TDK Corporation presents with the B40640B* and B40740B* series hybrid polymer capacitors with a very high ripple current capability increased by up to 29 per cent compared to preceding types. The ripple current capability is now up to 35 A (20 kHz, 125 °C). 

TDK Corporation presents the new L860 NTC thermistor chip which can be directly embedded into power modules and used within sintering and AI-heavy wire bonding. Its characteristics correspond to the common MELF-R/T curve with R₁₀₀ of 493 Ω.

TDK Corporation extends its MiniCell^® range to include pressure transmitters in robust stainless-steel casing to measure differential pressure in industrial applications. The B58622M32* series comprises five models that measure between 0 to 500 mbar and 0 to 10 bar. Its compensated temperature range extends from -20 °C to +140 °C and the dimensions are 57 x 34 x 39 mm, including the connections.

TDK Corporation announces the release of its newly developed ADL3225VM inductors for use in automotive Power over Coax (PoC) systems. Measuring at 3.2 x 2.5 x 2.5 mm (L xW x H), these inductors provide a compact solution for designers looking to reduce vehicle weight as manufacturers add more sensors and cameras to accommodate expanding automotive and advanced driver-assistance systems (ADAS) applications.

TDK Corporation announces that Tronics AXO^®315, a miniature high-performance 1-axis closed-loop digital MEMS accelerometer, is now available for purchase at Digi-Key, Mouser and Farnell and its affiliates Newark and Element 14. The AXO315 sensor and its Arduino-based evaluation kit are now available globally from the three distributors’ websites. 

TDK Corporation presents the new C35 type pressure sensor element, designed to measure a range of 0 to 100 mbar. It combines high sensitivity with extremely low dimensions of just 2.05 x 2.05 x 1.2 mm, enabling compact pressure sensor designs.

TDK Corporation today announced the development and mass production of the MMZ1608-HE series of high-reliability chip beads for automotive use, compatible with high-durability solder in 150 ºC environments. 

TDK Corporation (TSE:6762) presents a new series of very compact EPCOS X2 capacitors for noise suppression. They are rated for 275 V AC and cover a capacitance spectrum from 33 nF to 1 µF. Depending on the capacitance value, the interference suppression components have lead spaces of 10 mm (B32921X* / Y*), 15 mm (B32922X* / Y*) and 22.5 mm (B32923X* / Y*).

TDK Corporation has expanded its CN series of multilayer ceramic capacitors (MLCCs) that are the first of their kind. The new products, 10 μF capacitance in 3216 size (3.2 x 1.6 x 1.6 mm) and 22 μF capacitance in 3225 size (3.2 x 2.5 x 2.5 mm), offer low-resistance soft termination with low terminal resistance equivalent to standard products.

TDK Corporation today announced the development of its KCZ1210AH series of miniaturized common-mode filters for automotive applications. The series is extremely compact, measuring 1.25 (L) x 1.0 (W) x 0.5 mm (H), which contributes to a smaller footprint on substrate and provides a noise control function for different transmission signal lines for automobiles.

TDK Corporation has developed the TCM0403M Series of miniaturized thin-film common-mode filters for mobile devices. The 0403 case size (0.45 x 0.3 x 0.23 mm) is 58 % smaller and 56 % lighter than previous products. 

TDK Corporation has developed a series of thin-film metal power inductors for automotive power circuits. The new TFM201210ALMA inductors feature a mounting area downsized approximately 22 % from TDK’s conventional product, TFM201610ALMA (2.0 mm (L) x 1.6 mm (W) x 1.0 mm (H)). Mass production will begin in August 2021.

TDK Corporation has extended its range of coupled inductors to include the new EPCOS series B82472D6*. The nine series types cover an inductance range of 2 x 2.2 µH to 2 x 47 µH and are designed for maximum rated currents of 1.1 A to 4.3 A. The RoHS-compliant chokes are certified in line with AEC-Q200 and feature high saturation currents of up to 7.95 A.

TDK Corporation developed new HPL505032F1 power inductors for use in automotive circuits. The inductors enable level 5 ADAS applications for cameras by offering high-current and low-inductance for power circuits in central processing units and graphic processing units, such as advanced driver-assistance systems (ADAS). 

TDK Corporation presents the EPCOS aluminum electrolytic capacitors B43706* and B43726* series with screw terminals. The new components are designed for rated voltages between 400 V DC and 500 V DC and cover a capacitance range of 820 µF to 15,000 µF.

TDK Corporation has extended its range of TVS (transient voltage suppression) diodes characterized by their extremely low capacitance values for bidirectional overvoltage protection to include the ULC series (Ultra Low Clamping & Capacitance).

TDK Corporation presents its new B32320I* series of compact cylindrical DC-link capacitors for mounting on PCBs. They are designed for voltages of 450 V DC to 1300 V DC and cover a capacitance range of 6.5 µF to 260 µF. The current handling capacity I_RMS is up to 27.6 A (10 kHz, 60 °C) and minimal ESR is 2.4 mΩ.

TDK Corporation presents a new series of very compact current-compensated EPCOS power line ring core double chokes for very high frequencies. The B82791H2*N010 series is available with current ratings from 1.5 A to 4 A at a nominal ambient temperature of +70 °C without derating, and for a nominal voltage of 250 V AC (50/60 Hz).

TDK Corporation presents a new series of EPCOS power capacitors for DC link applications. The new capacitors are available for rated voltages of 600 V DC to 2000 V DC and cover a capacitance range of 20 µF to 270 µF. The current handling capacity can be up to 60 A at 55 °C with the ability to tolerate current peaks of up to 7.5 kA.

TDK Corporation has released tiny high-power TVS diodes for ESD protection, extending its portfolio of components for bidirectional overvoltage protection of I/O interfaces. The space requirement of the so-called chip scale package (CSP) is just 400 x 200 µm² (CSP01005) or 600 x 300 µm² (CSP0201), while the package height of just 100 µm is also very low.