TDK Electronics · TDK Europe

Multilayer Ceramic Capacitors

September 18, 2025

TDK launches industry-leading low-resistance soft-termination C0G MLCCs with 22 nF at 1000 V in the 3225 case size

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  • New 1000 V product with a capacitance of 22 nF in the 3225 case size with C0G characteristics of low-resistance soft termination type for automotive and general applications
  • Contributes to greater reliability in applications, reduction of component count, and miniaturization
  • Qualified based on AEC-Q200

TDK Corporation (TSE:6762) announced today it expanded its CN series of low-resistance soft-termination MLCCs. This product achieves an industry-leading* 22 nF capacitance in the 3225 case size (3.2 x 2.5 x 2.5 mm – L x W x T) and C0G characteristics at 1000 V. Mass production of the product series began in September 2025. The capacitors of the CN series are industry-first products that are equivalent to regular products in terms of their terminal resistance due to the optimization of their resin electrode structure.

In recent years, there has been an increase in the use of multiple resonance capacitors placed in series-parallel circuits for resonance applications such as LLC resonant circuits and wireless charging. As applications become more powerful, they require more resonance capacitance, which increases the demand for high-voltage, large-volume capacitors. To improve reliability in these applications, components with resin electrodes effectively prevent placement cracks resulting from external stress. However, the increased resistance value of resin electrodes has been an issue.

This led TDK to develop the CN series with optimized resin electrode structures, resulting in significantly lower resistance values. In addition to the low losses and capacitance stability over temperature and voltage variations of C0G products, these resin electrode structures achieve both high reliability against external stress and reduced loss, making them ideal for use as resonator and snubber capacitors. 

The optimization of product and process designs has made it possible to manufacture these products, which helps increase reliability and application to high-voltage circuits and enhances the reliability of the applications. TDK will continue to expand its product line to meet the needs of its customers.

* As of September 2025, according to TDK
 

Features & Applications

Main applications

  • Resonance circuits
  • Snubber circuits
     

Main features and benefits

  • TDK's unique terminal structure realizes soft termination MLCC whose low resistance is equal to that of standard terminal products
  • C0G characteristics with low loss and capacitance stability during temperature or voltage changes
  • Higher reliability of applications, reduced component count, and miniaturization achieved with resin electrodes, high voltages, and large volume


     

Key Data

Type* Outer dimensions 
[mm]
Temperature 
characteristics
Rated voltage 
[V]
Capacitance
[nF]
Capacitance tolerance
[%]
CNA6P1C0G3A223G250AE keyboard_arrow_right3.2 x 2.5 x 2.5C0G1,00022±2
CNA6P1C0G3A223J250AE keyboard_arrow_right±5
CNC6P1C0G3A223G250AE keyboard_arrow_right±2
CNC6P1C0G3A223J250AE keyboard_arrow_right±5
*CNA is for automotive, and CNC is for commercial. Samples may be purchased from the product page displayed after clicking Type.

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India

September 15, 2025

A Key Pillar of TDK’s Global Strategy

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India has emerged as a strategic powerhouse in the global electronics ecosystem, combining robust economic growth, supportive policies, and a vast talent pool. It is the fastest-growing major economy in the world and recently became its most populous nation. The Indian government’s push for self-reliance – from the “Make in India” initiative to Production Linked Incentives (PLI) schemes – is catalyzing domestic manufacturing and infrastructure development.

As a result, India’s electronics industry is scaling rapidly toward a projected USD 500 billion market by 2030, powered by surging local demand in sectors like automotive, renewable energy, industrial modernization, and digital technologies. This trajectory is also shaped by the global “China+1” strategy, as multinational companies diversify manufacturing and R&D footprints into India to strengthen resilience. For global companies like TDK, India’s rise presents an unprecedented opportunity: to innovate at scale, tap into world-class engineering talent, and build a more reliable supply chain at the heart of a booming market.

Investing in India for Innovation and Resilience

TDK’s commitment to India dates back to the mid-1990s, when it was among the pioneers establishing large-scale component manufacturing in the country. Over the decades, the footprint has grown steadily: today, TDK operates six factories across India producing components from film capacitors in Nashik to ferrite cores in Kalyani, alongside advanced battery cells and packs in Bawal and Manesar. Most recently, a state-of-the-art battery facility was inaugurated in Sohna, which, according to Bansal, will play a “pivotal role in supporting our rapidly growing energy solutions portfolio.”
 

 Gagan Bansal

“India will remain a cornerstone of our global strategy. We are confident that our expanding presence will further strengthen our ability to serve both domestic and international markets.”  

Gagan Bansal, President Electronic Components Business Company (ECBC), Sales and Marketing, TDK India

By growing its manufacturing presence locally, TDK not only increases capacity but also strengthens global supply chain resilience – diversifying production geographies and ensuring customers have reliable access to critical components even amid disruptions.

Beyond manufacturing, India is fast becoming a hub for R&D and engineering excellence. TDK has established four major engineering and sales centers – in Mumbai, Bangalore, Pune, and Noida – to stay close to customers and market trends. A new magnetic design lab for transformers and a large R&D facility under TDK-Lambda are being built in Bangalore, positioning the city as a nucleus for advanced product development.

Innovation in India also extends to the startup ecosystem. TDK Ventures is investing in high-potential ventures in fields ranging from agritech (FASAL) and industrial analytics (Infinite Uptime) to EV batteries (Exponent Energy) and next-generation mobility (Ultraviolette Automotive). Supporting grassroots innovators such as Healyantra in medtech reflects a long-term commitment to nurturing India’s entrepreneurial spirit. These collaborations bring agility and local insight into TDK’s portfolio, accelerating the development of tailored solutions for Indian and global markets.

 Production Nashik
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This multifaceted growth strategy is timed with India’s own upward trajectory. TDK forecasts the Indian electronics market to grow at 8–10% annually over the next five years, fueled by infrastructure build-out and rising domestic demand. Crucially, the areas where India is investing most heavily – ICT, EVs, renewable energy, and smart infrastructure – directly align with TDK’s core competencies, creating a virtuous cycle of national priorities and corporate expertise.

Powering India’s High-Growth Sectors

India’s development agenda highlights several high-growth sectors where electronics and digital technologies are vital. TDK is uniquely positioned to accelerate these transitions through its broad portfolio of components, energy solutions, and sensor technologies.

  • Electric Mobility (EVs): India’s e-mobility revolution is accelerating, with over 19 million EVs already on the road in 2025. Ambitious 2030 targets – 80% of two-/three-wheelers and 40% of buses to be electric – will transform transport. Backed by subsidies and charging infrastructure, this creates vast demand for advanced batteries and power electronics. By localizing battery production and partnering with EV startups, TDK is helping India electrify at scale while securing a strong position in a market expected to approach 80 million EVs by 2030.
  • Renewable Energy & Smart Grids: India is targeting 500 GW of renewable energy capacity by 2030. At the same time, programs like the Revamped Distribution Sector Scheme (RDSS) will deploy 250 million smart meters by 2026. From grid stability to rooftop solar integration, TDK enables this shift with energy-efficient capacitors, harmonic filters, and advanced surge protection – making the clean energy transition more efficient and reliable.
  • Railways & Infrastructure: With USD 60 billion earmarked for electrification and upgrades by 2030, India’s railway modernization is unprecedented. TDK supports this through high-reliability inductors, filters, and surge protection devices that safeguard both infrastructure and onboard systems, ensuring safe and uninterrupted mobility for millions.
  • Data Centers & Digital Infrastructure: As India becomes the world’s digital hub – with booming fintech, e-commerce, and cloud services – next-generation data centers are critical. TDK contributes with thermal management materials, EMI suppression, and power conversion modules, ensuring stable, energy-efficient operations that can handle exponential data growth.
  • Consumer & Industrial Electronics: Rising incomes and urbanization are spurring demand for energy-efficient appliances and advanced industrial automation. TDK supports OEMs with sensors, actuators, and power solutions that enhance energy efficiency, safety, and connectivity – enabling everything from smart homes to smart factories.
 Factory Nashik
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India at the Core of TDK’s Future Strategy

India is not only a high-growth market but also a critical node in the global electronics value chain. TDK’s strategy recognizes this reality: by investing in local production, R&D, and partnerships, the company contributes directly to India’s aspirations while leveraging the country’s strengths for global competitiveness.

Breakthroughs and efficiencies achieved in India – whether in EV batteries, renewable integration, or digital infrastructure – are increasingly influencing TDK’s global operations. This synergy enhances agility, responsiveness, and innovation across the corporation.

Looking ahead, India offers a scale and diversity of opportunity that few countries can match. Its large talent pool of 1.5 million engineers graduating annually, combined with government-backed policies, makes it a testing ground for innovation and a springboard for global growth.

As Bansal emphasizes: “By combining local strengths with TDK’s global expertise, we are helping customers bring new technologies to market faster and more reliably. India’s success and TDK’s success are deeply intertwined.”



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Corporate

September 10, 2025

TDK and World Athletics’ technology collaboration project: successful visualization of javelin throw using sensor technology

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  • Offers acquired and clearly visualized complex motion data of the javelin throw that was previously invisible
  • Contributes to athletes’ skill improvement and creates new spectator experiences
  • As an official partner of World Athletics, TDK will continue to contribute to the evolution of sports through its unique technologies

TDK Corporation (TSE:6762) announces the successful visualization of javelin throw data through its technology collaboration with World Athletics, announced in June 2025. By applying TDK advanced sensor technology, it has made previously unseen information about the javelin throw visible, aiming to further enhance the appeal of the sport and contribute to the technical improvement of the javelin and the throwing technique of the athletes.

TDK will exhibit at the National Stadium during the World Athletics Championships in Tokyo from September 13-21, 2025. TDK’s booth will showcase prototypes of sensor-equipped javelins and future-oriented sample javelins with embedded sensors.

This project began from the shared desire of TDK and World Athletics to evolve athletics through technology and communicate its appeal to more people. By utilizing TDK’s high-precision sensor technology, it is taking on the challenge of acquiring and clearly visualizing complex motion data generated during the moment of javelin release and flight (such as launch angle, rotation, speed, altitude, and flight trajectory). Currently, TDK is in the experimental stage of attaching its sensors to actual javelins and throwing them, and has confirmed that the data acquired and analyzed by TDK sensors can be visualized. Moving forward, it will work to acquire and analyze even more accurate and detailed data.

https://www.tdk.com/en/featured_stories/tdkwithin/entry-01-javelinthrow.html keyboard_arrow_right

A major contributor to data acquisition is TDK’s cutting-edge, ultra-miniature high-precision InvenSense 6-axis MEMS motion sensor. The ultra-low power, miniature sensor (approx. 13 mg, 2.5 mm x 3 mm x 0.81 mm) detects position, speed, and angle. By combining multiple sensors, TDK has also made it possible to acquire data such as launch angle, posture, rotation, and altitude, which were previously unable to be visualized.

The data visualized by these sensors provides athletes with a new means to deeply understand their own performance and improve their throwing technique. Additionally, by presenting the data in an easy-to-understand visual format, TDK aims to help spectators better understand the javelin throw, discover new appeal, and experience the athletes’ extraordinary physical abilities in a new way.

The collaboration is one of TDK’s initiatives to realize its Long-term Vision, “TDK Transformation,” and embodies the new brand identity tagline “In Everything, Better.” In particular, through co-creation with partners, TDK will accelerate projects under the concept of “TDK Sensing Within,” utilizing its sensor technology in final products and solutions to drive social transformation. 

Since 1983, TDK has contributed to the development of track and field as an official partner of World Athletics, and it will continue to promote further evolution in sports through its unique technologies.

Guided by TDK’s Corporate Motto to “Contribute to culture and industry through creativity,” it has established TDK Long-term Vision TDK Transformation starting from the fiscal year 2025. This vision reflects TDK’s commitment to contributing to social transformation and continuously evolving ourselves to realize a sustainable future. By accelerating technological advancement and social change through electronic devices that combine its unique materials, process, and software technologies, TDK aims to contribute to a sustainable future, continually transform itself, and become the No.1 partner for growth together with customers worldwide.

World Athletics Chief Information Officer, Mr. An:
“TDK has been a valued partner supporting World Athletics for over 40 years. We are delighted that this technology collaboration has been realized for the first time. Sensor technology is highly compatible with athletics, and I see great potential in its ability to visualize athletes’ movements and efforts as data.”

TDK Corporation Project Team:
“Through numerous discussions and experiments with World Athletics officials, our understanding of the javelin throw—a previously unexplored field for TDK—has deepened. We are delighted that our sensor technology is able to acquire and visualize data that was previously invisible. We will continue to refine our technology and contribute to the transformation of the sport.”




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Corporate

September 9, 2025

TDK initiates a proposed public tender offer followed by a mandatory squeeze-out for the shares of Tronic’s Microsystems

TDK Corporation (TSE:6762) and its wholly-owned subsidiary TDK Electronics AG informed the management board of Tronic’s Microsystems on July 9, 2025, of its decision to file a public tender offer followed by a mandatory squeeze-out for the shares of Tronic’s Microsystems SA at a price of €5.56 per share (the “Draft Offer”). TDK Electronics AG, the majority shareholder of Tronic’s, holds 87.34% of Tronic’s share capital. The concert formed between TDK Electronics AG and Thales AVS France SAS holds 97.44% of Tronic’s share capital.

The Draft Offer is part of an initiative to simplify the shareholding of Tronic’s, through the acquisition of the outstanding capital not currently held by TDK Electronics AG and Thales AVS France SAS (2.56% of Tronic’s), with TDK Electronics AG as the sole offeror. The Draft Offer is in line with Tronic’s strategy, which no longer requires the listing of the company on Euronext Growth® in Paris, taking into account the very low liquidity of the stock. The Draft Offer also aims to reduce the costs associated with the listing. As a reminder, TDK Electronics AG has financed Tronic’s in recent years and plans to recapitalize Tronic’s up to a maximum of €7,000,000 by March 31, 2026, as Tronic’s equity has been less than half of its share capital since 2023.

Therefore, TDK Electronics AG is offering Tronic’s shareholders who tender their shares to the offer the opportunity to obtain immediate liquidity for their entire stake.

As Tronic’s is unable to establish an ad-hoc committee as referred to in III of Article 261-1, III of the AMF General Regulation, Tronic’s submitted on July 10, 2025, to the French stock market authority (Autorité des marchés financiers, AMF) the appointment of BM&A, represented by Pierre Béal, as independent expert. The AMF financiers informed Tronic’s on July 23, 2025, that it did not oppose this appointment.

The Offer period will be ten trading days and is expected to take place before the end of the second half of 2025. Prior to the opening of the Offer, the AMF will publish a timetable notice, and Euronext Paris will publish a notice announcing the terms and opening of the Offer.

As the conditions for a mandatory squeeze-out have already been met, the offer will be followed by a mandatory squeeze-out procedure for Tronic’s shares on Euronext Growth®. As part of the mandatory squeeze-out, the Tronic’s shares that have not been tendered to the Offer will be transferred to TDK in exchange for cash compensation equal to the Offer price, i.e., €5.56 per share.

This Offer will not be subject to any financing condition, as TDK has the necessary funds to fully finance the cash Offer.

The draft TDK tender offer document was filed today with the AMF and is available in the investors section of TDK's website, www.tdk.com.

Additional information regarding the transaction

The draft information memorandum prepared by TDK Electronics AG and filed today with the AMF is available in the Investors section of TDK's website. The public will be informed of the filing of the public tender offer documents, which will subsequently be published by TDK Electronics AG and Tronic’s. In accordance with French law, the documentation related to the public buyout offer aimed at Tronic’s will include the tender offer document prepared by TDK, incorporating the terms and conditions of the offer, as well as the draft response memorandum prepared by Tronic’s, including the independent expert's report and the reasoned opinion of the supervisory board, and will be subject to review by the AMF.


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China

September 9, 2025

New sales office in Shenzhen

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At the end of August, TDK celebrated the relocation and opening of its new office in Shenzhen, China's third-largest city after Shanghai and Beijing. The new office brings together colleagues from TDK, TDK Electronics, TDK-Lambda, InvenSense, and TDK SensEI. The opening ceremony was attended by 215 employees and around 40 guests.

The new office is located on the 38th floor of the Dabaihui Plaza Tower, one of the city's highest buildings. More than 200 colleagues work on approximately 2,000 square meters, primarily serving customers in the automotive and industrial electronics sectors, such as BYD, VMAX, and DELTA. During the office's grand opening ceremony, Grace Wang, President and CEO of the Greater China Sales Business Group, emphasized its strategic importance.

Ludger Trockel, ECBC CSO and General Manager of the ECBC Sales & Marketing Group, sent a video message congratulating the team on the opening of the office and expressing his best wishes to all team members. Makoto Kondo, Deputy General Manager of TDK Greater China Sales Division and General Manager of China Sales Division South China Block, expressed his appreciation for the dedication of the teams and the support from partners.

Lions bring good luck and success

A traditional lion dance performance added a festive atmosphere to the new office, symbolizing prosperity and good fortune. Distinguished guests such as Yutaka Matsuura, Chairman Greater China Sales Business Group, Yuan Chong, Sales Director TDK-Lambda China, CJ Deng, General Manager TDK InvenSense China, and Paul Chen, General Manager TDK SensEI China, also took part in the celebrations. The lions paraded through the office, spreading wishes of happiness and success to all employees.

Following the performance, the guests jointly participated in a roasted pig cutting ceremony, a traditional practice symbolizing continuous good fortune and prosperity for both the new office and all employees.

Excellent location

The Dabaihui Plaza building is 380 meters high and comprises 74 floors with a total area of around 1.4 million square meters. The tower is located 400 meters from the Gangxia North Transit Hub, where seven subway lines intersect, and 800 meters from the Futian high-speed rail station.

The new address of the office is:
38th Floor, Dabaihui Plaza, 3086 Jintian Road, Futian District, Shenzhen 518026, China
 

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Film capacitors

September 9, 2025

TDK presents ultra-small PFC capacitors for space-constrained consumer applications

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TDK Corporation (TSE:6762) introduces the B3270xP, a series of ultra-small, metallized polypropylene (MKP) film capacitors tailored for power factor correction (PFC) stages in power supplies for consumer electronics. With their compact design and self-healing properties, these components are engineered for use in adapters and power supplies for devices such as laptops and gaming consoles. Their minimized footprint addresses the increasing demand for space-efficient solutions in high-density circuit designs. 

The B3270xP series is available in three lead spacing variants – 10 mm (B32701P), 15 mm (B32702P), and 22.5 mm (B32703P) – with rated DC voltages of 450 V, capacitance values ranging from 0.47 µF to 2.2 µF, and an ESR of 10  to 25  at 100 kHz. These capacitors operate up to a +110°C case temperature (with voltage derating above +85°C), delivering consistent performance over a service life of 50,000 hours at rated voltage and +85 °C. In addition, they exhibit a dissipation factor tan δ of up to 1.0 ∙ 10⁻³ at 1 kHz. TDK provides LTspice models for these components. 

Designed with parallel wire leads and halogen-free options upon request, the components meet RoHS compliance and are offered in bulk, ammo pack, or reel configurations. Their plastic housing and epoxy resin sealing meet UL 94 V-0 standards, ensuring flame retardance and mechanical durability. 

 

Features & Applications

Main applications

  • Power supplies and adapters 

  • SMPS PFC circuits 

  • Low-power electronic device chargers 


     

Main features and benefits

  • Very compact design for space-constrained consumer applications 

  • High voltage capability up to 450 V (DC) 

  • Self-healing properties for enhanced reliability 

  • RoHS compliance 

  • Halogen-free (upon request) 
     

Key Data

Ordering codeCapacitance [µF] Lead spacing [mm] Min. dimensions (L x W x H) [mm] Weight
[g]
 

B32701P* 

0.47 … 2.2 

10 

13.0 x 5.0 x 11.0  

13.0 x 9.5 x 19.5  

B32702P* 

0.68 … 2.2 

15 

18.0 x 5.0 x 10.5 

18.0 x 8.5 x 14.5 

B32703P* 

2.2 

22.5 

N.A. 

26.5 x 6.0 x 15.0 


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Corporate

September 8, 2025

TDK announces that Tronics enters the machine and asset health monitoring market with vibration sensor solutions

  • TDK’s subsidiary, Tronics Microsystems, expands into vibration sensor solutions, targeting process and asset monitoring to support predictive maintenance and industrial IoT applications 

  • Building on two decades of MEMS expertise, the company leverages its legacy in inertial sensors to engineer high-precision vibration sensor solutions 

  • Strategic evolution aligns with Tronics’ mission and vision, reinforcing its role in digitally transforming transportation, energy, and industrial sectors through smart sensing solutions 

  • Live demonstrations planned at electronica India (Sept 17–19) and sps – Expo in Nuremberg (Nov 25–27), showcasing the new vibration sensor technology 

    TDK Corporation (TSE:6762) announces that its subsidiary, Tronics Microsystems ‒ a leading provider of high-performance inertial MEMS sensor solutions ‒ is expanding its product portfolio to include vibration sensor solutions aimed at process and asset monitoring applications. This strategic development represents a major milestone in the company’s evolution and underscores its dedication to driving the digital transformation across industrial sectors. 

    For over two decades, Tronics has pioneered in delivering high-performance MEMS inertial sensor solutions for precise motion sensing, positioning, and navigation in aerospace, railway, and energy applications. Leveraging decades of experience in MEMS R&D, manufacturing, and test, the company builds on that legacy to introduce vibration sensor technologies for monitoring and predictive maintenance of critical processes and assets. 

    Mission 

    To be a provider of MEMS inertial sensor solutions for precise motion sensing, positioning, navigation, and condition monitoring of critical assets in transportation, energy, and industry. 

    Vision 

    To contribute to the digital transformation of transportation, energy, and industry by providing digital inertial and vibration sensors solutions.  

    A story of evolution 

    As industries evolve, digitally transforming towards Industrial IoT and more, so does the need for smarter systems that can continuously sense not just motion, but also the health of machines themselves through vibration spectrum monitoring. Tronics is then currently introducing vibration sensor solutions that bring a new layer of digital transformation and intelligence to industrial systems. 

    “Expanding offers into the vibration sensor market is a natural and strategic evolution for the Company, rooted in our MEMS DNA for high-end industrial applications. We did not just package an off-the-shelf basic accelerometer for our vibration sensors. Listening to the condition-based monitoring demand, we engineered innovative MEMS solutions with the same precision and reliability that define our inertial products and services,” said Julien Bon, CEO, Tronics Microsystems.  

    Tronics is currently completing the development of its first generation of vibration sensor solution for process and assets monitoring, enabling customers to design highly accurate quality control and predictive maintenance solutions. 

    See it in action! 

    Tronics is proud to announce that this innovative development will be showcased live at electronica India on September 17-19 in Bengaluru [TDK booth D01, Hall 3] and sps – Expo on November 25-27 in Nuremberg [TDK booth 334, Hall 10]. Emmanuel Bercier, Innovation Marketing Manager, will demonstrate the technology and discuss how Tronics is shaping the future of machine health monitoring through smart IoT sensor solutions. 


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Aluminum electrolytic capacitors

September 4, 2025

TDK unveils ultra-compact, vibration-resistant axial capacitors for up to +140 °C in automotive applications

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TDK Corporation (TSE:6762) unveils the B41699 and B41799 series of ultra-compact aluminum electrolytic capacitors with axial-lead and soldering star designs, engineered to withstand operating temperatures of up to +140 °C. Tailored for demanding automotive applications, these components offer a high-capacitance​​ and​​ high-ripple current solution in a space-saving format. This enables designers to reduce the number of capacitors required in powertrain modules, such as electric power steering (EPS), fan control, and transmission systems.

The new capacitors are available for rated voltages of 25 V and 35 V, with capacitance values ranging from 1800 µF to 13,000 µF. They offer ripple currents of up to 34.6 A (IAC,max) at 10 kHz and +125 °C case temperature, supported by low ESR, over 4000 h of useful life (at +125 °C at rated voltage and rated ripple current), and vibration stability up to 60 g (optional). This robustness is particularly advantageous in xEV platforms operating within a 12-V board net, where thermal stress, mechanical vibration, and compact integration are critical design factors. 

The axial-lead version (B41699) and the soldering star version (B41799) provide flexible mounting options for horizontal, vertical, or busbar configurations. The dimensions vary from 16 x 25 mm and 21 x 49 mm (D x H). Their SIKOREL-based construction allows for a storage life of up to 15 years at +35 °C, while ensuring RoHS compatibility and compliance with AEC-Q200 standards. By achieving high capacitance in a minimized footprint, these capacitors empower engineers to simplify their designs without compromising performance. 

Further information on the products can be found at www.tdk-electronics.tdk.com/en/alu_axial  

 

Features & Applications

Main applications

  • Automotive electronics 


     

Main features and benefits

  • Ultra compact design 

  • High ripple current capability 

  • Useful life 4000 h at up to +125 °C 

  • Vibration stability up to 60 g available upon request 

  • Low ESR at high frequency 

  • SIKOREL design – storage for up to 15 years at a temperature of up to +35 °C 

  • Compliance with AEC-Q200  

  • RoHS-compatible 
     


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Corporate

September 3, 2025

TDK and ASICS launch joint research on motion analysis technology to support athletes

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  • Integration of TDK’s sensing technology and ASICS’s sports engineering 

  • Embodying the new brand identity “In Everything, Better” and accelerating the long-term vision “TDK Transformation” 

  • “TDK Sensing Within” project: contributing to social transformation through sensing technology together with partners 

TDK Corporation (TSE:6762) announces that it has launched a joint research project with ASICS Corporation (hereafter “ASICS”) to analyze athletes’ movements using motion sensing technology. By combining TDK’s sensor technology with ASICS’s extensive expertise in sports engineering, TDK aims to visualize athletes’ movements and contribute to improving their performance.  

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This project was born from a shared desire between both companies to support athletes with innovative, cutting-edge technology. By utilizing TDK’s proprietary high-precision sensor technology to sense athletes’ movements and analyzing the data with ASICS’s deep expertise in sports engineering, TDK aims to build solutions that provide advice and coaching to athletes, as well as contribute to the development of shoes and tools. TDK is in the experimental phase using prototype sensing devices, and are jointly advancing motion analysis and visualization. 

The collaboration is one of TDK’s initiatives to realize its Long-term Vision “TDK Transformation,” and embodies the new brand identity tagline “In Everything, Better.” In particular, through co-creation with partners, TDK will accelerate projects under the concept of “TDK Sensing Within,” utilizing its sensor technology in final products and solutions to drive social transformation. Since 1983, TDK has contributed to the development of track and field as an official partner of World Athletics, and it will continue to promote further evolution in sports through its unique technologies. 

Guided by TDK’s corporate motto “contribute to culture and industry through creativity,” it has established TDK Long-term Vision “TDK Transformation” starting from the fiscal year 2025. This vision reflects TDK’s commitment to contributing to social transformation and continuously evolving ourselves to realize a sustainable future. By accelerating technological advancement and social change through electronic devices that combine its unique materials, process, and software technologies, TDK aims to contribute to a sustainable future, continually transform ourselves, and become the No.1 partner for growth together with customers worldwide. 

Comment from TDK President & CEO, Noboru Saito: 

TDK is honored to join ASICS in supporting athletes’ ambitions as an official partner of World Athletics. Through TDK’s advanced sensor technology, it has contributed to societal transformation in fields such as automotive, ICT, and industrial equipment. Now, by applying these technologies to the world of sports, TDK aims to create new value by analyzing athletes’ motion data to enhance performance and drive product innovation.Over the past 40 years, TDK has had the privilege of meeting countless athletes through its involvement with World Athletics. By combining ASICS’s expertise in sports engineering with TDK’s sensor technology, it is committed to supporting athletes and advancing the transformation of sports. 

Comment from ASICS President & COO, Mitsuyuki Tominaga: 

TDK and ASICS are both Official Partners of the World Athletics, and we are delighted to be able to support the athletes who continue to challenge themselves, through this joint research. Since its founding, ASICS has been committed to helping athletes maximize their performance through fundamental research and technology, always guided by our founding philosophy - Anima Sana In Corpore Sano, A Sound Mind In A Sound Body. Under our Mid-Term Plan 2026, we are promoting mid to long term research focused on athletes to further strengthen innovation. This joint research with TDK is part of that effort, aiming to enhance research on athletes and digital technology, and to expand and accelerate our innovation framework through a broader global R&D network. We will continue conducting various research and testing based on feedback from athletes, developing products and services that truly meet their needs, and leveraging data to deliver even deeper support for athletes. 


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Corporate

September 1, 2025

TDK Unveils New Brand Identity and Tagline: “In Everything, Better”

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  • “In Everything, Better,” embodies the spirit at the heart of TDK and contributions to culture, industry, and society 

  • TDK is an enabler of advanced technologies behind the devices that shape our daily lives

  • The technologies of TDK are woven into the fabric of everything, creating transformation from within 

  • TDK strives to be better every day by transforming itself, and to make the world better by transforming society 

TDK Corporation (TSE:6762) announces the launch of its new brand identity and tagline: “In Everything, Better”. This serves as a significant driver of the Long-term Vision “TDK Transformation” and captures the company’s unique venture spirit, its commitment to progress, and its vision for a sustainable future.

For 90 years, TDK has quietly shaped the world from within. TDK has been pushing for progress and boldly reinventing itself; from ferrite cores to cassette tapes, to powering the digital age with advanced components, sensors, and batteries, leading the way towards a sustainable future. The company’s technologies nowadays power the devices and systems that define modern life: from smartphones and electric vehicles to industrial applications and energy systems. With over 100,000 passionate team members worldwide, united by a start-up mentality and a drive for innovation, TDK is an enabler behind the scenes, creating impact from within. 

More details about TDK’s new brand identity can be found at https://www.tdk.com/en/about_tdk/brand-identity/index.html

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“In Everything, Better” - the new tagline, debuting in September 2025, is not just a phrase; it is a declaration of TDK’s promise to always strive for better, for ourselves and for society.

Noboru Saito, President & CEO of TDK Corporation mentioned “The new brand identity aligns with our Long-term Vision of TDK Transformation, and it is rooted in our Corporate Motto of ‘Contributing to culture and industry through creativity’ and Corporate Principles of ‘Vision, Courage, and Trust’. It is what we believe, how we act, and how we communicate. It is who we are today, where we are going in the future and the legacy we create.”

As TDK expands into new segments such as AI and solution businesses, TDK’s brand now reflects the evolving realities of today and the aspirations for tomorrow.

The roll-out of the new brand identity will be gradual. As the main partner of the World Athletics for over 40 years, TDK’s new brand identity will be actively promoted at the upcoming World Athletics Championships in Tokyo, from September 13, and through TDK’s corporate exhibitions and global activities.

We will strive to be better every day, continuously transforming TDK and boldly embracing the challenge to make the world better; driving positive change in society.

In Everything, Better.  


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Power EMC Filters

August 28, 2025

TDK unveils standardized CarXield EMC filters for xEV platforms

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TDK Corporation (TSE:6762) presents CarXield (ordering code: B84252x), a standardized EMC filter series for automotive inverters for 500 V and 1000 V, which can significantly reduce development time for system integrators. This product enables rapid market entry for mid-sized e-mobility manufacturers with validated, compact EMI solutions that meet automotive standards and are immediately available through streamlined, standardized manufacturing processes. By mitigating inverter-to-battery interference, CarXield enhances overall powertrain EMC performance and simplifies compliance for electric drivetrain applications.

Designed to suppress inverter-generated noise on battery lines, which is crucial for both electromagnetic immunity and emission compliance, CarXield ensures stable performance in xEV platforms. The components measure 140 x 59 x 50.0 mm (L x W x H) and cover 500 V and 1000 V systems with rated currents up to 400 A at ambient temperatures of +85 °C, and transient peak currents up to 1000 A. The typical DC resistance is only 0.1 mΩ. Based on nanocrystalline core technology and incorporating X2 or Y2 class capacitors with integrated passive discharge, these filters are engineered for durability under severe ambient conditions.

Thanks to its availability with or without copper busbars and optional passivated finishes, CarXield supports flexible system integration, allowing developers to adapt thermal and spatial designs without compromise. It is certified to automotive standards such as AEC-Q200 and validated against MBN LV 124 profiles.

Further information on the products can be found at www.tdk-electronics.tdk.com/en/carxield

Features & Applications

Main applications

  • EMI noise reduction in the electric drivetrain of commercial and passenger vehicles


     

Main features and benefits

  • Standardized solution for xEV powertrains
  • Tailored for the dynamic needs of mid-sized e-mobility manufacturers
  • Based on nanocrystalline cores and X2 and Y2 capacitors
  • Passive discharge circuit
  • Easy and fast to install
  • Compact design


     

Key Data

Ordering codeRated DC voltage
[V]
Rated current
[A]
Peak current 
for 10 s [A]
Weight
[g]
 
B84252A0200*500200600≤ 620
B84252B0400*10004001000≤ 780


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Inductors

August 26, 2025

TDK launches compact thin-film inductors for optical transceivers that reduce losses in AI data centers

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  • The component achieves a high inductance of 10 μH despite a small 1206 case size 

  • High impedance characteristics over a wide frequency range of 10 MHz to 200 MHz 

  • DC resistance reduced by approximately 70%, rated current increased by 1.7 times 

TDK Corporation (TSE: 6762) has expanded its PLEC69B series (1.2 x 0.6 x 0.95 mm – L x W x H) of thin-film inductors, used for separating the data signal from the power in optical transceivers in AI data centers. Mass production of these components began in August 2025. 

The widespread adoption of AI led to a skyrocketing demand for high-speed and high-capacity optical transceivers. Bias-tee circuits, which are used in these transceivers, are designed to superimpose signals and power on a single transmission line. Because of the impedance characteristics, inductors like the PLEC69B separate the signal from the power in bias-tee circuits, preventing the signal from flowing into the power side. 

The new component achieves the highest standard performance* for an inductor with 10 μH in 1206 size with TDK’s proprietary metallic magnetic materials and structural designs. With a wide frequency range of 10 MHz to 200 MHz, signals can be separated from power with high impedance, which improves communication quality. Additionally, the DC resistance of 1.4 Ω (typ.) is approximately 70% lower than that of similar products on the market. This reduces power loss and heat generation. The rated current (Isat) of 0.2 A is also 1.7 times higher than that of similar products. In addition, the smaller dimensions require less space on the PCB. The PLEC69B ensures high reliability with an upper operating temperature limit of +125 °C.  

TDK will continue contributing to its extensive lineup by developing products to meet market needs for lower power consumption and high-speed communications designed for data centers, servers, as well as optical communication devices and edge devices, supporting the AI market in anticipation of significant future growth.  

*Source: TDK, as of August 2025 

Features & Applications

Main applications

  • For signal circuits: Bias-tee circuits for optical communication modules  

  • For power supply circuits: Smartphones, TWS, wearable devices 
     

Main features and benefits

  • High impedance characteristics with a wide frequency range of 10 MHz to 200 MHz 

  • DC resistance reduced by approximately 70%, producing a typical resistance of 1.4 Ω to help reduce power loss and heat generation 

  • Rated current (Isat) of 0.2 A, increased by 1.7 times 


     

Glossary

Bias-tee circuit: A circuit that superimposes and separates the signal and power along a single transmission line 
 
 

Key Data

TypeInductance [μH] @100 kHzDC resistance
[Ω] (max.)

Isat [A] (max.) 

Isat [A] (typ.) 

Itemp [A] (max.)

Itemp [A](typ.) 
PLEC69BCA100M-1PT00 10 ± 20%1.68/1.4 0.2 0.25 0.35 0.4 

Isat: Current value based on inductance variation (30% lower than the initial inductance value) 

Itemp: Current value based on temperature increase (temperature increase of 40 K by self-heating) 


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Corporate

August 21, 2025

TDK receives “platinum” rating for the first time in the EcoVadis sustainability assessment

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TDK Corporation (TSE: 6762) announced it has received the highest rating of “platinum for the first time in the sustainability assessment conducted by EcoVadis, an international sustainability rating agency headquartered in France.

EcoVadis sustainability assessment evaluates the sustainability activities of over 150,000 companies across more than 185 countries and 250 industries, focusing on four themes: Environment, Labor and Human Rights, Ethics, and Sustainable Procurement. The platinum rating is awarded to companies that rank in the top 1% of all evaluated companies.

TDK received a gold rating in 2024, and this is the first time achieving a platinum rating. In this survey, TDK received a perfect score, with its evaluation improving from last year, particularly in the areas of environmental reporting (disclosure of quantitative indicators showing the status of initiatives) and labor and human rights implementation measures (specific action plans to realize policies and commitments). As a result, TDK was recognized as having established a high-level management system in all four themes, leading to this platinum rating.

TDK will continue to contribute to the realization of a sustainable future based on the company’s long-term vision, TDK Transformation: Accelerating transformation for a sustainable future, while aiming to solve social issues through TDK’s business based on its management philosophy.
 


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Transformers

August 19, 2025

TDK extends the DC working voltage of its InsuGate SMT gate drive transformers to 1000 V

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TDK Corporation (TSE:6762) has significantly extended its EPCOS InsuGate series of SMT gate drive transformers, introducing new variants rated for a DC working voltage of up to 1000 V (ordering code: B78541A25). These components meet the IEC 61558-1/2-16 standard for basic insulation and enable more compact gate driver designs for full-bridge inverter modules, particularly in demanding e-mobility and industrial environments. The triple-insulated winding structure, combined with a MnZn ferrite core and optimized coil architecture, allows for robust isolation in high-switching-frequency applications without compromising board space or reliability.

With a footprint of just 13.85 x 10.5 x 9.2 mm (L x W x H), the new 1 kV-rated components reduce PCB floor space requirements by approximately 30% compared to traditional single gate drive transformer designs supporting equivalent insulation. They offer a flat inductance profile up to +150 °C, with a nominal inductance of 75 µH and a coupling capacitance of only 4 pF, making them a good choice for fast-switching IGBT and SiC devices. SPICE models are available upon request.

The series is qualified to AEC-Q200 Rev. E and has undergone extended mechanical vibration testing in line with AQG 324 requirements based on standard Eurocard PCB, proving its resilience in powertrain-mounted modules. With a partial discharge extinction voltage of ≥1.2 kV (Vpeak), reinforced insulation voltage capability of 300 V (AC), and high voltage test performance at 3 kV (AC) for 60 seconds, these new transformers offer a reliable solution for galvanic isolation in next-generation power electronics.

Features & Applications

Main applications

  • Switch-mode power supplies
  • Gate driver circuits
  • Isolated DC-DC converters
  • Galvanically isolated single-channel IGBT/SiC driver ICs


     

Main features and benefits

  • DC working voltage up to 1000 V
  • Small SMT package 13.85 x 10.5 x 9.2 mm (L x W x H)
  • Flat L vs. temperature curve
  • Coupling capacity 4 pF (typ.)
  • Partial discharge capability
  • RoHS compatible
  • Qualified to AEC-Q200 Rev. E
  • Vibration resistant acc. to AQG 324 on standard Eurocard PCB
  • Wide temperature range up to +150 °C
     

Key Data

Ordering codeVop_Basic (DC) [V]Turns ratioLleak [µH]RDC,N1 [mΩ]
B78541A2528A003> 10001 : 0.910.7420
B78541A2525A003> 10001 : 0.91 : 0.360.7420
B78541A2526A003> 10001 : 0.81 : 0.450.7420


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