• TDK presents DigiKey with the “Global Best Performance Award” 2025
• Award recognizes strong business performance and long-standing collaboration
• Signs of a recovery in the distribution business

TDK Corporation (TSE:6762) has honored the globally active high-service distributor DigiKey with this year’s “Global Best Performance Award,” thereby recognizing its outstanding business performance and the successful collaboration over the past year. DigiKey impressed in particular with its strong international orientation and its ability to reliably serve customers worldwide. Of particular importance was the fact that DigiKey is firmly established in the Chinese and U.S. markets. In addition, the company has the capability to supply developers, design houses, as well as medium-sized enterprises with small quantities, thereby enabling production ramp-ups.

“DigiKey is extremely honored to receive the 2025 Global Best Performance award from TDK,” said Jason Simoneau, Vice President, Passives and Multimarket Semiconductor at DigiKey. “Our long-standing partnership with TDK has provided customers around the globe with exceptional technologies to create innovative products that accelerate progress. We look forward to continued collaboration and growth centered on TDK’s comprehensive, innovation-driven portfolio of cutting-edge electronics.”

“I am very pleased with the outstanding performance of DigiKey as one of our long-standing partners with whom we collaborate strategically,” says Dietmar Jäger, General Manager Distribution & EMS Sales Division. “This shows that even in a challenging market environment, success is possible with a strong team,” adds Dietmar Jäger.

Electronics distribution is currently showing clear signs of a recovery. “The delivery of small quantities to small customers can be an early indicator of a broader market recovery,” says Dietmar Jäger. “We are well positioned with our products for the markets we serve through distribution, particularly AI applications in China and industrial applications in the U.S.” China remains the most important market, followed by the U.S. and Europe.

Complex test cycles on hardware prototypes once measured hotspots, resonances, and current peaks. Today, engineers simulate them. TDK provides free tools like CLARA and CapThermal that engineers can use to virtually examine film capacitors – from individual components to complete DC links. No prototype required. This saves time and money and gives you a competitive edge.

Power electronics engineers must get designs right the first time. Simulation and digital modeling—digital twins—are now essential. For film capacitors—key components in DC links, filters, and inverters—TDK provides a comprehensive suite of web-based design tools like CLARA and CapThermal that help engineers predict performance with high confidence.

These tools are backed by sophisticated models derived from real-world testing. A rigorous process combines electromagnetic and thermal analysis to bridge the gap between physical behavior and digital prediction.

From real-world testing to digital twins

As Industry 4.0 and digital twin concepts advance, engineers get deeper insights into the components they use. Therefore, TDK is digitizing its capacitors through finite element analysis (FEA), capturing electromagnetic and thermal characteristics in great detail.

To ensure these models mirror real performance, TDK uses a "test-simulation-model" approach based on three key steps:

1. Representative testing: Selected samples from the standard series undergo electromagnetic and thermal testing under tightly controlled conditions.
2. Simulation alignment: Simulations replicate the conditions of the representative testing, and models are fine-tuned until test and simulation results align.
3. Model creation: Once validated, the model is expanded to represent the entire series for real application use.

Figure 1 illustrates the complete workflow—from geometry input to simulation output. TDK applies this process not only to standard series but also to customized capacitor designs and customer-specific projects.

Virtual characterization: understanding every detail

The physical parameters of the capacitor—geometry, rated voltage, current, and temperature—drive electromagnetic simulations that map loss distribution in 3D. From this, TDK generates SPICE models that allow engineers to simulate capacitor behavior within a converter circuit.

Thermal simulations build on this data, using computational fluid dynamics (CFD) to evaluate temperature distribution and hotspot formation under realistic boundary conditions.

These simulations ultimately form the backbone of TDK's CLARA (Capacitor Life And Rating Application) platform, which includes practical tools such as Capacitor Banks and CapThermal. Each tool helps engineers visualize and optimize capacitor performance without lengthy test cycles.

Figure 1:

Digitalization flowchart

Figure 2:

Examples of ESR and ESL curves obtained by simulation (virtual characterization) and test

 

 

 

The power of electromagnetic modeling

Electromagnetic modeling is the cornerstone of TDK's digitization process. Unlike thermal modeling, which follows well-established steady-state methods, electromagnetic simulation requires a deep understanding of current flow, parasitic effects, and internal field distribution.

Through virtual characterization, engineers can accurately determine impedance (|Z|), capacitance (C), equivalent series resistance (ESR), and inductance (ESL) across frequencies—all without fabricating a single prototype. Figure 2 compares ESR and ESL curves from virtual and physical measurements, showing near-perfect correlation.

This approach also accounts for manufacturing tolerances and aging effects, allowing users to explore both nominal and worst-case performance scenarios.

Including temperature effects: thermal modeling

Temperature affects a capacitor's electrical performance, mainly through the thermal coefficient of resistance (TCR) in the metallization layers. While the properties of bulk metals are well-known, thin metallized films behave differently.

Figure 3:

Increase in losses caused by the TCR, considering representative application conditions (current spectrums) from ambient temperature to representative application temperatures 

TDK has characterized the TCR across the various elements inside a capacitor, ensuring that virtual models reflect temperature-dependent losses accurately. Depending on the application—DC-link, filter, or PCB-mounted—the TCR influence varies (Fig. 3), helping engineers predict how performance evolves under real operating conditions.

SPICE-equivalent models: bridging physics and simulation

SPICE remains the standard tool for electronic circuit simulation. But accurate results depend on precise component models. TDK's SPICE-equivalent models combine mathematical accuracy with computational efficiency, representing real capacitors across both time and frequency domains (Fig. 4).

Figure 4:

Simplified capacitor model

Each model includes enough elements to mimic real-world behavior without slowing simulations. These models are not limited to single components; they can describe complete DC-link systems, PCB assemblies, or custom configurations (Fig. 5).

TDK provides SPICE models for all standard film capacitor series via its website and CLARA platform. Custom models can also be generated upon request, giving engineers the confidence to simulate real capacitor behavior directly within their converter design.

Figure 5:

Comparison of ESR and ESL curves between measurement, simulation, and equivalent spice modeling

 

 

 

 

Figure 6:

Structure of the analyzed capacitor (left), ESR curve and current analysis (upper right), and thermal simulation results at 10 kHz, 37 kHz, and 60 kHz (lower right)

Revealing hidden interactions

Electromagnetic simulation visualizes hidden interactions inside the capacitor. Engineers can detect phenomena such as skin effects, uneven impedance distribution, or internal resonances—effects that are hard to capture through measurement alone.

For example, Figure 6 illustrates how resonances inside a cylindrical capacitor can cause current peaks in its individual capacitive elements, while the total external current remains unchanged. This kind of insight helps developers to avoid unwanted resonances and improve overall system reliability.

Validating through thermal testing and simulation

Thermal modeling follows the same philosophy depicted in Figure 1: test first, simulate next, then model. Real-world conditions are difficult to reproduce, so thermal simulations are essential. They let engineers analyze internal temperature points that are impossible to measure physically.

TDK's Capacitor Bank Simulator within CLARA combines CFD and empirical data to predict the temperature rise of capacitor arrays based on geometry, cooling airflow, and mission profile parameters. Figure 7 shows a sample output for 5 xEVCap in parallel, where the tool calculates the temperature distribution across all units.

Figure 7:

Capacitor banks simulation result

CapThermal: fast insights without heavy simulation

For engineers who need quick thermal insights, TDK developed CapThermal—a simplified, web-based tool that emulates the results of a full FEA simulation. By entering boundary conditions such as losses, ambient temperature, and cooling, users instantly receive hotspot and surface temperature maps (Fig. 8).

CapThermal makes professional-grade thermal analysis accessible to everyone, allowing designers to select the optimal capacitor for their conditions and even explore ways to extend lifetime through better cooling or placement.

Figure 8:

CapThermal example simulation result

Figure 9:

Thermal integration simulation

Thermal integration: seeing the full picture

In automotive and other high-power applications, capacitors rarely operate in isolation. They share their environment with semiconductors and cooling systems. TDK's thermal integration approach takes this into account by simulating the entire subsystem, for instance, the DC-link capacitor, semiconductor modules, and coolant flow path together.

This approach delivers a more accurate picture of real operating temperatures, since component interactions and heat exchange are directly modeled (Fig. 9). As a result, engineers gain a realistic view of how capacitors behave in full systems, not just in isolation.

The road to fully digital design

TDK's ongoing digitization initiative aims to transform every standard capacitor series into accurate, validated digital models. These resources—available through the CLARA platform—include SPICE models, capacitor bank simulations, and now CapThermal for thermal simulation.

By combining electromagnetic, circuit simulation, and thermal modeling techniques, TDK enables engineers to design smarter, faster, and with greater confidence. The result: fewer prototypes, shorter development cycles, and optimized capacitor use in every application—from industrial drives and renewable energy to automotive power electronics.

Fernando Auñón, Fernando Rodríguez, Sergio Sepúlveda, David Olalla TDK Electronics
 

References

[1] S. Chowdhury, E. Gurpinar, and B. Ozpineci, "Capacitor Technologies: Characterization, Selection, and Packaging for Next-Generation Power Electronics Applications," IEEE Transactions on Transportation Electrification, vol. 8, no. 2, pp. 2710–2720, 2022.

[2] H. Wang et al., "A Thermal Modeling Method Considering Ambient Temperature Dynamics," IEEE Transactions on Power Electronics, vol. 35, no. 1, pp. 6–9, 2020.

[3] V.V.R. Narashimha Rao et al., "Electrical resistivity, CR and thermo electric power of annealed thin copper films," Journal of Physics D: Applied Physics, vol. 9, no. 1, 1976.

[4] M.F. Staniloiu et al., "SPICE model of a real capacitor: Capacitive feature analysis with voltage variation," 2020 International Conference and Exposition on Electrical and Power Engineering (EPE), 2020.



 

• Ultra-compact micro POL module FS3303 delivers 3 A in a 2.5 × 2.5 mm footprint with only 1.2 mm height, enabling high-density power for optical modules and AI edge systems
• High efficiency up to 95% with operation up to +90 °C (and +125 °C with derating), supporting low-voltage rails from 0.4 V to 3.3 V for ASICs, SoCs, DSPs, and AI chipsets
• Integrates controller, driver, MOSFETs, and inductor in TDK’s advanced 3D chip-embedded package, minimizing external components and maximizing board space savings

TDK Corporation (TSE: 6762) today announced the FS3303, the first member of a major expansion of its micro POL family of ultra‑compact, non‑isolated DC‑DC power modules for optical modules in AI edge systems and other space‑constrained designs. Despite its small footprint of just 2.5 x 2.5 mm and a height of only 1.2 mm, the FS3303 can deliver 3 A at ambient temperatures of up to +90 °C (up to +125 °C with derating) and boasts a peak efficiency of around 95%. The FS3303-0400-AL is in full production and is sampling at major distributors.

The FS3303 and the upcoming high‑performance point‑of‑load (POL) converter lineup spans 3 A to 80 A output across 0.3 V to 3.3 V rails. They enable next‑generation optical networking and AI accelerator platforms to push performance without sacrificing board space. An example is compact optical modules, which are scaling from 10 Gbit/s to 1.6 Tbit/s. The new portfolio delivers height profiles between 1.2 mm and 1.7 mm.

Engineered for low‑voltage rails, the FS3303 supports input voltages from 2.7 V to 6 V and output voltages from 0.4 V to 3.3 V. This makes it a versatile solution for ASICs, SoCs, DSPs, and emerging AI chipsets requiring tight regulation and high transient performance.

The FS3303 leverages TDK’s proprietary 3D chip‑embedded packaging technology, integrating the controller, driver, MOSFETs, and power inductor. This architecture minimizes external components and delivers a complete DC‑DC solution with exceptional area and height savings—ideal for next‑generation optical transceivers and edge AI modules.

• Under the motto “The power in your design”, TDK highlights technologies that enable more powerful and energy-efficient systems from June 9 to 11, 2026, at the NürnbergMesse exhibition center in Nuremberg, Germany 

• On booth 350 in hall 9, visitors can explore the latest passive component and sensor solutions for wind and solar power, industrial drives, railway traction, EV charging, electric mobility, and AI data centers 

TDK Corporation (TSE: 6762) will showcase its recent advancements in passive components and sensor solutions at this year's PCIM on booth 350 in hall 9. The fair will take place from June 9 to 11, 2026, at the NürnbergMesse exhibition center in Nuremberg, Germany. TDK’s theme for the trade show is “The power in your design,” emphasizing how TDK enables partners and customers to design more powerful systems for industrial applications, the green energy sector, automotive, and AI data centers. 

Exhibition highlights 

The power in industrial and green energy

• TDK will showcase an inverter power stack from Ingenieurbüro Hoffmann, powered by 3-kV-rated ModCap capacitors from TDK and 3.3 kV SiC MOSFETs. The system is designed primarily for energy storage systems and heavy-duty vehicles. 

• Another highlight is a 2L-B6I inverter equipped with TDK’s MKP DC-link film capacitors from the B25697* series and Infineon CoolSiC™ 2.3 kV SiC MOSFETs in XHP™ 2 modules. This reference design illustrates how TDK supports customers in developing high-performance solutions for energy storage systems, wind and solar inverters, DC fast chargers, and solid-state transformers (SSTs). 

• To demonstrate TDK’s ability to respond to evolving market needs, visitors can also explore a Dispenser Blade of the EcoG Powerblock for EV charging. Each blade integrates one 4-in-1 HVC module instead of four discrete high-voltage contactors, simplifying assembly and maintenance. 

• Also on display is a 280 kW eCAV (commercial, construction, and agricultural vehicles) traction inverter reference design from Infineon, featuring TDK’s xEVCap in the DC link. 

• Visitors can learn more about how TDK supports efficient and reliable thermal management with its temperature and pressure sensors. These can be implemented directly in fluid circuits, offering fast response times, robust signal stability, and easy integration.

The power in automotive 

• Using a state-of-the-art traction motor, TDK will showcase its temperature and pressure sensors alongside embedded motor controllers and Hall- and TMR-based magnetic-field sensors – including current sensors – supporting a broad range of e-motor functions such as rotor position sensing, resolver replacement, and current measurement. The newly released TMR TAS magnetic sensors deliver zero-latency, high-bandwidth analog sensing in a compact footprint, offering a powerful and cost-effective alternative to inductive and resolver solutions.  

• In cooperation with Infineon and Shin‑Etsu Silicones Europe, TDK will exhibit a 300 kW traction inverter demonstrator, featuring four xEVCap film capacitors in the DC link and the CarXield as an EMC filter. Infineon contributed the reference inverter platform based on EconoDUAL™ 3 power modules, and Shin‑Etsu provided adhesives and gap fillers used for mechanical fixation and thermal coupling. 

• The new smart AlN multilayer substrates demo will give visitors a close-up view of this advanced thermal management technology. Key characteristics of AlN (aluminum nitride) include its high thermal conductivity compared to other ceramic substrate materials and its coefficient of thermal expansion (CTE), which closely matches today’s power semiconductor materials, including silicon and silicon carbide (SiC). 

• On the booth, visitors can see the “Tiny Power Box 2”. This 11-kW bidirectional on-board charging (OBC) unit from Silicon Austria Labs is equipped with dozens of CeraLink capacitors from TDK. This OBC supports both three-phase and single-phase operation (at lower power) and incorporates a DC-DC converter with an isolated 14-V output. 

• Another automotive highlight is Infineon’s cost-competitive IDEA traction inverter reference design, featuring TDK’s xEVCap in the DC link, TDK’s InsuGate transformers for driving the transistor gates, and the IDPAK discrete products from Infineon. 

The power in AI data centers 

The claim “From grid to core” underpins TDK’s approach to serve the entire power infrastructure for AI data centers with passive components, sensor solutions, and DC-DC converters. Besides the core application, the PSU (power supply unit), AI-related UPS (uninterruptible power supply), and BESS (battery energy storage system) are booming. The same applies to the point-of-load conversion next to the processor. For all these sub-applications, TDK has a comprehensive portfolio of solutions. And looking into the future, the solid-state transformer (SST) technology is in the starting blocks. 

• On the booth, visitors can explore how TDK’s ultra-compact aluminum electrolytic snap-in capacitors enable Infineon’s PSU reference designs to deliver 8 kW and 12 kW to AI servers in a very small footprint. 

• TDK will also showcase how the MKP DC-link capacitors align well with the modular concept of SSTs. 

• Another highlight is the high-voltage contactors like the HVC29, ensuring safety in 800 V DC distribution environments. 

• Also on display will be TDK's µPOL converters. This modular point-of-load solution can be stacked to deliver up to 200 A for FPGAs, SoCs, or ASICs, and is suitable for vertical power delivery architectures in AI systems. 

The power in EMC testing 

TDK is in the final phase of constructing a significantly larger EMC lab in Regensburg, Germany. The new accredited site will cover almost 1,700 square meters, including 1,100 square meters dedicated to laboratories and measuring stations. It will also include a showroom and a large customer area with meeting rooms. At PCIM, visitors can learn more about the new lab and TDK’s EMC services. 

At the booth, visitors can also explore TDK’s own absorbers, including tiles and pyramids, as well as sine-wave filters for up to 720 A and 2-line filters for power electronics applications of up to 1500 V/1600 A. 

The power in expertise 

TDK experts will share detailed technical insights into key technologies for e-mobility, energy storage, AI data centers, and solid-state transformers. The presentations demonstrate how TDK’s component and system expertise helps customers address design challenges and accelerate the development of next-generation power electronics.  

• David Olalla, xEVCap Next Level: Capacitor Bank and Thermo-Mechanical Evaluation of a Powertrain Inverter, June 10, 4:15 PM, E-Mobility & Energy Storage Stage, Hall 6, Booth 220 

• Anirban Roy, Technologies Powering the Shift to Solid-State Transformers: How TDK Technologies Enable the Transition, June 11, 10:00 AM, AI & Data Centers Stage, Hall 5, Booth 320 

• Alberto Espinar, xEVCap Next Level: Capacitor Bank and Thermo-Mechanical Evaluation of a Powertrain Inverter, June 11, 11:15 AM, Poster Session, Hall 4A 
   

Further information on TDK’s appearance at PCIM can be found at www.tdk-electronics.tdk.com/en/3474864/company/tradeshows-events/pcim

• State-of-the-art solutions for measuring electromagnetic compatibility (EMC)

• Focus on automotive and industrial electronics

After nine months of construction, the new EMC laboratory of TDK Electronics in Regensburg is celebrating its topping-out ceremony. This traditional event marks the completion of the building’s rough construction, and includes a heartfelt thank you to the craftspeople involved for their work, as well as a light meal for everyone. A total of about 50 guests attended, including employees from the architectural firm, various construction companies, and the City of Regensburg’s Economic Development Office.

Dr. Stefan Weber, project manager for the construction of the new EMC laboratory, thanked everyone involved for their work and support. “I am very pleased that we are able to celebrate the topping-out ceremony for our new EMC laboratory here today. The interior work is also progressing well, so I am confident that we will be able to officially open the laboratory this fall.” 

Juergen Roumen, Deputy General Manager of the Magnetics Business Group, to which the laboratory belongs, went on to emphasize that the new facility would serve as a central hub for working with customers to quickly and efficiently resolve any electromagnetic compatibility (EMC) issues. “The new laboratory will thus serve as a starting point for many innovative projects.” 

EMC as an indicator of safety and quality 

Covering an area of approximately 1,700 square meters, the new facility offers both internal and external customers state-of-the-art capabilities for measuring electromagnetic compatibility. EMC refers to the ability of electrical devices to function properly in their environment without interfering with other devices or being interfered with by them. The increasing amount of electronics in both the private and industrial sectors makes EMC a critical factor in safety and quality. 

The laboratory comprises three anechoic chambers of different sizes, in which vehicles, industrial applications, and RF and wireless applications can be tested. All chambers utilize state-of-the-art TDK anechoic technology and measurement systems. The EMC laboratory thus also serves as a showroom for the technologies and services TDK offers in this field, ranging from the design and planning of the facilities and their equipment to turnkey solutions. 

• TDK introduces SensorStageTM software – a complete evaluation platform that simplifies and accelerates SmartMotion® IMU development through advanced visualization and automated workflows
• SensorStage permits seamless evaluation of complex on-chip features, including ML algorithms, sensor fusion, and power optimization, cutting development time and improving system performance
• Designed with a future-proof architecture, SensorStage supports both current and next-generation sensors for applications such as smart glasses, wearables, OIS, and IoT

TDK Corporation (TSE:6762) announces a new comprehensive sensor evaluation tool, InvenSense SensorStage^TM, designed to simplify and accelerate the development workflow for the company’s latest SmartMotion^® IMUs. This all-in-one platform bridges the gap between simple GUIs and custom test benches, offering advanced visual analytics and automated scripting to help engineers move from setup to insight without the traditional bottlenecks of manual configuration. By providing a future-proof architecture that supports existing and upcoming high-performance sensors, SensorStage enables seamless evaluation of complex on-chip algorithms for next-generation applications in OIS, wearables, AR/Smart Glasses, and IoT.

“Inertial sensor development has traditionally required extensive hands-on experience and deep expertise. But SensorStage speeds and simplifies this process with its data analysis platform and prebuilt sensing features,” said Rosa Chow, Software Vice President, InvenSense, a TDK group company. “With SensorStage, customers can more easily tailor workflows to their exact needs, for rapid iteration and optimization, which dramatically accelerates their time-to-market.” 

The SensorStage platform provides a unified environment for evaluating the latest features of TDK’s MEMS IMUs and TMR magnetometers. Paired with SmartMotion development board, sophisticated on-chip features—including Machine Learning (ML) algorithms, the APEX engine for Gyro Assisted Fusion, motion and event detection, and chip-level power consumption—are visualized, allowing for precise calibration and faster time-to-market for complex designs.

SensorStage is currently available for InvenSense SmartMotion IMUs ICM-456xx and ICM-426xx, and will soon be available for additional InvenSense MEMS sensor solutions. Learn more at https://invensense.tdk.com or e-mail inv.sales.us@tdk.com.

• Addresses key scalability barriers and deployment challenges inherent to intelligent edge IoT solutions.   
• Improves scalability by generating large and diverse datasets that accelerate the development of AI solutions for edge applications.  
• Reduces dependency on real data from 80% (market standard) to 10%, enabling accelerated innovation and faster time-to-deployment.

TDK Corporation (TSE:6762) announces advancements in sensor technology that optimize and accelerate the deployment of smart IoT solutions, SensorGPTTM. This technology uses generative AI, signal processing, statistical methods, and simulations to create and manage sensor data at scale. TDK’s SensorGPT will empower both the smart IoT market and the emerging Ambient IoT market segment to overcome key scalability challenges. It streamlines model development and deployment, cutting both time and cost, and significantly enhancing the performance and efficiency of edge AI models and applications.

Data is the bedrock of intelligence in smart edge systems – yet today, data collection consumes more time than building the intelligence it is meant to power. Nearly 80% of AI solution development time is spent on data collection and curation (Forbes). As the demand for edge AI continues to accelerate, projected to become the standard in 2026 (Gartner), data availability has become the primary barrier to scalability. SensorGPT directly addresses this challenge by reducing reliance on real-world data through intelligent sensor data synthesis, cutting data collection efforts from 80% to nearly 10%, and enabling faster, more scalable edge AI development.

Synthesizing sensor data with AI

By using advanced techniques to expand and enhance existing datasets, edge AI model building time that takes months can be reduced to weeks, said Jim Tran, Corporate Officer and General Manager, Americas HQ and Deputy General Manager, Technology & Intellectual Property HQ.
TDK USA Corporation. “By tapping into generative AI modeling, simulation, and more, engineers can use AI to generate additional, high-quality data that reflects real-world conditions — turning data into a scalable resource.”

SensorGPT data synthesis technology advancements:

• Generative AI models: train generative models over limited real-world data to learn underlying patterns and generate high-quality synthetic data that faithfully mimics real-world data.
• Physics-based simulation models: leveraging physics-based and mathematical models to simulate and generate synthetic sensor data.  
• Signal processing methods: employing mathematical and computational techniques to simulate data reflecting the dynamics and characteristics of real sensor outputs.
• Data augmentation techniques: automatically transform existing sensor data into rich, diverse datasets spanning a wide range of conditions and scenarios.
• Assisted annotation: streamline the labeling of training data, increasing its usefulness and quality for model training.

SensorGPT generates 90% similarity between synthetic and real-world sensor data, enabling the use of the synthetically generated data for faster edge AI solution deployment. Once deployed, it drives a virtuous cycle of feedback-driven improvement in which real-world data progressively refines and strengthens synthetic models over time, which in turn leads to more efficiently deployed models.

Differentiation of SensorGPT to existing technologies: 

• Improve scalability by generating large and diverse datasets that quickly help to create AI solutions for edge applications.
• Faster innovation and accelerated development by providing quick access to data for prototyping, testing, and deploying initial models.
• Customizability by providing tools to tailor data to specific sensors, smart IoT applications, and real-world scenarios and conditions they operate in.
• Enabler for edge intelligence intercepting the growing demand for quality data for smart edge AI applications.  

TDK’s new SensorGPT ultimately accelerates prototyping and proof of concepts, enabling orders-of-magnitude dataset size expansion, depending on the application and use case, significantly reducing edge AI model building time from 5+ months down to a few weeks. 

Norvento Enerxía needed more than just a suitable DC link capacitor to fit a hermetically sealed 8-megawatt inverter into a standard 20-foot container. The developers at the Spanish renewable energy specialist needed certainty that the design would operate stably under all operating conditions. TDK provided both, offering the ModCap UHP as the basis for the DC link and performing detailed simulations. This saved several months of development time.

"The primary design objective for the nXL was full encapsulation, which means there is no air exchange between the inside of the converter and the environment." This is how Ángel Mayor, the head of innovation at Norvento and the chief developer of the converter, describes the key challenge. This type of encapsulation makes sense because central inverters in photovoltaic systems and large battery storage facilities often operate in challenging environments. These include areas with high humidity, salty air, and metal particles, such as mining sites, as well as regions with active volcanism. Additionally, encapsulated systems require minimal maintenance since filter mats do not need to be replaced regularly. Liquid cooling should ensure thermal management.

However, this design objective has a significant impact on key components, such as the DC link capacitor. TDK provided more than just a suitable component; they also provided technical expertise and service.

Figure 1:

The nXL converter from Norvento Enerxía for 7 to 8 MW, including transformer and medium-voltage switchgear

Challenges in the development process

The DC link solution for the nXL had to meet three key requirements:

• Low equivalent series resistance (ESR) across the frequency range to minimize losses,
• low equivalent series inductance (ESL) to prevent excessive voltage overshoot when the semiconductors are turned off, which will become even more important when fast-switching SiC MOSFET modules are used in the future, and
• high operating temperatures.

Figure 2:

TDK's ModCap UHP can deliver full output power up to +105 °C.

“In addition, modularity was another important factor for us, as we needed a solution that could be flexibly adapted to different configurations,” adds Mayor. That’s why ModCap from TDK, a long-standing partner of Norvento, was the obvious choice.

However, film capacitors with polypropylene as the dielectric must be derated in terms of output power at temperatures above +85 °C. This also applies to previous ModCap variants. This is why TDK developed the ModCap UHP. It uses a new type of dielectric called EPN (ethylene propylene norbornene), which enables the component to deliver full power at temperatures up to +105 °C [1]. EPN is a blend of polypropylene (PP), an established, easily processed dielectric, and cyclic olefin copolymer (COC), a dielectric with greater heat resistance. However, COC alone cannot be formed into a film. Therefore, it is blended with polypropylene. The resulting material can be processed like polypropylene while offering the high-temperature resistance of COC.

Nevertheless, questions remained. How is the current distributed among the individual ModCaps on the busbar at higher frequencies? How is the current distributed among the capacitor windings within the component at higher frequencies? How do losses develop over frequency? TDK's simulation expertise helped Norvento.

Shorter time to market

“One of Norvento’s main concerns was how the current would be distributed among the 18 ModCaps—six per phase—that make up the DC link,” recalls Fernando Rodríguez of TDK’s Applications and Development Group in Málaga. Another concern was whether high-frequency oscillations would have a negative effect, such as resonances related to the dimensions of the busbar. To address these concerns, TDK proposed characterizing the entire DC link digitally and using finite element analysis (FEA) to simulate the current distribution. The result: The busbar design, when combined with ModCap UHP capacitors, remains within specifications across the entire operating frequency range of the application. 

The main advantage of using FEA is that the results are available before any prototype is built. This largely eliminates the need for lengthy durability and stress tests. "In this case, the simulation saved an estimated two to three months of development and testing time," says Rodríguez, summarizing the approach.

"By running simulations early in the project, we optimized the power distribution in the DC link and ruled out potential resonances in advance. This shortened the time to market for Norvento and ensured that the design was sound from the beginning.”

Fernando Rodríguez, Applications and Development Group at TDK

Support: the key to success

Only a team of experienced specialists could fit a hermetically sealed 7 to 8 MW converter, including a transformer and medium-voltage switchgear, into a standard 20-foot container. "The key to success," says Álvar Mayor, "was not only the right DC link capacitor, but also the technical support, especially during the simulations." The nXL can operate in grid-following mode or as a grid-forming system. This makes it ideal for microgrids or systems where grid stability is not guaranteed.

“The collaboration with TDK was excellent and always proactive. We learned a lot from each other during this project. The technical support, especially with the simulations, was key to our success.”

Álvar Mayor, Head of Innovation at Norvento and lead developer of the nXL

Outlook

For Norvento, the nXL is a turning point. With an unmatched power density and the ability to integrate 7 to 8 MW into a standard 20-foot container, the company can now compete with major international power electronics manufacturers. However, development is not yet fully complete. Right from the beginning, the nXL's architecture was designed for SiC MOSFET modules — an upgrade that will further challenge the requirements for the DC link. However, thanks to the comprehensive simulations carried out at TDK, this upgrade path has already been paved.

Achieving such a compact, reliable system would not have been possible without the right combination of components and partners at the right time. TDK's ModCap UHP, with its innovative high-temperature dielectric and patented high-frequency internal structure, and the accompanying FEA simulation service, demonstrate this synergy between component-level expertise and system understanding. Those facing similar challenges will find both at TDK.

References

[1] Power Capacitors: The New ModCap Likes It Hot, https://www.tdk-electronics.tdk.com/en/373562/tech-library/articles/applications-cases/applications-cases/modcap/3660166, TDK, retrieved March 16, 2026

TDK Corporation (TSE: 6762) presents the B82722V6*B040 series of new compact high-voltage, current-compensated ring-core double chokes. Designed primarily for rated DC voltages of up to 1250 V (630 V AC), these compact common-mode chokes (23 x 15.5 x 24 mm) effectively suppress EMI in next-generation applications. These include power converters, industrial motor drives, and switch-mode power supplies that often deploy SiC and GaN power semiconductors and feature elevated DC bus voltages, where insulation coordination and PCB space are critical.

The series covers nominal inductance values ranging from 3.3 mH to 22 mH, with rated currents between 0.85 A and 3.0 A at a rated ambient temperature of +70 °C. Multilayer solid insulation construction and testing with voltages of 3,750 V (line-to-line) ensure robust electrical isolation. Thanks to the special automated winding technique, these chokes feature high resonance frequency characteristics and a typical stray inductance of around 0.6%, helping to suppress symmetrical interference.

The epoxy coating of the ferrite core and the plastic header comply with UL 94 V-0. The design fulfills the latest IEC 60938-2 and IEC/UL 60939-3 safety requirements for EMI chokes and filters. Suitable for wave soldering and offered in a compact vertical design, the B82722V6*B040 series enables engineers to realize 1250 V DC high-voltage architectures without increasing the PCB footprint.

• The filters achieve industry-leading* noise attenuation in the high-frequency range exceeding 5 GHz
• A newly developed low-distortion ferrite material significantly reduces audio distortion by minimizing performance variations in the audio line of small consumer devices
• Reduces attenuation of audio signals with lower resistance than conventional products, achieving a wide dynamic range

TDK Corporation (TSE:6762) has announced its latest noise suppression filters of the MAF0603GWY series. These measure only 0.6 mm x 0.3 mm x 0.3 mm (L x W x H) for use in small consumer devices like smartphones and wearables. Mass production of the new product series is set to begin in April 2026.

Electromagnetic noise radiated from audio lines in smartphones, wearable devices, and the like interferes with the built-in antenna and can reduce the receiver sensitivity. The common countermeasure is chip beads. While effective at suppressing noise, they have the drawback of degrading the audio quality on the audio line, which users may find annoying.

The new MAF0603GWY series of noise suppression filters resolves this drawback by employing a newly developed, proprietary low-distortion ferrite material. It introduces just minimal change to audio-line characteristics and significantly reduces audio distortion, eliminating the sound-quality degradation that occurs when chip beads are used. It provides industry-leading high attenuation in the 5-GHz band (impedance up to 3220 Ω at 5 GHz), effectively suppressing noise. Compared with conventional products, it also features lower resistance to reduce attenuation of audio signals and realizes a wide dynamic range.

TDK will continue to contribute to the industry by offering a broad lineup of noise suppression filters and technical support that reconcile audio-quality preservation with electromagnetic-noise countermeasures for mobile and wearable devices with communication functions.

*    As of April 2026, according to TDK.

TDK Corporation (TSE:6762) announces that TDK will start manufacturing advanced sensors for various Apple products in the US. Built on a partnership spanning more than 30 years with Apple, this initiative will allow both companies to reinforce their advanced sensors manufacturing capabilities via Japan–U.S. collaboration and, by producing at U.S. facilities, contribute to a more reliable sensor supply chain. In the context of Apple’s current American Manufacturing Program initiative, this is the first time a Japanese company will produce components for Apple in the US. 

TDK has been collaborating with Apple not only on the development of next-generation sensors to enhance mobile functionality, but also on many other devices such as electronic components and rechargeable batteries.  

“TDK is a long-time partner and we’re excited they’ve joined our American Manufacturing Program,” said Sabih Khan, Apple’s COO. “Apple is committed to working with suppliers — like TDK — to manufacture even more in the US, and this initiative is another powerful example of how much we can achieve together when we invest in advanced American manufacturing.” 

Regarding the mutual collaboration, TDK President and CEO Noboru Saito commented: “Based on the decade-long relationship with Apple, when Apple asked what more we could do in the United States beyond our existing relationship, we TDK saw that as an opportunity to grow our relationship even more, and in new ways. We are very proud to be working with Apple to accelerate US manufacturing. We share their commitment to do more in the US, and our teams are working side-by-side with theirs in the US.”  
 

The recent hike in precious metal prices is putting commercial pressure on conventional multilayer piezo designs that use silver. In addition to increasing costs, silver is the primary cause of failure when moisture is present. By using copper instead of silver, TDK offers a compelling solution to both challenges.

As of early March 2026, the price of precious metals was near record highs. Silver has surged by more than 100% in the past six months [1] (Fig. 1a). In such a turbulent market, TDK’s patented High Active Stack (HAS) technology [2], which is copper-based, shields manufacturers from both relentless price escalation and supply-chain instability. This is because the price of copper has increased by just 29% in the last six months [3] (Fig. 1b). This makes the high-performance HAS technology more accessible and economically sustainable.

Additionally, silver-based electrodes come with a technical drawback: they are susceptible to moisture, also known as silver migration. This can lead to reduced endurance and potential short circuits in the components, compromising reliability in damp environments. Unlike silver electrodes, copper electrodes are inherently resistant to this effect, delivering greater durability and reliability. TDK’s third‑generation copper‑stack actuators demonstrate this advantage with an exceptional lifespan of over 100 million cycles at +85 °C at 85% relative humidity, energy‑controlled for nominal elongation. This performance is made possible by a patented copper‑etching process that significantly enhances both lifetime and structural robustness.

Broad applications across industries

For over 20 years, TDK’s HAS actuators have been an integral part of automotive fuel injection systems. But they are not limited to cars. They power nano-positioning systems in semiconductor production, ensuring accuracy in wafer handling and lithography processes. In medical applications, they support devices like ultrasound transducers and drug delivery systems, where precision and humidity resistance are non-negotiable.

The PowerHap series [4], for instance, extends to haptic feedback in consumer electronics, such as wearables and VR equipment, delivering crisp vibrations [5]. Valve controls in process engineering also benefit, managing liquids and gases with exceptional speed.

Furthermore, in AI infrastructure, enabling advanced optical solutions for high-speed, low-latency data transmission in data centers. This supports the massive computational demands of AI, offering humidity-resistant reliability and cost stability essential for scalable, efficient data center operations.

A partner ready to build your copper-based piezo

What truly sets TDK apart is its full in-house expertise. At the global piezo competence center in Deutschlandsberg, Austria, the company controls every step, from design and development to prototyping and high-volume manufacturing. This complete vertical integration ensures uncompromising quality, rapid innovation cycles, and the flexibility to tailor multilayer piezo solutions precisely to customer requirements. Whether adapting an existing actuator or engineering a completely new copper-based variant.

Ready to take the next step in transforming your application using piezo actuators with copper? Reach out to us.

Get in touch: piezo@tdk.com

References

[1] https://tradingeconomics.com/commodity/silver, retrieved March 18, 2026

[2] Piezo actuators for fuel injection systems: Most reliable and cost-efficient, https://www.tdk-electronics.tdk.com/en/373562/tech-library/articles/applications-cases/applications-cases/most-reliable-and-cost-efficient/1039300, July 11, 2014; retrieved March 3, 2026

[3] https://tradingeconomics.com/commodity/copper, retrieved March 18, 2026

[4] PowerHap Piezoelectric Actuators. Fast. Precise. Immersive. https://www.tdk-electronics.tdk.com/en/2124786/products/product-catalog/switching-heating-piezo-components-buzzers-microphones/powerhap, retrieved March 3, 2026

[5] PowerHap from TDK makes AR/VR experiences more immersive, https://www.tdk-electronics.tdk.com/en/373562/tech-library/articles/applications-cases/applications-cases/powerhap/3225734, March 12, 2024; retrieved March 3, 2026

Designing a portable defibrillator, the size of a lunchbox, requires solving an engineering paradox: the smaller the high-voltage capacitor, the more energy it leaks over time. For a device that must deliver a decisive shock after months on standby, such energy loss is unacceptable. As the first capacitor prototypes from different manufacturers showed high leakage current, the question became: could this challenge even be solved?

When engineers at Corscience set out to create the world's smallest automatic external defibrillator (AED), they faced a fundamental engineering paradox: they needed a high-voltage capacitor that was both incredibly compact and remarkably reliable. The challenge would require more than off-the-shelf components; it demanded innovation at the material level. The specifications set by the defibrillation experts from Erlangen were demanding: stable capacitance at 2 kV, delivering the required therapeutic level of stored energy through a biphasic truncated exponential discharge.

But size wasn't the only constraint. It’s crucial for a defibrillator that the capacitor maintains its charge over extended periods. Any significant leakage current could mean the difference between a functioning defibrillator and a failed rescue attempt. "It is literally vital that the AED is still able to provide the energy for defibrillation after months in standby at different ambient temperatures, like in your car," explains Manuel Seufert, Team Lead Defibrillation, Shock & Analysis at Corscience.

"It is literally vital that the AED is still able to provide the energy for defibrillation after months in standby at different ambient temperatures, like in your car," explains Manuel Seufert, Team Lead Defibrillation, Shock & Analysis at Corscience.

An automated high-voltage capacitor test bench was used for a comprehensive evaluation of all relevant capacitor parameters

This requirement created a classic engineering trade-off for TDK: thinner dielectric foils enable smaller capacitor dimensions, but they also increase leakage current. Aluminum electrolytic capacitors require series connections with balancing resistors that continuously discharge the stored energy – unacceptable for this compact AED. Ceramic capacitors face similar limitations. Only film capacitors could meet the demanding voltage and reliability requirements and were the clear choice over ceramic or electrolytic alternatives. To verify this, Corscience developed an automated high-voltage capacitor test bench. The system enables comprehensive evaluation of all relevant capacitor parameters across large sample sizes and under varying temperature conditions. However, initial samples from several manufacturers either exhibited excessive leakage current or exceeded the allowable dimensions. As a result, moving forward required close and in-depth collaboration.

TDK and Corscience sat down to dissect the requirements in detail, combining TDK's expertise in capacitor manufacturing with Corscience's extensive experience in defibrillation technology. The second iteration samples were significantly better than comparison types from other manufacturers. "Our collaboration has been a remarkable fusion of innovation and purpose," notes Anderson Estancovich, the product marketing manager responsible at TDK. "Together, we've not only engineered the smallest AED on the market but also redefined what's possible in medical technology. This makes critical care more accessible, discreet, and patient-friendly than ever before." The partnership extended beyond just component development. Corscience supported the implementation of a dedicated test bench for future high-voltage capacitors at TDK, enabling real-world simulation and validation of long-term stability.

"Together, we've not only engineered the smallest AED on the market but also redefined what's possible in medical technology. This makes critical care more accessible, discreet, and patient-friendly than ever before," notes Anderson Estancovich, the responsible product marketing manager at TDK.

"TDK is a manufacturer with a 'We can do it' mentality," reflects Maciej Postek, Corscience Project Team Lead.

"TDK is a manufacturer with a 'We can do it' mentality," reflects Maciej Postek, Corscience Project Team Lead. "By combining TDK's expertise in capacitor manufacturing with our knowledge of defibrillation, we were able to develop the perfect capacitor for miniaturized AEDs." This custom film capacitor combines high energy density and exceptional reliability in an ultra-compact design. It demonstrates what’s possible when two experts come together to create innovative solutions for future generations of highly sophisticated medical devices.

TDK Corporation (TSE: 6762) has introduced the MT40 series of ThermoFuse varistors (ordering code B72240M), a new generation of surge protection components (SPC) that combine a compact design with advanced safety features. Thanks to their patented overmolding technology and integrated thermal disconnecting system, these SPCs provide robust protection up to 50 kA while minimizing size (38.0 x 15.2 x 40.9 mm; L x W x H). Consequently, the MT40 series is commonly used in inverters, industrial power supplies, outdoor lighting, telecommunications systems, and surge protection devices (SPDs).

Designed for extreme electrical conditions, the MT40 series has a peak surge current capability of up to 50 kA (8/20 μs pulse) and a short-circuit current rating of up to 200 kA. The series is recognized as a UL 1449 Type 1CA component assembly, designed for use in applications with AC voltages ranging from 150 V to 550 V and DC voltages spanning from 200 V to 750 V. Additional features, such as a galvanically insulated normally open micro-switch for remote monitoring and an optional visual indicator, enhance system integration and operational safety. These MT40 components operate in temperatures ranging from -40 °C to +85 °C.

Supporting sustainable design practices and aligning with TDK’s commitment to environmental responsibility, the MT40 series is encapsulated in a flame-retardant epoxy coating. Its RoHS compliance and lead-free materials underscore its eco-conscious profile while ensuring high reliability under demanding conditions. By combining innovation, safety, and sustainability, MT40 ThermoFuse varistors offer system designers a compact, future-proof solution for next-generation industrial and communication systems.