Norvento Enerxía needed more than just a suitable DC link capacitor to fit a hermetically sealed 8-megawatt inverter into a standard 20-foot container. The developers at the Spanish renewable energy specialist needed certainty that the design would operate stably under all operating conditions. TDK provided both, offering the ModCap UHP as the basis for the DC link and performing detailed simulations. This saved several months of development time.

"The primary design objective for the nXL was full encapsulation, which means there is no air exchange between the inside of the converter and the environment." This is how Ángel Mayor, the head of innovation at Norvento and the chief developer of the converter, describes the key challenge. This type of encapsulation makes sense because central inverters in photovoltaic systems and large battery storage facilities often operate in challenging environments. These include areas with high humidity, salty air, and metal particles, such as mining sites, as well as regions with active volcanism. Additionally, encapsulated systems require minimal maintenance since filter mats do not need to be replaced regularly. Liquid cooling should ensure thermal management.

However, this design objective has a significant impact on key components, such as the DC link capacitor. TDK provided more than just a suitable component; they also provided technical expertise and service.

Figure 1:

The nXL converter from Norvento Enerxía for 7 to 8 MW, including transformer and medium-voltage switchgear

Challenges in the development process

The DC link solution for the nXL had to meet three key requirements:

• Low equivalent series resistance (ESR) across the frequency range to minimize losses,
• low equivalent series inductance (ESL) to prevent excessive voltage overshoot when the semiconductors are turned off, which will become even more important when fast-switching SiC MOSFET modules are used in the future, and
• high operating temperatures.

Figure 2:

TDK's ModCap UHP can deliver full output power up to +105 °C.

“In addition, modularity was another important factor for us, as we needed a solution that could be flexibly adapted to different configurations,” adds Mayor. That’s why ModCap from TDK, a long-standing partner of Norvento, was the obvious choice.

However, film capacitors with polypropylene as the dielectric must be derated in terms of output power at temperatures above +85 °C. This also applies to previous ModCap variants. This is why TDK developed the ModCap UHP. It uses a new type of dielectric called EPN (ethylene propylene norbornene), which enables the component to deliver full power at temperatures up to +105 °C [1]. EPN is a blend of polypropylene (PP), an established, easily processed dielectric, and cyclic olefin copolymer (COC), a dielectric with greater heat resistance. However, COC alone cannot be formed into a film. Therefore, it is blended with polypropylene. The resulting material can be processed like polypropylene while offering the high-temperature resistance of COC.

Nevertheless, questions remained. How is the current distributed among the individual ModCaps on the busbar at higher frequencies? How is the current distributed among the capacitor windings within the component at higher frequencies? How do losses develop over frequency? TDK's simulation expertise helped Norvento.

Shorter time to market

“One of Norvento’s main concerns was how the current would be distributed among the 18 ModCaps—six per phase—that make up the DC link,” recalls Fernando Rodríguez of TDK’s Applications and Development Group in Málaga. Another concern was whether high-frequency oscillations would have a negative effect, such as resonances related to the dimensions of the busbar. To address these concerns, TDK proposed characterizing the entire DC link digitally and using finite element analysis (FEA) to simulate the current distribution. The result: The busbar design, when combined with ModCap UHP capacitors, remains within specifications across the entire operating frequency range of the application. 

The main advantage of using FEA is that the results are available before any prototype is built. This largely eliminates the need for lengthy durability and stress tests. "In this case, the simulation saved an estimated two to three months of development and testing time," says Rodríguez, summarizing the approach.

"By running simulations early in the project, we optimized the power distribution in the DC link and ruled out potential resonances in advance. This shortened the time to market for Norvento and ensured that the design was sound from the beginning.”

Fernando Rodríguez, Applications and Development Group at TDK

Support: the key to success

Only a team of experienced specialists could fit a hermetically sealed 7 to 8 MW converter, including a transformer and medium-voltage switchgear, into a standard 20-foot container. "The key to success," says Álvar Mayor, "was not only the right DC link capacitor, but also the technical support, especially during the simulations." The nXL can operate in grid-following mode or as a grid-forming system. This makes it ideal for microgrids or systems where grid stability is not guaranteed.

“The collaboration with TDK was excellent and always proactive. We learned a lot from each other during this project. The technical support, especially with the simulations, was key to our success.”

Álvar Mayor, Head of Innovation at Norvento and lead developer of the nXL

Outlook

For Norvento, the nXL is a turning point. With an unmatched power density and the ability to integrate 7 to 8 MW into a standard 20-foot container, the company can now compete with major international power electronics manufacturers. However, development is not yet fully complete. Right from the beginning, the nXL's architecture was designed for SiC MOSFET modules — an upgrade that will further challenge the requirements for the DC link. However, thanks to the comprehensive simulations carried out at TDK, this upgrade path has already been paved.

Achieving such a compact, reliable system would not have been possible without the right combination of components and partners at the right time. TDK's ModCap UHP, with its innovative high-temperature dielectric and patented high-frequency internal structure, and the accompanying FEA simulation service, demonstrate this synergy between component-level expertise and system understanding. Those facing similar challenges will find both at TDK.

References

[1] Power Capacitors: The New ModCap Likes It Hot, https://www.tdk-electronics.tdk.com/en/373562/tech-library/articles/applications-cases/applications-cases/modcap/3660166, TDK, retrieved March 16, 2026

TDK Corporation (TSE: 6762) presents the B82722V6*B040 series of new compact high-voltage, current-compensated ring-core double chokes. Designed primarily for rated DC voltages of up to 1250 V (630 V AC), these compact common-mode chokes (23 x 15.5 x 24 mm) effectively suppress EMI in next-generation applications. These include power converters, industrial motor drives, and switch-mode power supplies that often deploy SiC and GaN power semiconductors and feature elevated DC bus voltages, where insulation coordination and PCB space are critical.

The series covers nominal inductance values ranging from 3.3 mH to 22 mH, with rated currents between 0.85 A and 3.0 A at a rated ambient temperature of +70 °C. Multilayer solid insulation construction and testing with voltages of 3,750 V (line-to-line) ensure robust electrical isolation. Thanks to the special automated winding technique, these chokes feature high resonance frequency characteristics and a typical stray inductance of around 0.6%, helping to suppress symmetrical interference.

The epoxy coating of the ferrite core and the plastic header comply with UL 94 V-0. The design fulfills the latest IEC 60938-2 and IEC/UL 60939-3 safety requirements for EMI chokes and filters. Suitable for wave soldering and offered in a compact vertical design, the B82722V6*B040 series enables engineers to realize 1250 V DC high-voltage architectures without increasing the PCB footprint.

• The filters achieve industry-leading* noise attenuation in the high-frequency range exceeding 5 GHz
• A newly developed low-distortion ferrite material significantly reduces audio distortion by minimizing performance variations in the audio line of small consumer devices
• Reduces attenuation of audio signals with lower resistance than conventional products, achieving a wide dynamic range

TDK Corporation (TSE:6762) has announced its latest noise suppression filters of the MAF0603GWY series. These measure only 0.6 mm x 0.3 mm x 0.3 mm (L x W x H) for use in small consumer devices like smartphones and wearables. Mass production of the new product series is set to begin in April 2026.

Electromagnetic noise radiated from audio lines in smartphones, wearable devices, and the like interferes with the built-in antenna and can reduce the receiver sensitivity. The common countermeasure is chip beads. While effective at suppressing noise, they have the drawback of degrading the audio quality on the audio line, which users may find annoying.

The new MAF0603GWY series of noise suppression filters resolves this drawback by employing a newly developed, proprietary low-distortion ferrite material. It introduces just minimal change to audio-line characteristics and significantly reduces audio distortion, eliminating the sound-quality degradation that occurs when chip beads are used. It provides industry-leading high attenuation in the 5-GHz band (impedance up to 3220 Ω at 5 GHz), effectively suppressing noise. Compared with conventional products, it also features lower resistance to reduce attenuation of audio signals and realizes a wide dynamic range.

TDK will continue to contribute to the industry by offering a broad lineup of noise suppression filters and technical support that reconcile audio-quality preservation with electromagnetic-noise countermeasures for mobile and wearable devices with communication functions.

*    As of April 2026, according to TDK.

TDK Corporation (TSE:6762) announces that TDK will start manufacturing advanced sensors for various Apple products in the US. Built on a partnership spanning more than 30 years with Apple, this initiative will allow both companies to reinforce their advanced sensors manufacturing capabilities via Japan–U.S. collaboration and, by producing at U.S. facilities, contribute to a more reliable sensor supply chain. In the context of Apple’s current American Manufacturing Program initiative, this is the first time a Japanese company will produce components for Apple in the US. 

TDK has been collaborating with Apple not only on the development of next-generation sensors to enhance mobile functionality, but also on many other devices such as electronic components and rechargeable batteries.  

“TDK is a long-time partner and we’re excited they’ve joined our American Manufacturing Program,” said Sabih Khan, Apple’s COO. “Apple is committed to working with suppliers — like TDK — to manufacture even more in the US, and this initiative is another powerful example of how much we can achieve together when we invest in advanced American manufacturing.” 

Regarding the mutual collaboration, TDK President and CEO Noboru Saito commented: “Based on the decade-long relationship with Apple, when Apple asked what more we could do in the United States beyond our existing relationship, we TDK saw that as an opportunity to grow our relationship even more, and in new ways. We are very proud to be working with Apple to accelerate US manufacturing. We share their commitment to do more in the US, and our teams are working side-by-side with theirs in the US.”  
 

The recent hike in precious metal prices is putting commercial pressure on conventional multilayer piezo designs that use silver. In addition to increasing costs, silver is the primary cause of failure when moisture is present. By using copper instead of silver, TDK offers a compelling solution to both challenges.

As of early March 2026, the price of precious metals was near record highs. Silver has surged by more than 100% in the past six months [1] (Fig. 1a). In such a turbulent market, TDK’s patented High Active Stack (HAS) technology [2], which is copper-based, shields manufacturers from both relentless price escalation and supply-chain instability. This is because the price of copper has increased by just 29% in the last six months [3] (Fig. 1b). This makes the high-performance HAS technology more accessible and economically sustainable.

Additionally, silver-based electrodes come with a technical drawback: they are susceptible to moisture, also known as silver migration. This can lead to reduced endurance and potential short circuits in the components, compromising reliability in damp environments. Unlike silver electrodes, copper electrodes are inherently resistant to this effect, delivering greater durability and reliability. TDK’s third‑generation copper‑stack actuators demonstrate this advantage with an exceptional lifespan of over 100 million cycles at +85 °C at 85% relative humidity, energy‑controlled for nominal elongation. This performance is made possible by a patented copper‑etching process that significantly enhances both lifetime and structural robustness.

Broad applications across industries

For over 20 years, TDK’s HAS actuators have been an integral part of automotive fuel injection systems. But they are not limited to cars. They power nano-positioning systems in semiconductor production, ensuring accuracy in wafer handling and lithography processes. In medical applications, they support devices like ultrasound transducers and drug delivery systems, where precision and humidity resistance are non-negotiable.

The PowerHap series [4], for instance, extends to haptic feedback in consumer electronics, such as wearables and VR equipment, delivering crisp vibrations [5]. Valve controls in process engineering also benefit, managing liquids and gases with exceptional speed.

Furthermore, in AI infrastructure, enabling advanced optical solutions for high-speed, low-latency data transmission in data centers. This supports the massive computational demands of AI, offering humidity-resistant reliability and cost stability essential for scalable, efficient data center operations.

A partner ready to build your copper-based piezo

What truly sets TDK apart is its full in-house expertise. At the global piezo competence center in Deutschlandsberg, Austria, the company controls every step, from design and development to prototyping and high-volume manufacturing. This complete vertical integration ensures uncompromising quality, rapid innovation cycles, and the flexibility to tailor multilayer piezo solutions precisely to customer requirements. Whether adapting an existing actuator or engineering a completely new copper-based variant.

Ready to take the next step in transforming your application using piezo actuators with copper? Reach out to us.

Get in touch: piezo@tdk.com

References

[1] https://tradingeconomics.com/commodity/silver, retrieved March 18, 2026

[2] Piezo actuators for fuel injection systems: Most reliable and cost-efficient, https://www.tdk-electronics.tdk.com/en/373562/tech-library/articles/applications-cases/applications-cases/most-reliable-and-cost-efficient/1039300, July 11, 2014; retrieved March 3, 2026

[3] https://tradingeconomics.com/commodity/copper, retrieved March 18, 2026

[4] PowerHap Piezoelectric Actuators. Fast. Precise. Immersive. https://www.tdk-electronics.tdk.com/en/2124786/products/product-catalog/switching-heating-piezo-components-buzzers-microphones/powerhap, retrieved March 3, 2026

[5] PowerHap from TDK makes AR/VR experiences more immersive, https://www.tdk-electronics.tdk.com/en/373562/tech-library/articles/applications-cases/applications-cases/powerhap/3225734, March 12, 2024; retrieved March 3, 2026

Designing a portable defibrillator, the size of a lunchbox, requires solving an engineering paradox: the smaller the high-voltage capacitor, the more energy it leaks over time. For a device that must deliver a decisive shock after months on standby, such energy loss is unacceptable. As the first capacitor prototypes from different manufacturers showed high leakage current, the question became: could this challenge even be solved?

When engineers at Corscience set out to create the world's smallest automatic external defibrillator (AED), they faced a fundamental engineering paradox: they needed a high-voltage capacitor that was both incredibly compact and remarkably reliable. The challenge would require more than off-the-shelf components; it demanded innovation at the material level. The specifications set by the defibrillation experts from Erlangen were demanding: stable capacitance at 2 kV, delivering the required therapeutic level of stored energy through a biphasic truncated exponential discharge.

But size wasn't the only constraint. It’s crucial for a defibrillator that the capacitor maintains its charge over extended periods. Any significant leakage current could mean the difference between a functioning defibrillator and a failed rescue attempt. "It is literally vital that the AED is still able to provide the energy for defibrillation after months in standby at different ambient temperatures, like in your car," explains Manuel Seufert, Team Lead Defibrillation, Shock & Analysis at Corscience.

"It is literally vital that the AED is still able to provide the energy for defibrillation after months in standby at different ambient temperatures, like in your car," explains Manuel Seufert, Team Lead Defibrillation, Shock & Analysis at Corscience.

An automated high-voltage capacitor test bench was used for a comprehensive evaluation of all relevant capacitor parameters

This requirement created a classic engineering trade-off for TDK: thinner dielectric foils enable smaller capacitor dimensions, but they also increase leakage current. Aluminum electrolytic capacitors require series connections with balancing resistors that continuously discharge the stored energy – unacceptable for this compact AED. Ceramic capacitors face similar limitations. Only film capacitors could meet the demanding voltage and reliability requirements and were the clear choice over ceramic or electrolytic alternatives. To verify this, Corscience developed an automated high-voltage capacitor test bench. The system enables comprehensive evaluation of all relevant capacitor parameters across large sample sizes and under varying temperature conditions. However, initial samples from several manufacturers either exhibited excessive leakage current or exceeded the allowable dimensions. As a result, moving forward required close and in-depth collaboration.

TDK and Corscience sat down to dissect the requirements in detail, combining TDK's expertise in capacitor manufacturing with Corscience's extensive experience in defibrillation technology. The second iteration samples were significantly better than comparison types from other manufacturers. "Our collaboration has been a remarkable fusion of innovation and purpose," notes Anderson Estancovich, the product marketing manager responsible at TDK. "Together, we've not only engineered the smallest AED on the market but also redefined what's possible in medical technology. This makes critical care more accessible, discreet, and patient-friendly than ever before." The partnership extended beyond just component development. Corscience supported the implementation of a dedicated test bench for future high-voltage capacitors at TDK, enabling real-world simulation and validation of long-term stability.

"Together, we've not only engineered the smallest AED on the market but also redefined what's possible in medical technology. This makes critical care more accessible, discreet, and patient-friendly than ever before," notes Anderson Estancovich, the responsible product marketing manager at TDK.

"TDK is a manufacturer with a 'We can do it' mentality," reflects Maciej Postek, Corscience Project Team Lead.

"TDK is a manufacturer with a 'We can do it' mentality," reflects Maciej Postek, Corscience Project Team Lead. "By combining TDK's expertise in capacitor manufacturing with our knowledge of defibrillation, we were able to develop the perfect capacitor for miniaturized AEDs." This custom film capacitor combines high energy density and exceptional reliability in an ultra-compact design. It demonstrates what’s possible when two experts come together to create innovative solutions for future generations of highly sophisticated medical devices.

TDK Corporation (TSE: 6762) has introduced the MT40 series of ThermoFuse varistors (ordering code B72240M), a new generation of surge protection components (SPC) that combine a compact design with advanced safety features. Thanks to their patented overmolding technology and integrated thermal disconnecting system, these SPCs provide robust protection up to 50 kA while minimizing size (38.0 x 15.2 x 40.9 mm; L x W x H). Consequently, the MT40 series is commonly used in inverters, industrial power supplies, outdoor lighting, telecommunications systems, and surge protection devices (SPDs).

Designed for extreme electrical conditions, the MT40 series has a peak surge current capability of up to 50 kA (8/20 μs pulse) and a short-circuit current rating of up to 200 kA. The series is recognized as a UL 1449 Type 1CA component assembly, designed for use in applications with AC voltages ranging from 150 V to 550 V and DC voltages spanning from 200 V to 750 V. Additional features, such as a galvanically insulated normally open micro-switch for remote monitoring and an optional visual indicator, enhance system integration and operational safety. These MT40 components operate in temperatures ranging from -40 °C to +85 °C.

Supporting sustainable design practices and aligning with TDK’s commitment to environmental responsibility, the MT40 series is encapsulated in a flame-retardant epoxy coating. Its RoHS compliance and lead-free materials underscore its eco-conscious profile while ensuring high reliability under demanding conditions. By combining innovation, safety, and sustainability, MT40 ThermoFuse varistors offer system designers a compact, future-proof solution for next-generation industrial and communication systems.

• TDK Showcases solutions for multiple applications including automotive, energy systems, solid-state transformers, optical solutions, data center, robotics and more
• TDK will be at booth #1419, March 23-25, 2026, in San Antonio, TX

TDK Corporation (TSE:6762) announces its participation at the 2026 Applied Power Electronics Conference (APEC) highlighting solutions for a broad range of applications on March 23-25, 2026, at Henry B. Gonzalez Convention Center in San Antonio, Texas. TDK Corporation of America and TDK-Lambda Americas will be located at booth #1419. 

TDK will highlight solutions shaping current and future power electronics technology.  

Technology highlights include:

Data Center Eco-System: TDK delivers power solutions across every layer of the data center infrastructure, from Optical Solutions, Uninterruptible Power Supply and Point-of-Load to Bus Converters and Power Supply Units. TDK products critical to keeping data center infrastructure efficient and reliable include varistors, ceramic capacitors, power line chokes, high-density power management µPOL, transformers for LAN, surge arrestors, NTC chip varistors, and power inductors and more to support the complex needs for data centers. 

Industrial & Energy: TDK offers high-performance, leading-edge solutions designed for demanding industrial applications such as EV fast charging, robotics and smart energy. Among the products that TDK offers are metalized polypropylene capacitors, EMI suppression capacitors, DC-DC converters, DIN rail power supplies to our block varistors, ultra-high voltage ceramic capacitors, thermistors and much more. 

Automotive: High-performance ADAS and xEV systems for automotive applications with components for telematics, battery management, onboard chargers, and more. For ADAS, featured products include inductors, ceramic chip capacitors, µPOL, chip-embedded DC-to-DC power modules (POL), wireless power transfer solutions, and more. For xEV, featured products include disk varistors, power and film capacitors, thermistors, chip beads, and common mode chokes.  

Power Solutions: Advanced AC-DC power supplies and DC-DC converters for innovative industrial, medical, and embedded applications. Products include the HWS3000G / GT, compact 3000W industrial programmable power supply offers Constant Voltage (CV) and Constant Current (CC) operation with single or three-phase inputs. DUSH960-1248 is a DC-UPS designed for DIN rail mount applications and features a wide programmable input and output voltage range and supports external battery capacities of up to 1000Ah. 

Programmable DC/AC Power Supplies: Reliable, high-efficiency, feature-rich programmable DC/AC power sources for leading-edge Industrial and Test & Measurement applications. The GENESYSTM DC Series (750W-15kW) provides general-purpose DC power while the GENESYSTM DC Series DC Series (1kW – 22.5kW) and Rack DC Power Systems (30kW-90kW) showcase advanced features and digital interfaces. These along with the GENESYSTM AC Series (2kVA-45kVA) which delivers high performance AC power for modern demanding test environments.   

Additional Technologies: Also highlighted at APEC will be the new major expansion of the TDK µPOL family of ultra‑compact, non‑isolated DC‑DC power modules for optical modules in AI edge systems and other space‑constrained designs.

TDK will also feature a diverse, wide range of wireless power transfer products to support different applications: low-output/medium-output for smartphones and laptops, higher output wireless feeding for industrial equipment and EVs (electric vehicles), and ultra-compact, thin-profile systems for wearable and/or other devices. 

Exhibitor Presentation: Technologies Powering the Shift to Solid-State Transformers: How TDK Technologies Enable Transition, presented by our expert Anirban Roy, Senior Manager, Field Applications Engineering. 

This informative exhibitor presentation at APEC 2026 will explore how TDK component technologies support SST design at both the component and system level with solutions that are space saving, improving performance, and using TDK’s materials expertise.  

Date: Tuesday, March 24 at 2:15pm in Expo Theater No. 3, Henry B. Gonzalez Convention Center

 

• TDK establishes Asia-Pacific Regional Headquarters (APAC RHQ) in India, effective 1 April 2026
• APAC RHQ will be operated by TDK Asia-Pacific Pvt. Ltd., a new legal entity to be established in India, and TDK Singapore Pte. Ltd., forming a dual-city administrative structure
• The RHQ is part of ‘TDK Transformation’, the company's Long-term Vision

TDK Corporation (TSE:6762) announces the establishment of its Asia-Pacific Regional Headquarters (APAC RHQ) in Bengaluru, India—the company’s fifth regional headquarters alongside Japan, Europe, the Americas, and China. The new legal entity, TDK Asia-Pacific Pvt. Ltd., together with TDK Singapore Pte. Ltd., will govern more than 20 TDK entities across India, Southeast Asia and Oceania—representing nearly 17 percent of TDK’s 105,000 team members. Effective 1 April 2026, the APAC RHQ will operate from a dual-city administrative structure: Bengaluru, India, and Singapore, together the epicenter of one of the world’s most consequential economic corridors and drive ‘TDK Transformation’.

Asia-Pacific is the growth market of this century. Home to nearly 40 percent of the world’s population, the region is projected by the IMF to grow at 4.5 percent in 2025, contributing roughly 60 percent of all incremental world output—even as global growth holds at a modest 3.2 percent. Within it, India stands decisively apart: at 6.6 percent GDP growth for FY2025/26 (IMF), the fastest-growing major economy on earth for the third consecutive year, and now the world’s fourth largest after surpassing Japan in 2025. For TDK, this is familiar terrain approached with new ambition. The company has operated in India for several decades, through its two principal business entities—Electronics Components Business Company (ECBC) and Energy Solutions Business Company (ESBC)—and their subsidiaries, with production facilities in West Bengal, Maharashtra, and Haryana. Today, TDK in India employs over 5,000 people.

"With the establishment of the Asia-Pacific RHQ, we are not simply expanding our footprint—we are strengthening the foundation for the future”, said Vaidyanathan Ramasarma, General Manager, APAC RHQ – TDK Corporation. “This region holds immense potential in technology, talent, and market development. Our mission is to unlock that potential responsibly, collaboratively, and strategically.”

The dual-city administrative structure will balance growth and governance equally in a region that demands both. Bengaluru anchors the growth agenda—India’s technology capital with one of the world’s deepest talent ecosystems in engineering, and foundational research, positions TDK to build new categories, not merely optimize existing ones. The APAC RHQ will invest in emerging technology domains, leveraging India’s tradition of frugal engineering and favorable unit economics for a growing global marketplace. Singapore anchors governance, compliance, and supply chain—a trusted, neutral fulcrum for a region of extraordinary complexity. Together, the two cities form a strategic dyad: one looking inward at the intricacies of regional operations, the other at the horizon of what is possible.

The APAC RHQ will strengthen market intelligence, government relations, and supply chain resilience across the region while driving internal efficiencies, workforce skilling, and disciplined process governance—the less visible but indispensable work of building a business that lasts. In particular, APAC RHQ will play a critical role in building TDK’s global R&D network. India’s scientific talent, its appetite for foundational research, and its unique ability to apply deep knowledge to real‑world constraints make it an indispensable part of our global R&D vision. The government of India’s urgency and appetite for foreign direct investment, its improving ease of doing business, and its ambitious national technology initiatives create conditions that are, for a company like TDK, genuinely rare.

For the past two years, a quiet but purposeful effort has been underway—building the relationships, the institutional trust, and the operational foundations needed for success. TDK’s nascent APAC team has been forging partnerships across academia, government, and industry in India, establishing the connective tissue of a long-term commitment. 

Through this APAC RHQ, TDK will strengthen its contributions to social transformation from India and Asia‑Pacific, while also accelerating our own transformation.
 

• TDK is represented from March 10 to 12 in Nuremberg, Germany, at booth 505 in hall 1
• Technologies ranging from sensor solutions, power supplies, and embedded motor controllers to flash storage solutions and microphones

TDK Corporation (TSE 6762) announces its participation in embedded world 2026, held from March 10 to 12 in Nuremberg, Germany. At booth 505 in hall 1, TDK will showcase a wide range of embedded solutions designed to meet evolving application demands. Visitors can engage directly with TDK experts to learn more about current technologies and system-level approaches. 

Technology highlights include:

Sensor solutions: Sensing solutions for a variety of applications across IoT, Automotive, wearables, hearables, AR/VR, gaming, smart home, and accessibility technology.

• 2D/3D Hall-effect position sensors:
  Enable precise position detection of valves, flaps, and actuators within the automotive thermal management system. They are robust against magnetic stray fields and provide accurate position information even in harsh automotive environments.
• Temperature and pressure sensors:
  Provide accurate temperature and pressure measurement directly in fluid circuits such as oil, coolant, and refrigerant lines. Designed for harsh automotive environments, these sensors combine fast response times, robust signal stability, and easy integration to support efficient and reliable thermal management.
• Digital MEMS microphones:
  Showcasing audio capture, acoustic activity detection, and spoken keyword detection.
• TMR & MEMS sensor fusion: 
  Tracking everything every time, an absolute orientation detection for accurate heading and navigation, using on-chip system-level sensor fusion of 6-axis IMU (Inertial Measurement Unit) and 3-axis magnetometer.
• Ultrasonic Time-of-Flight sensor in iSee One smart glass:
  Thanks to its obstacle detection capabilities and ultra-low power consumption, the ultrasonic ToF enhances accessibility for individuals with visual impairments in an ergonomic design of a smart glass.

Embedded motor controllers: Fully integrated motor controllers for the drive of small DC motors, e.g., in automotive thermal management applications such as pumps, valves, grille shutters, or fans.

• Embedded gate driver & motor control ICs:
  Support efficient control of BLDC motors driving pumps and actuators in thermal management applications. Integrated control and communication functions enable compact system design and reliable motor operation.

Power supply solutions: Advanced AC-DC power supplies and DC-DC converters for cutting-edge industrial, medical, and embedded applications.

• RGC series: 300 W rated ruggedized non-isolated DC-DC buck-boost converters with an input voltage of 9 V to 53 V.
• RGA series: 250 W rated ruggedized non-isolated DC-DC buck converters with an input voltage of 9 V to 40 V or 9 to 53 V
• CCG series: 6 W and 10 W rated DC-DC converters, suitable for through-hole or surface-mount placement.
• i7A series: non-isolated DC-DC buck converters with the industry-standard 1/16th brick footprint.

Flash storage solutions: Solid State Drives (SSDs) offering exceptional data reliability are ideal for applications like industrial equipment and edge computing, where stable operation is crucial.

• Solid State Drives (SSDs) featuring GBDriver series: moderately high-speed access and stable operation while securing data reliability.
• DRAM-less SSDs with a power backup circuit: minimizing data errors, ideal solution for industrial embedded systems.

These flash‑storage technologies are already being integrated into European railway infrastructure and will be showcased at embedded world together with their applications. The demonstration is presented in collaboration with IHI Corporation and features the “3D Laser Radar Level Crossing Obstacle Detection System”.
 

TDK Corporation (TSE:6762) extends its X2 safety film capacitor portfolio with the new B3292xU/V series, 
now supporting higher voltages and offering compact lead spacings of 15 mm and 22.5 mm, with capacitance values from 47 nF to 1.8 µF. Rated at 350 V (AC) and robust against peak voltage pulses up to 2.5 kV 
(IEC 60384-14), the series is designed for interference suppression in demanding, space-constrained industrial and automotive environments in series with the mains. Typical applications are on-board chargers, EV charging systems, PV inverters, energy meters, and capacitive power supplies.

The entire series is now available with lead spacings from 15 mm to 52.5 mm, covering capacitance values from 47 nF to 20 µF. It passed the THB (temperature, humidity, bias) test at +85 °C, 85% RH, and rated voltage for 1000 h, meeting Grade III, Test Condition B requirements. In addition, the series offers AEC-Q200 compliance, excellent self-healing properties, and a maximum operating temperature of +110 °C, ensuring durability even under severe ambient conditions.

With their compact dimensions and high DC testing voltage (1505 V for 2 s), the B3292xU/V series provides a balanced solution of performance and size for next-generation industrial drives and automotive power electronics, supporting the growing need for efficient and space-optimized EMI suppression solutions.

For the B3292xU/V series, TDK offers a range of design tools and SPICE models.

TDK Corporation (TSE: 6762) introduces the new B43655 and B43656 series of aluminum electrolytic capacitors designed specifically for DC links in on-board chargers (OBCs) of electric vehicles. Both series are optimized for forced cooling operation, supporting the growing trend toward higher voltages and currents in next-generation OBC platforms. Due to their compact design and high ripple current capability, such capacitors are commonly used in applications requiring maximum efficiency and reliability in confined spaces. 

With a high voltage rating of 475 V and 500 V, as well as capacitances ranging from 110 µF to 880 µF, the B43655 series meets the requirements of 800 V battery architectures for modern e-mobility applications. Designed for base cooling and high ripple current density, these components offer a useful life of more than 3,000 hours at +105 °C. They also feature a maximum ripple current of 3.29 A at +105 °C and ESR values down to 100 mΩ to minimize power losses. The B43656 series, rated at 450 V, handles even higher currents of up to 4.42 A at +105 °C for demanding high-power OBC topologies. 

Both series are qualified according to AEC-Q200 Rev. E and are made with RoHS-compliant materials. They are available in compact snap-in designs ranging in diameter from 22 mm to 35 mm and in length from 25 mm to 60 mm, depending on the capacitance and voltage class. The B43655 and B43656 capacitors provide design engineers with robust, future-ready solutions for on-board chargers in electric vehicles, thanks to their enhanced electrical performance and reliability. 

The new B43655 and B43656 series will also be implemented in TDK’s web-based AlCap Useful Life Calculation Tool. 

• Guarantees operation in high‑temperature environments up to +175 °C
• Adopts AgPd terminals compatible with conductive‑glue mounting
• AEC‑Q200 compliant (automotive grade)

TDK Corporation (TSE:6762) announced today that it has expanded its NTCSP series of NTC thermistors. These components are designed for conductive‑glue mounting for operation in high‑temperature environments up to +175 °C. Mass production of this series began in February 2026.

To drive higher automotive performance, more powerful and heat-resistant power semiconductors are required. Consequently, electronic components mounted in these power modules must also be able to withstand higher temperatures. While the maximum guaranteed operating temperature for TDK's existing products was +150 °C, the company has now expanded its range to cover up to +175 °C.

This product is a high‑reliability device compliant with AEC‑Q200 and realizes a wide operating temperature range of -55 °C to +175 °C. It can be used for various temperature detection and temperature compensation applications across low to high temperature ranges. It is suitable for automotive applications such as anti‑lock braking systems (ABS), transmissions, and engines. By adopting AgPd (silver‑palladium) terminals compatible with conductive‑glue mounting, this series can operate at +175 °C; this was difficult to achieve with conventional solder mounting.

The NTCSP series offers 10 kΩ and 100 kΩ types in a 1.6 x 0.8 mm package.

TDK will continue to develop NTC thermistors to meet a wide variety of needs, including expansion of chip sizes, thermistor characteristics, and operating temperature ranges.

• TDK becomes the title partner of ABB FIA Formula E World Championship – Tokyo.
• The title of the race is the “2026 TDK Tokyo E-Prix.", the first-ever night race to be held in Tokyo.
• Reinforcing TDK’s commitment to the automotive sector, mobility, vehicle electrification and intelligence.
• Automotive sector and future mobility play an important role in TDK’s AI ecosystem.

TDK Corporation (TSE:6762) will serve as the title partner of the "Formula E Tokyo E-Prix" (hereinafter, “Tokyo E‑Prix”), to be held as a night race in Tokyo on July 25 and 26. This edition of the race will be held under the title “2026 TDK Tokyo E-Prix”.

Since 2025, TDK has been the Official Technology Partner of the Porsche Formula E Team and the Porsche Coanda Esports Racing Team. This collaboration positions Formula E as a live R&D lab for sustainable mobility, digital innovation and commercialization of next‑generation electrification technologies for TDK.

TDK is pleased to announce that it will become the title partner of the race in Tokyo, where TDK’s global headquarters are located. TDK shares Formula E’s commitment to trialing transformative approaches to future automotive and accelerating sustainable progress for humanity.

Noboru Saito, President & CEO, TDK Corporation said:

“TDK has consistently regarded automotive as a priority market, and through this title partnership, reaffirms its commitment to contributing to its ongoing transformation. TDK aims to become a trusted and essential partner at the heart of the automotive industry, strategically positioned in future mobility, vehicle electrification, and data-driven intelligence. As safety systems and autonomous driving technologies advance, we are powering the revolution of electric mobility from within. A conventional internal-combustion engine vehicle already houses thousands of TDK products, a number that grows even higher in electric vehicles. Mobility is a cornerstone of TDK’s AI ecosystem, and by driving innovation from within, we are committed to enabling smarter, safer, and better automobiles. Through these initiatives, TDK embraced Formula E’s vision and decided to support it. We are proud to be the title partner at our home event here in Tokyo.

Alberto Longo, Co-Founder and Chief Championship Officer, Formula E, added:

“We are thrilled to welcome TDK as the Title Partner for the Tokyo E-Prix and Official Partner of Season 12. Japan is a spiritual home for automotive innovation, and TDK’s mission to drive societal transformation through technology aligns perfectly with our vision. Their commitment to supporting engineering students also ensures that this partnership leaves a lasting legacy on the future of the industry.”