• Strategic investments in the high-performance magnetic sensors business to capitalize on the Physical AI era
• Contributing to development of the AI ecosystem on which TDK is focused

TDK Corporation (TSE:6762) has decided to make strategic investments to strengthen the development of new magnetic sensors, particularly tunnel magnetoresistance (TMR) sensors, and establish a full-scale mass-production system. Designed primarily for Physical AI applications, these sensors are compact and consume little power, while also delivering high-performance and fast response for next-generation power semiconductors. The total investment is expected to be approximately 100 billion yen at TDK Shinano River Techno Factory in Ojiya City, Niigata Prefecture, Japan.

In recent years, the spread of AI technology has rapidly expanded into the “Physical AI” domain, including robotics, smart infrastructure, and automation systems. As a result, the importance of sensors that acquire real-world data with high precision and in real time is increasing, and the AI ecosystem market, including sensors, is expected to expand over the medium to long-term. TDK’s magnetic sensors portfolio includes angle and linear sensors based on TMR technology.

Against this backdrop, in June this year, TDK established TDK Shinano River Techno Factory in Ojiya City, Niigata Prefecture, Japan. Through the large-scale strategic investments announced today, TDK will bring to global markets high-value-added products that combine its proprietary packaging technologies with high-performance TMR sensors. These products will help improve the energy efficiency and performance of equipment in an AI-powered infrastructure society.

These investments will contribute to the further development of the AI ecosystem market on which TDK is focused, as well as to the revitalization of related industries in Japan and the local economy. Learn more about TDK sensors, including magnetic sensors, at product.tdk.com/en/products/sensor/index.html

Overview of the New Factory

1. Factory Name: TDK Shinano River Techno Factory
2. Location: Ojiya City, Niigata Prefecture, Japan
3. Site Area (Building Area): 173,335 m² (132,075 m²)
4. Main Business Activities: Production of magnetic sensors
5. Scheduled Start of Operations: In 2029

TDK Corporation (TSE:6762) showcases its diverse portfolio of sensor and passive component solutions for humanoid robotics at Hon Hai (Foxconn) Technology Day, held in Taipei from October 30 to 31, 2026. This portfolio includes position sensing solutions, angle sensors, NTC temperature sensors, and one-stop passive component solutions, demonstrating how TDK supports humanoid robot development across perception, computing, driving, communication, battery management, and human-machine interaction.

With continuous advancements in artificial intelligence, advanced materials, precision motion control, and battery technology, humanoid robots are gradually moving from laboratory displays to industrial applications, demonstrating potential in intelligent manufacturing, logistics, inspection, medical care, and service fields.

Future humanoid robots will not only need to be able to walk, but also achieve precise grasping, dynamic balance, environmental perception, and human-machine collaboration. This places higher demands on electronic components and sensors: the system needs to have high-precision motion sensing, efficient power management, stable high-speed communication, as well as reliability to cope with vibration, temperature changes, and long-term operation.

With its technological expertise in sensors, magnetic components, capacitors, thermistors, power modules, batteries, and EMI noise suppression products, TDK is collaborating with customers to build humanoid robot solutions that cover modules such as sensing, computing, power supply, communication, drive, and dexterous hands, accelerating the transition of innovative achievements from R&D verification to practical application.

High-performance motion and position sensors enable precise control

Sensor solutions for humanoid robots keyboard_arrow_right include IMUs, angle sensors, encoders, and position sensors to monitor posture, acceleration, angular velocity, joint position, and actuator status in real time, thereby achieving dynamic balance, precise movements, and safe control.

TDK's MEMS IMU can be considered the "inner ear" of humanoid robots, suitable for the head, torso, hips, feet, and joints. This solution uses low-noise, high-performance gyroscopes and accelerometers, combined with BalancedGyro® vibration suppression technology, effectively reducing the effects of motor noise and structural vibration. The related products support angular velocities up to 4000 dps (degrees per second) and acceleration measurement ranges of ±32 g, with support for excellent temperature stability.

In humanoid robot joints, accurate sensing of motor rotor and actuator angular positions plays an important role in improving motion accuracy, operating efficiency, and system safety. TDK TMR angle sensors use the tunnel magnetoresistance (TMR) effect to sense magnetic-field direction, enabling non-contact measurement of angular position. With compact packaging, low power consumption, high sensitivity, and high angular accuracy, these sensors are well suited for space-constrained humanoid robot joint modules, motors, and actuator applications.

In addition, TDK PositionSense™ magnetic position sensing solution by InvenSense, a TDK group company, can detect changes in the magnetic field, enabling non-contact detection of rotational, linear, and switch positions. PositionSense combines a 6-axis IMU and 3-axis TMR-based magnetometer with on-chip sensor fusion software,all in a compact size, simple structure, and with low power consumption and high reliability.

By combining TMR angle sensors, absolute encoders, and related magnetic sensing technologies, TDK can provide diverse position detection solutions for robot joints, motor rotors, linear actuators, and dexterous hands.

Temperature sensing ensures the safety of motors and batteries

Humanoid robots contain numerous motors, actuators, power modules, and battery systems, generating heat during operation. TDK offers glass-encapsulated NTC products, bondable NTC chips, ring-shaped terminal temperature sensors, and high-voltage applications, which can monitor motor windings, drive boards, power devices, computing units, and battery temperatures, helping the system achieve overheat protection.

A highly reliable component solution for actuator communication, haptic feedback, and ESD protection

In order for the humanoid robot industry to make great strides toward the future, high reliability that allows humans to use them with peace of mind will become even more important. TDK’s electronic components are highly reliable parts manufactured with development technology and quality control cultivated over many years in the fields of automotive electronic control units (ECUs) and industrial robots.

For wired communication applications, which serve as the nerves to control actuator motors—key components of humanoid robots—TDK offers products such as CMC (Common Mode Choke), PUI (Power Inductor), and MLCC (Multilayer Ceramic Capacitor), which are widely used in automotive control units and the space industry. TDK develops these products with the aim of further miniaturization, weight reduction, and increased robustness for humanoid robot applications. For better interaction between humans and machines, TDK’s haptics devices enable tactile feedback, and various ESD protection devices make it possible to design systems that do not malfunction due to noise at points of contact with people.

With a product portfolio covering motion sensing, position detection, temperature monitoring, power supply, communications, drive, and tactile feedback, TDK can provide humanoid robot customers with solutions for complete machine systems.

TDK Corporation (TSE: 6762) has introduced the HVC28 and HVC29 series of gas-filled, high-voltage DC contactors with optional mechanical auxiliary contact. Both series are available with continuous current ratings of 300 A, 400 A, 500 A, and 600 A. The HVC28 is designed primarily for automotive systems with operating DC voltages of up to 1000 V and high short-circuit currents. Meanwhile, the HVC29 is built for industrial power systems that require operating DC voltages of up to 1500 V.

The HVC28 has a continuous-current capability of up to 600 A and a short-circuit current handling capability of 16 kA for 5 ms. Under specified resistive-load test conditions, the contactor can perform one maximum cut-off operation at 1600 A and 1000 V. Therefore, it is particularly useful for xEV battery disconnect units, high-voltage junction boxes, traction battery systems, commercial vehicles, and DC fast-charging stations.

The HVC29 can handle maximum operating voltages of 1500 V and continuous currents of up to 600 A. It has a short-circuit current handling capability of 6 kA for 5 ms. Typical industrial applications include energy storage systems, solid-state transformers, uninterruptible power supplies, and DC fast-charging stations. In AI data centers, these contactors can support the upcoming 800 VDC power architectures.

Both series use a ceramic, gas-filled arc chamber to quickly and reliably interrupt DC currents. Their polarity-free main terminals enable bidirectional current flow, supporting applications in which power can flow in either direction. An integrated connector simplifies low-voltage connections and system installation.

For mechanically linked feedback on the state of the main contact, a normally closed mirror contact is available as an optional accessory. This auxiliary contact complies with IEC 60947-4-1 and can be used to determine whether the main contact has opened or closed. It supports switching-state monitoring in safety-relevant automotive and industrial systems.

Both the HVC28 and the HVC29 are available with 12 V or 24 V single coils. Each coil consumes 6 W at the nominal voltage. Both models measure 95.5 x 96 x 49 mm (H x W x D). The HVC28 weighs about 640 g, while the HVC29 is slightly less at about 630 g. They operate within a temperature range of -40 °C to +85 °C. The components are CE- and UKCA-compliant, as well as certified to UL 60947-4-1. CCC certification is pending.

TDK Corporation (TSE: 6762) announces the expansion of its NTC temperature sensor portfolio with the M704 (ordering code: B57704M0103A001) and M705 (ordering code: B57705M0103A001) series, engineered for reliable temperature measurement in high-voltage environments. With voltage ratings of up to 4000 V (AC) for the M704 and 2500 V (AC) for the M705, these probe assemblies enable safe and precise monitoring in demanding applications such as UPS and PSU systems in data centers, charging stations, and PV inverters. By combining electrical robustness with ease of assembly, TDK helps designers achieve safe and efficient system operation.

Both sensors feature an R25 of 10 kΩ, a B25/100 value of 3988 K (±1 percent), and a resistance tolerance of ±2 percent. The M704 is specified for a temperature range from -40 °C to +125 °C, while the M705 extends this range up to +180 °C. The M704, with its compact plastic case and 3.5 mm lead spacing, supports automated PCB integration and fast assembly. In contrast, the M705 provides a low thermal time constant of approximately 6.2 s on a metal plate, enabling fast thermal response. It also features a metal-tag ring lug design that ensures excellent thermal coupling and flexible screw-on mounting across various mechanical interfaces.

Together, these portfolio extensions provide robust, application-focused temperature sensing solutions for high-voltage systems where safety, reliability, and installation efficiency are paramount.

Two of TDK's most important customer industries in Europe are facing major challenges. Under pressure from Chinese manufacturers in particular, the automotive industry is undergoing restructuring and continuing to shift production and key corporate functions to Eastern Europe. At the same time, Europe is making significant investments in AI infrastructure in the industrial sector to reduce its technological dependence on China and the United States. TDK Europe (TEU), the TDK sales organization serving the European market, is adapting to these new conditions with a future-focused and agile organizational setup across Europe.

A Conversation with TEU President Josef Vissing and Steve Elliot, Head of Sales Europe.

What are the most significant changes you currently see in the European market?

Vissing: A key factor is that the automotive industry is undergoing a major transformation. The biggest challenge for European manufacturers is that China, traditionally their most important sales market, has come under tremendous pressure following the shift to electric vehicles. A large share of profits used to be generated in China, but today European manufacturers account for only a small percentage of the Chinese electric vehicle market. At present, vehicle registrations in China are dominated by Chinese brands.

Elliot: At the same time, Chinese manufacturers such as BYD and XPeng are making a strong push into the European market and, in some cases, are even establishing their own production facilities here, such as BYD’s plant in Hungary. Chinese automakers have now become the biggest competitors to Europe’s automotive industry, putting European manufacturers under pressure from two directions.

What is TDK doing to strengthen its access to Chinese automotive manufacturers in Europe?

Vissing: Chinese manufacturers in Europe present additional opportunities for us. We work closely with our colleagues in China to engage customers at the right time. However, it will still take some time for business to gain momentum for us in Europe, as Chinese car makers currently continue to source and import much of their electronics from China.

Will the automotive industry continue to be the largest customer industry for TDK products in Europe?

Elliot: The automotive industry will remain our largest market in Europe, while industrial applications and emerging markets related to AI infrastructure are becoming increasingly important. However, the automotive business alone will not be sufficient to drive future growth. This is why we started diversifying our business several years ago.

Vissing: The automotive industry continues to offer significant business opportunities for us, particularly through electrification, software-defined vehicles, and the ongoing advancement of autonomous driving. We have a wide range of products to support these developments. The industrial market is benefiting from the massive demand across the entire AI ecosystem, particularly for data center infrastructure and power supply solutions.

Elliot: Humanoid robots and smart glasses are opening up numerous new opportunities for us, especially in the sensor market. We are working on a variety of projects in medical technology and security applications, leveraging innovative new products.

How important is the AI ecosystem in Europe? After all, the global AI market, and data center infrastructure in particular, is largely dominated by the United States and China.

Elliot: AI is also extremely important for TDK in Europe. The region is home to key development and design centers focused on infrastructure solutions and power supplies for AI and data centers. This is driving enormous demand for products such as ultra-compact snap-in aluminum electrolytic capacitors used in high-performance server power supply units. Demand for these capacitors is so strong that we are currently more than doubling production capacity, including at our facility in Szombathely, Hungary.

In addition, new opportunities are emerging in power transmission applications, for example in medium-voltage uninterruptible power supply systems. Furthermore, solid-state transformer technology, with its compact and flexible design, is expected to see broader adoption in modern AI data centers. AI is significantly driving our growth this year, both directly and indirectly, and is expected to remain a major growth driver in the years ahead.

What advantages does TDK have in Europe compared with the competition?

Vissing: We have long-standing, strong relationships with many of our customers, and with 17 sales offices across Europe, we maintain a local presence close to them. This proximity, combined with the trust we have built over many years, represents a significant advantage over our competitors. Its value cannot be overstated. And we are also continuing to invest in our presence in Europe. In Regensburg, a new EMC laboratory is being built where we will work together with our customers to develop solutions. The laboratory will therefore serve as another important tool for strengthening customer relationships and enhancing customer engagement.

In addition, we have opened a new sales office in Romania to ensure that we remain close to our customers in the years ahead. Over the past several years, automotive customers in particular have established manufacturing, research and development, and procurement operations in Eastern European countries.

Opening of the TDK sales office in Timișoara, Romania, from left: Uwe Aistleitner (Managing Director Central and South Eastern Europe and Managing Director sales office Timișoara), Andrei Buhaceanu (Strategic Account Manager Aumovio and also Managing Director sales office Timișoara), Josef Vissing (President TDK Europe) and Oliver Huettner (Managing Director TDK Europe).

The TDK main booth in Hall B5.520 will showcase solutions for the AI ecosystem, Automotive, Industrial, and ICT applications across approximately 540 square meters.

 

 

 

Should we be concerned about Europe?

Vissing: Europe is facing challenges in a number of areas right now. As TDK, we need to think carefully about how to respond, but we have no reason to worry. We remain firmly committed to the European market and to the long-standing relationships we have built with many major customers based on trust and close collaboration. Europe offers us many great opportunities! To take advantage of them, we must continue to realign ourselves and adapt to changing market conditions.

Elliot: Europe needs to redefine its position and become more self-reliant. I am French myself, have a British name, and have been living in Germany for more than 20 years. That alone shows that I am a strong believer in Europe. At the same time, I believe we as Europeans need to adapt more decisively to the new geopolitical realities.

Next year, TDK’s European sales organization will be consolidated into five hubs: West, Central, East, Distribution, and Strategic Automotive Accounts (SAA). What is the objective of the new organization?

Vissing: We are further aligning our sales organization with the changing market conditions in Europe. In addition, we can now offer customers a broader range of sensor solutions from across the TDK Group. Sensor technologies, in particular, represent an area where we have many compelling and innovative products. By leveraging our strong customer relationships, we can effectively promote these solutions and convert them into successful design wins.

Looking ahead to electronica, which will take place in Munich from November 10 to 13, what can visitors expect from our booth in Hall B5.520, and what are you personally most looking forward to?

Elliot: At electronica, we will be showcasing innovative, high-performance products, particularly for the AI ecosystem. Visitors will be able to experience a variety of demo stations featuring different TDK technologies, allowing them to get a glimpse into the future of AI in a short amount of time. Of course, our booth will also feature solutions for the automotive, industrial, and ICT markets.

In addition, electronica in Munich is one of the best opportunities to exchange ideas with customers and business partners about future trends in an inspiring environment. Over just a few days, we have the chance to engage in a large number of conversations and further strengthen our strong customer relationships. That is something we are very much looking forward to.

TDK Corporation (TSE: 6762) has introduced the compact B3201*A5/B5/C5 series of Y1 safety capacitors designed to suppress EMI in demanding automotive and industrial applications. The metallized polypropylene (MKP) film capacitors are rated for AC voltages of 500 V and DC voltages of up to 1500 V. Featuring a maximum operating temperature of up to +125 °C (with derating), they combine a space-saving footprint with AEC-Q200 Rev. E compliance and high robustness under severe ambient conditions. Typical applications include xEV power electronics, on-board chargers, EV charging infrastructure, industrial drives, power supplies, renewable energy converters, and energy storage systems.

This series offers capacitance values ranging from 0.47 to 33 nF and is available with lead spacings of 15 and 22.5 mm. The smaller B32012 variants measure 5.0 x 10.5 x 18.0 mm, and the B32013 types extend the capacitance range to 33 nF. The compact dimensions help developers implement reliable line-to-ground filtering where PCB space is limited. Parallel wire leads support conventional through-hole mounting. The components are available untaped or in ammo-pack and reel configurations.

The capacitors are rated for continuous operation at 500 V (AC) and 1500 V (DC), respectively, at temperatures of up to +110 °C. At operating temperatures above +110 °C and up to the maximum of +125 °C, the operating voltage must be derated by 1.5% per degree Celsius. Operation within this elevated temperature range is limited to a maximum of 1000 hours.

For applications exposed to heat and humidity, the B3201*A5/B5/C5 series is tested at +85 °C, 85% relative humidity, and 500 V (AC) for 500 hours (THB test). Their self-healing MKP construction supports reliable operation under electrical stress, while the plastic case and epoxy resin sealing meet UL 94 V-0 flammability requirements. The series is approved according to IEC/EN/UL 60384-14, CSA E60384-14, and GB/T 6346.14.

• Discover how TDK technologies are enabling the AI ecosystem at electronica 2026
• Explore innovations that bring greater intelligence, efficiency, and sustainability to key industries
• Experience how the new TDK tagline “In Everything, Better” comes to life across AI Infrastructure & ICT Devices, Automotive, and Industrial & Renewable Energy

TDK Corporation (TSE:6762) will showcase its latest technologies enabling the AI ecosystem at electronica 2026 in Munich, Germany, from November 10 to 13. TDK will be in Hall B5, Stand 520. Guided by its new tagline “In Everything, Better,” TDK powers the next generation of artificial intelligence with its solutions in AI Infrastructure & ICT Devices, Automotive, and Industrial & Renewable Energy, leading to greater intelligence, higher efficiency, and better sustainability. In addition to TDK’s main booth, TDK-Lambda will showcase its latest power supply solutions in Hall A5, Stand 503, and ICsense will showcase its innovations in Hall C4, Stand 100. For more information, visit electronica.tdk.com.

“Artificial intelligence is entering a new phase,” notes Noboru Saito, President and CEO of TDK Corporation. “As AI becomes increasingly embedded across infrastructure, intelligent systems, and devices, the need for energy efficiency, sensing, computing, and connectivity continues to grow. Through our expertise across the AI ecosystem, we are enabling this transformation while creating new value for our customers and society.”

As artificial intelligence expands beyond digital environments into the physical world, it increasingly relies on seamless interactions among infrastructure, intelligent systems, and devices. Consequently, the demand for advanced sensing, connectivity, energy, and computing technologies will grow. TDK, a global leader in electronics solutions for the smart society, is helping build the foundation for this transformation through its broad portfolio of technologies. These technologies support applications ranging from renewable energy and AI infrastructure to industrial automation, automotive, and intelligent devices.

TDK technologies, products, and solutions support every stage of the AI value chain—from data centers and semiconductor manufacturing to edge devices, smart glasses, and intelligent industrial systems—thereby accelerating the adoption of AI across society.

Highlights on the booth

AI Infrastructure & ICT Devices

• Solid-state transformer: This technology is used to transform medium-voltage AC (10 kV to 35 kV) to lower AC or DC voltages. In the case of AI data centers, the preferred output is 800V (DC). Such a system consists of several nodes in series on the input side, connected in parallel at their output. Many different components are used in a modular and scalable solid-state transformer (SST). It features not only silicon carbide (SiC) devices and proprietary high-frequency modules, but also a lot of passive components, ensuring bidirectional power flow with higher efficiency and reduced grid strain in a compact form factor.

• Data center cooling: TDK offers a variety of sensor technologies for coolant distribution units (CDUs). With power per rack expected to reach 1 MW within the next few years, reliable cooling is essential for AI servers and data centers. The portfolio includes temperature and pressure sensors for the cooling circuit, as well as tunnel magnetoresistance (TMR) sensors for angle detection in valve control motors.

• Optical transceiver: This mock-up demonstrates TDK’s ability to supply key components and sensors for optical transceivers used in AI and general server communications. It combines TDK’s aluminum nitride (AlN) substrates, thin-film capacitors, power inductors, bondable and thin-film negative temperature coefficient (NTC) thermistors, and DC-DC converters in a single system.

• Dexterous robotic hand: Powered by TDK’s advanced sensor technology and AI-driven smart perception, the Nibotics Dexterous Hand redefines precision in robotic manipulation. With human-like dexterity and the ability to sense pressure, force, slip, texture, shape, and temperature in real time, the hand can perform complex handling tasks with uncompromising control, performance, and sophistication. This sets a new standard for physical AI in industrial automation.

• Meta-optic mirror for smart glasses: TDK’s award-winning meta-optic mirror uses a precisely engineered nanostructure to enable an ultra-thin optical system for stylish, lightweight smart glasses. Images are projected directly onto the retina through a mirror only 150 nm thick, embedded in an eyeglass lens, delivering a clear, focus-free augmented reality (AR) experience without visible rainbow artifacts. This mirror eliminates the need for a larger conventional curved mirror.

• Tactile zoom for smart glasses: Imagine adjusting the camera zoom of smart glasses and feeling the zoom levels through instant, crisp tactile cues rather than relying solely on vision. The Haptic Slider Zoom demo uses TDK’s piezo technology to create crisp, highly responsive haptic feedback in a compact form factor. The result is a natural, interactive user experience and an example of how advanced haptics can make future smart glasses more intuitive and user-friendly.

• Sensors in smart glasses: TDK MEMS sensors and software are a critical bridge between physical AI and the real world. MEMS and TMR sensing technologies, together with advanced sensor fusion software, enable precise motion tracking and orientation sensing, as well as immersive user experiences in next-generation wearables.

• MEMS microphones for wearables: In wearable devices where audio is the main interface for artificial intelligence, such as AI pins or smart glasses, TDK MEMS microphones provide the high sound fidelity and noise suppression algorithms required to enable audio AI applications. They include an Acoustic Activity Detect feature that allows AI processors to operate at ultra-low power.

• Haptic glove with augmented reality glasses: Haptic feedback makes AR and virtual reality (VR) even more immersive, as it engages additional human senses. TDK’s multilayer piezo ceramic PowerHap actuators can render surface textures precisely, as demonstrated impressively by WEART’s TouchDIVER glove.

Automotive

• Traction inverter demonstrator: This demonstrator unites key TDK technologies to create efficient, high-performance electric drive systems. One highlight is the new AC-phase current sensor CUR 3020. It provides highly accurate current measurements, supporting efficient inverter operation and helping to extend vehicle range. The demonstrator also integrates high-capacitance-density DC-link capacitors, which ensure stable current flow and a compact design. EMC filters achieve electromagnetic compatibility, and magnetic rotor position sensors provide precise motor commutation.

• Building the backbone of the software-defined vehicle: Common-mode chokes and power-over-coax inductors from TDK enable reliable high-speed connectivity, signal integrity, and efficient power delivery for the growing number of cameras and sensors in Zonal ECU architectures.

• High-brightness RGB laser beam scanning projector: TDK showcases a compact, MEMS-based laser beam scanning technology that enables bright, high-contrast, full-color projections. Designed for high optical performance, a small footprint, and low power consumption, this technology opens new ways to present information to drivers and passengers through intuitive human-machine interfaces in software-defined vehicles.

Industrial & Renewable Energy

• Predictive maintenance by AI-driven analytics: With edgeRX and edgeRX Vision, TDK showcases a solution that makes predictive maintenance possible by using AI-driven analytics to identify potential equipment issues before they result in failures or unplanned downtime. edgeRX delivers actionable insights that empower teams to move from reactive maintenance to a proactive, data-driven approach. This approach can help reduce maintenance costs and improve resource efficiency, while also extending equipment life and increasing reliability through early detection of wear, degradation, and performance anomalies.

• Advanced vibration monitoring for rotating equipment: VIBO from TDK is an industrial IoT edge vibration sensor combining a 20 kHz bandwidth, a digital architecture, a Modbus interface, and embedded intelligence for advanced condition-based monitoring. Thanks to these features, the sensor system can identify subtle, early-stage mechanical defects, including bearing, gearbox, and cavitation issues, before they affect system performance. Designed for demanding industrial environments and manufacturing processes, VIBO provides predictive maintenance insights that maximize uptime and minimize maintenance costs for motors, compressors, vacuum systems, pumps, and industrial robots.

• Programmable power sources: Suitable for 19-inch rack mounting, the GENESYS AC programmable power sources from TDK offer 2 kVA and 3 kVA in the 1U format and 6 kVA and 9 kVA in the 3U format. Units can be paralleled to increase output power. The series provides 1-phase and 3-phase outputs, with adjustable AC voltages from 0 V to 350 V at frequencies from 16 Hz to 1.2 kHz (up to 5 kHz for the PRO series) and ±500 V (DC). Avionics and IEC test libraries are available.

• EMC Services: In early 2027, TDK will officially open a completely new accredited EMC lab in Regensburg, Germany. At electronica, visitors can learn more about this new lab and TDK’s worldwide EMC services. Besides this new European facility, TDK operates several accredited EMC labs in all major regions, including Japan, China, and the United States.

Porsche Formula E Partnership

Through its partnership with the Porsche Formula E Team and Porsche Coanda Esports Racing Team, TDK brings the world of electric racing to electronica 2026. Visitors can experience the Porsche Coanda Esports racing simulator firsthand and learn more about the technologies shaping the next generation of electric mobility.

Careers at TDK: TDK’s HR team will be at the booth to talk with anyone interested in working for TDK.

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Noboru Saito, President and CEO TDK Corporation

TDK Corporation (TSE: 6762) has expanded its surface-mount multilayer varistor (MLV) product family with the standard X series (CT0402*X, CT0603*X, CT0805*X, CT1206*X, CT1210*X, CT1810*X, and CT2220*X) for industrial applications. These new SMD MLVs not only protect electronics against overvoltages, maintaining high reliability and performance in a compact size, but also help customers reduce their CO₂ footprint by up to 30 percent. Based on a tailored, innovative ceramic composition, these components can be sintered at lower temperatures than standard MLVs, reducing energy usage. Additionally, the raw material itself has a smaller CO₂ footprint.

The X series targets power supplies, factory automation, industrial IoT, and sensor interfaces where miniaturization and electrical robustness are required, including harsh environments. This follows the release and ramp-up of the X1 series for automotive applications based on the same technology platform.

Spanning case sizes from EIA0402 to EIA2220, the X series offers RMS voltage ratings from 3.5 to 40 V and varistor voltages from 8 to 350 V. They provide clamping voltages from 24 to 450 V and withstand electrostatic discharge (ESD) up to 15 kV air discharge according to IEC 61000-4-2. For surge protection, peak current handling ranges from 1 A in the smallest footprint up to 800 A. Customer-specific adjustments are possible.

These varistors respond to voltage transients within 0.5 ns and offer capacitance values as low as 6 pF, preserving signal integrity in high-speed data lines. The components operate reliably in a temperature range of -55 to +125 °C. With packaging options that support high-volume automated assembly, the X series integrates seamlessly into modern SMT processes.

By combining compact dimensions, fast response times, and robust electrical ratings, the X series enhances the resilience of electronic designs, contributing to longer service life and improved system reliability across a diverse set of industrial applications.

• Now available for worldwide distribution, PositionSense is a 2-chip 9-axis sensor solution for absolute orientation detection and fast sensor calibration
• Enables the ultimate positioning accuracy for smart glasses, smartphones, AI wearables, humanoid robots, drones, and any device requiring precise location
• Integrates TDK’s ultra-low power 6-axis IMU and 3-axis TMR-based magnetometer with on-chip sensor fusion software

TDK Corporation announces worldwide distribution availability of its InvenSense PositionSenseTM – a two-chip nine-axis sensor solution that enables next-gen positioning accuracy and navigation for applications in wearables, robotics, drones, mobile devices, and more. The PositionSense ‘Smart Perception’ solution integrates TDK’s lowest-power 6-axis IMU and TMR-based 3-axis magnetometer with on-chip sensor fusion and calibration software to enable fast, accurate orientation tracking and position detection.  

“When your device uses PositionSense, users are always on track and never lost – even in a city, field, factory, or location without a satellite connection,” said Joseph Bousaba, CEO of InvenSense, a TDK group company. “Whether for people using their smart glasses, watches, or phone for directions, or for a humanoid navigating a warehouse floor, our PositionSense sensor solution ensures highly accurate and reliable navigation for physical AI devices.” 

The speed and precision of PositionSense’s absolute orientation detection come from the custom integration of its components: 

• TDK 6-axis SmartMotion^® IMU, the lowest-power IMU with high-performance MEMS technology and vibration-resistant gyroscope
• TDK 3-axis magnetometer, based on tunnel magneto resistance (TMR) sensor technology, the lowest-power magnetometer with high-sensitivity and accuracy, along with magnetic field shock resistance
• TDK on-chip sensor fusion software, enabling fast and accurate 9-axis sensor calibration

PositionSense is available in four hardware configurations, all with on-chip sensor fusion, gyro-assisted calibration, and an easy-to-integrate design for always-on sensing.   

• ICM-45608 + ICT-15318 keyboard_arrow_right With I2C/SPI/I3C support at 1.8V VDDIO, this PositionSense solution is ideal for IoT applications with a 16g/2000dps Accel/Gyro full-scale range. 

• ICM-45608 + ICT-15312 keyboard_arrow_right With I2C/SPI support at 1.2V VDDIO, this PositionSense solution is ideal for battery-powered and power-sensitive applications with 16g/2000dps Accel/Gyro full-scale range. 

• ICM-45689 + ICT-15318 keyboard_arrow_right With the IMU’s extended ±4000 dps gyroscope and ±32 g accelerometer full-scale range, this PositionSense solution improves measurement headroom for high-dynamic motion, while offering I2C/SPI/I3C support with 1.8V VDDIO.  

• ICM-45689 + ICT-15312 keyboard_arrow_right With the IMU’s extended ±4000 dps gyroscope and ±32 g accelerometer full-scale range, this PositionSense solution improves measurement headroom for high-dynamic motion, while offering I2C/SPI support with 1.2V VDDIO.  

TDK India has received awards from the Electronic Industries Association of India ELCINA for the third consecutive year. The awards recognize outstanding achievements in the areas of sustainability, exports, and technological innovation, particularly at the Nashik site.

By winning first place in the Environmental Protection & Sustainable Development category, TDK India was recognized for its continued efforts to sustainability. This includes initiatives focused on energy conservation, the use of renewable energy, water management, waste reduction and recycling, pollution prevention, the reduction of greenhouse gas emissions, and employee awareness programs. TDK Electronics now uses electricity generated from 100 percent renewable energy sources at all of its production sites worldwide, including its facilities in Nashik and Kalyani, India.

In addition, TDK India received second place in the Export category, recognizing the company's contributions to international markets. TDK India also once again demonstrated its innovative strength: in the Research & Development category, the company received a Certificate of Merit for its innovative Compact Y1 EMI suppression capacitor.

In 2025, TDK India received an ELCINA Award in the Research & Development category for the development and production of a new series of X2 capacitors for EMI suppression. In 2024, ELCINA recognized TDK India’s achievements in Environmental Protection & Sustainable Development, including the creation of a Miyawaki forest at the Nashik site.
 

At the award ceremony in New Delhi: Gagan Bansal, President Sales & Marketing TDK India (third from right), Pritam Chavan, QMS in charge for Nashik site (third from left), S. Krishnan, Secretary of the Ministry of Electronics and Information Technology, Government of India (center).

• Delivers high impedance at frequencies up to 2 GHz
• Provides 1.7 to 2 times higher impedance than conventional components
• Compact 1608 size using multilayer processing technologies

TDK Corporation (TSE:6762) expands the MLJ1608-G series (1.6 x 0.8 x 0.8 mm; L x W x T) of multilayer inductors for automotive power-over-coax (PoC) circuits. Mass production of these new components began in October 2026.

Automotive PoC enables power and data to be transmitted simultaneously over a single coaxial cable. It is used primarily in automotive cameras that form part of advanced driver-assistance systems (ADAS). Multiple cameras installed at the front, rear, sides, and other areas of a vehicle detect the surrounding environment, and the resulting information is processed by an electronic control unit (ECU) to support safe driving. Traditionally, two cables—one for power and one for data—were required to connect an automotive camera to an ECU. PoC consolidates these functions into just one coaxial cable. This reduces the number of cables in a vehicle, offering benefits such as higher reliability, more compact wiring, reduced vehicle weight, and lower CO₂ emissions.

Before the signals can be processed, PoC systems require a wideband filter consisting of multiple inductors to separate the data signal and the power. Through its proprietary material and structural designs, the MLJ1608-G series achieves high impedance across the frequency range from 300 MHz to 2 GHz, owing to its high inductance of 1.2 μH, compared with 0.56 μH for conventional products. In the 100–700 MHz range, it provides 1.7 to 2 times higher impedance than conventional components, thereby delivering effective noise suppression. With its size of 1608, the component also helps to make camera modules smaller.

For the development of inductors for automotive PoC applications, TDK will continue to expand its lineup to meet evolving market needs through optimized designs utilizing multilayer, wire-wound, and thin-film technologies. In doing so, TDK will contribute to improving the quality of PoC transmission signals.

• The world’s first demonstration of a direct retinal projection display for smart glasses using a meta-optic mirror.
• A natural-looking appearance suitable for everyday use, enabled by an ultrathin, transparent mirror that can be embedded in a lens.
• Future realization of full-color capability to contribute to the widespread adoption of smart glasses.

TDK Corporation (TSE:6762) has successfully demonstrated, for the first time in the world, a direct retinal projection (DRP) display for smart glasses using a meta-optic mirror. The flat mirror uses nanoscale reflectors, measures just 150 nm thick and can be embedded directly into a lens. With a visible-light transmittance of approximately 80 percent, it enables smart glasses with transparency equivalent to that of ordinary eyeglass lenses, giving them a natural appearance suitable for everyday use. TDK will exhibit a prototype at CEATEC 2026,  beginning on October 13, 2026, and at electronica, November 10-13, 2026.

TDK has established technologies for an ultra-compact full-color laser module (FCLM), one of the smallest of its kind in the world, and a visible-light full-color laser control device capable of achieving 4K resolution. The company has also been developing the key devices required for DRP in smart glasses. Conventional DRP systems used a curved mirror mounted in front of the user’s eye to project images onto the retina, making it difficult to achieve smart glasses with a natural appearance. By arranging unique nanoscale reflectors on a plane and creating a structure that changes the angle of light reflection depending on the position of the mirror, it is possible to reflect laser light incident from various angles at the reflection angle necessary for DRP. Therefore, it is possible to replace conventional curved mirrors.

Furthermore, the DRP smart glasses prevent images from being visible to people facing the wearer (image leakage). This provides a natural look and addresses privacy concerns since others cannot see the projected content.

Conventional waveguide displays have complex structures and can be costly to manufacture. The meta-optic mirror, however, can be manufactured using processes comparable to those used for semiconductors, opening the way to cost-competitive mass production. The current meta-optic mirror supports monochrome operation. TDK aims to demonstrate full-color operation and achieve mass production within the next few years.

TDK has entered into a business cooperation agreement with QD Laser, Inc. (TSE:6613, hereinafter “QD Laser”). By combining QD Laser’s proprietary retinal projection technology and patent portfolio with TDK’s FCLM, visible-light full-color laser control devices, meta-optic mirrors, and other technologies, TDK is accelerating the development of next-generation RGB light source modules and optical engines for smart glasses. TDK will contribute to the transformation of smart glasses, an application expected to grow within the AI ecosystem on which TDK is focusing, and their widespread adoption in society. 

TDK Corporation (TSE: 6762) presents the B3272*A/G/T series of DC-link film capacitors. These are qualified for continuous operation at case temperatures of up to +135 °C, with no derating required up to +105 °C. These components feature an EPN dielectric. This blend of polypropylene (PP) and cyclic olefin copolymer (COC) has already been proven in TDK’s ModCap UHP power capacitors. This allows DC-link designs for demanding automotive and industrial power electronics applications to have greater thermal headroom.

On-board charging units, xEV traction inverters, DC-DC converters, industrial drives, and high-end power supplies must operate reliably even as power density increases, in confined spaces, and at higher ambient temperatures. These constraints subject passive components to growing thermal and electrical stress. The B3272*A/G/T series is designed to meet the demands of such applications.

The series spans rated DC voltages from 800 to 1200 V and rated capacitance values from 1.0 to 60 µF, with three lead spacings: 27.5 mm, 37.5 mm, and 52.5 mm (B32728G, 4-pin). The 4-pin G-types support low-inductance busbar interfaces and help reduce parasitic loop area in fast-switching inverter stages, while the low-profile T variant addresses height-constrained layouts in compact automotive and industrial assemblies.

The flame-retardant plastic case and epoxy resin sealing both comply with UL 94 V-0. The series is AEC-Q200E qualified and RoHS-compatible, supporting global use in automotive and industrial converters where thermal headroom, reliability, and compact integration must be optimized together.

For the B3272*A/G/T series, TDK provides various SPICE model libraries and the web-based Capacitor Life And Rating Application (CLARA) tool.

TDK Corporation (TSE:6762) has expanded its B43645, B43657, B43658, B43659, B43660, and B43661 series of ultra-compact snap-in aluminum electrolytic capacitors to meet the specific needs of advanced AI server power supply units (PSUs) and high-performance SMPS applications. Additionally, the rated DC voltages were raised to 500 V. With diameters ranging from just 22 mm to 35 mm and lengths between 25 mm and 100 mm, these capacitors deliver high voltage capability in an exceptionally compact form factor. For high-performance power supplies, this translates to higher power densities, improved reliability, and greater design flexibility—critical for supporting the continuous, high-load operation typical in AI data centers. This enables smaller, more efficient systems without compromising electrical or thermal performance. 

These extended-voltage series cover capacitances from 80 µF to 2060 µF, handle high ripple currents up to 5.39 A, and deliver a service life of up to 5,000 h at +105 °C. Their ultra-compact CV design minimizes footprint, while robust aluminum-can construction with PET sleeve, secure snap-in pins, and integrated pressure relief ensures durability. All types are RoHS-compliant and vibration-tested per IEC 60068-2-6. 

The web-based AlCap Tool quickly and easily calculates accurate lifetime under application-specific conditions.