recent years, 48-V systems have become increasingly common for AI servers, energy storage systems, and a wide range of industrial equipment to improve system efficiency and reduce power loss. This has led to a growing demand for 100 V-rated MLCCs used as capacitors on power lines.

This new 100-V product of the C series achieves ten times the capacity of conventional products of the same size, thanks to optimized material selection and product design. Therefore, it makes it possible to reduce the number of MLCCs used and the mounting area, contributing to the reduction of component counts and miniaturization of sets. TDK will further expand its lineup to meet the needs of customers.

*Source: TDK, as of June 2025

• The smallest size in the industry* in the 0201 size
• Achieves high-frequency characteristics through proprietary patterning and sintering technologies
• Lineup of inductances with fine increments, taking advantage of the features of the multilayer method
• Wide temperature range of -55 °C to +125 °C

TDK Corporation (TSE: 6762) announces the expansion of the MUQ0201022HA series* of high-frequency inductors. The 0201 size (0.25 x 0.125 x 0.2 mm; L x W x T) are the smallest inductors of their kind in the industry with the same electrical characteristics as the existing MHQ0402PSA series, which is one size larger at 0402 (0.4 x 0.2 mm; L x W). The lineup covers an inductance from 0.6 nH to 3.6 nH. Mass production of these new components began in May 2025.

As mobile devices such as smartphones and wearable devices become increasingly sophisticated and compact, there is a growing need for small-sized, high-performance components. By applying its proprietary patterning and sintering technologies, TDK has achieved high-frequency characteristics equivalent to or better than existing products while reducing the component mounting area by around half. TDK will further expand its line to meet the needs of customers.

*Source: TDK, as of May 2025

• Compatible with currents as high as 8 A
• Saves space by reducing components and footprint
• Highly reliable for use in high-temperature environments like automotive and industrial applications

TDK Corporation (TSE: 6762) has expanded its MPZ1608-PH series of large-current multilayer chip beads for automotive and commercial power supply lines (1.6 x 0.8 x 0.6 mm – L x W x H). Mass production of the product series began in May 2025.

These 1608-size chip beads for power supply lines achieve a rated current of 8 A, the industry’s highest value*. Chip beads are used as noise suppression components in power and signal circuits. In a circuit with a current of 8 A or more, usually two or more chip beads must be used in parallel. This has the disadvantage that the current is not evenly distributed between the ferrite beads. TDK’s new product simplifies the circuit structure because fewer components are required compared to conventional methods, and it improves the quality of power circuits.

The MPZ1608-PH series of products halves the component footprint in comparison with circuits using two conventional 1608-sized chip beads. Moreover, the highly reliable components with a specified operating temperature of up to +125 °C are designed to be used in high-temperature environments like automotive and industrial equipment applications.

With TDK’s proprietary materials and structural designs adapted to market needs, the company is committed to expanding its lineup of high rated current products in the automotive, industrial equipment, and consumer equipment areas. These chip beads will serve as EMC components contributing to the enhancement of the quality of power circuits.

*Source: TDK, as of May 2025

• Optimized construction leads to extraordinary power density in surprisingly small modules
• The new FS1606 in the series is the smallest solution in 6A, with full telemetry via an I2C interface, in a 3.3 mm x 3.3 mm x 1.35 mm size, with a wide operating range of -40 °C to 125 °C
• Easy access to full telemetry (voltage, current & temperature)
• Easily adopted in designs anchored by ASICs, SoCs, and FPGAs
• Showing FS1606 at APEC Conference – Advanced Power Management, Use case for Predictive Maintenance, Session#:  IS06.3. Atlanta, Georgia on March 18th 

TDK Corporation (TSE:6762) announces the new FS160* series of its microPOL (μPOL) power modules. The FS160* series of μPOL DC-DC converters all offer full telemetry, provide increased performance, and are remarkable for extraordinary power density in the smallest sizes now in mass production.

All FS160* microPOL modules measure a mere 3.3 mm wide by 3.3 mm deep by 1.35 mm high. Because of their size and extraordinary power density, every module in this series can be easily integrated into designs anchored by ASICs, SoCs, and all the most popular FPGAs. Full telemetry (voltage, current & temperature) is accessible via an I2C interface. The modules operate across a broad junction temperature range, from -40 °C to 125 °C. 

There are several versions each of the 3 A parts (the FS1603 series), 4 A parts (the FS1604 series), and 6 A parts (the FS1606 series). The FS line also includes models at 12A (the FS1412) and 25A-200A (the FS1525). The selection of DC-DC converter modules that range from 3 A to 200 A covers a broad range of needs and applications, including big data, machine learning, artificial intelligence (AI), 5G cells, the Internet of Things (IoT), and enterprise computing. 

The configuration of the module is itself innovative; the FS160* series modules integrate a high-performance controller, drivers, MOSFETs and logic core in carefully engineered packages, using TDK’s version of semiconductor embedded in substrate (SESUB). SESUB eliminates wire bonds & enhances thermal performance. 

TDK also integrates the module’s IC inductor and passives into a chip-embedded package to minimize parasitic inductance. This lowers interconnect and enhances the module’s efficiency. Minimizing resistance and inductance leads to fast response and accurate regulation with dynamic load currents. Boot and Vcc capacitors are also incorporated into the module. 

These and other design optimizations make it possible for the FS160* series converters to deliver an extraordinary 1 watt per cubic millimeter, in modules that are roughly half the size of other products in the same class. The FS160* series modules are so effective that they require no airflow whatsoever for up to 15W to 30 W in up to 100 °C ambient temperature. The end result of using TDK modules is a small solution size that requires less PCB board space and fewer board layers as well as fewer external components, resulting in lower system cost.

The modular approach makes designing with the FS160* a for either analog or digital design configuration for 0.6V to 5.0V outputs. TDK has created multiple design tools for designers to use, including tools specific to FPGAs from each of the major FPGA suppliers.

Evaluation boards are available, one each for modules at 3A, 4A, and 6A, (respectively the FS1603 series, FS1604 series, and FS1606 series). Additional design tools for FS160* series includes spice simulator designs on QSPICE^TM. Fast starter designs for schematic and PCB layout are now available with our partners at Ultra Librarian for free, https://www.ultralibrarian.com/partners/tdk

• Compatible with high currents of up to 1650 mA
• Ensures high impedance across a broad frequency range
• Suitable for high temperature environments; supports a wide operation range of -55 °C and +155 °C

TDK Corporation (TSE: 6762) announces the expansion of the ADL4532VK series (4.5 x 3.2 x 3.2 mm; L x W x T) of wire winding inductors for automotive power-over-coax (PoC). Mass production of these new components began in February 2025.

Advanced driver-assistance systems (ADAS) are designed to enhance vehicle safety by using automotive cameras and sensors that monitor the driving environment. These systems rely on multiple cameras, typically installed at the front, rear, and sides of the vehicle, to capture real-time imagery for safe and secure driving. In standard configurations, automotive cameras require two separate lines for power and signal transmission: a power line connected to the vehicle’s battery and a signal line connected to the electronic control unit (ECU). However, with PoC technology, a single coaxial cable can simultaneously carry both power and data, simplifying and reducing cabling. This can reduce the vehicle’s weight, which in turn can improve fuel efficiency and lower carbon emissions.

The PoC system requires a filter incorporating multiple inductors to effectively separate power from the data signal before processing. TDK’s new ADL4532VK series delivers high impedance across a broad frequency range from tens of megahertz (MHZ) to hundreds of megahertz by using proprietary materials and structural design innovations. This reduces the number of inductors used, saving space. It is compatible with high currents of up to 1650 mA and meets the needs for high functionality, including not only the latest automotive cameras but also the infrared cameras and display. Additionally, the inductor ensures high reliability with an upper operation temperature limit of +155 °C thanks to product design assuming use in high-temperature environments.

Looking ahead, TDK is committed to developing inductors for automotive PoC applications by pursuing optimized design by refining multilayer, wire-winding, and thin-film technologies to address market needs. TDK will expand its lineup of products to improve the quality of PoC transmission signals.

• Industry's smallest inductor for power circuits*
• Low-loss magnetic material for highly efficient power supply circuits
• High-precision internal electrode formation using thin-film technology

TDK Corporation (TSE:6762) announces the introduction of its new PLE856C Series (0.80 x 0.45 x 0.65 mm; L x W x T) of compact thin-film power inductors for wearable devices. Mass production of these new components began this month, in December 2024.

Increasing functionality and performance of wearable devices, such as wireless earbuds and smartwatches, has led to a higher number of components per system. However, the space in these devices remains limited, driving the demand for smaller electronic components. The PLE856C Series, featuring inductances from 470 nH to 1.5 µH, is the industry's smallest inductor used for power supply circuits in such devices, contributing to space-saving designs and lighter devices. In comparison to the conventional PLEA67B Series (1.0 x 0.6 x 0.8 mm; L x W x T), the new PLE856C Series boasts a 40% smaller mounted area and a 50% decrease in volume. The saturation currents are specified between 0.40 A and 0.72 A (typ.).

Despite their compact size, these products feature precisely formed coil conductor patterns acting as internal electrodes, achieved using TDK's proprietary thin-film technology. Moreover, the use of low-loss magnetic material helps reduce power losses and increase the efficiency of power supply circuits.

Moving forward, TDK will promote the development of high-performance inductors that are even smaller and better designed for wearable devices, capitalizing on the advantages of the thin-film technology and aiming to expand its power inductors in response to market needs.

*As of December 2024, according to TDK