TDK showcases its latest industrial, automotive, and AI data center solutions at PCIM under the motto “The power in your design”

• Under the motto “The power in your design”, TDK highlights technologies that enable more powerful and energy-efficient systems from June 9 to 11, 2026, at the NürnbergMesse exhibition center in Nuremberg, Germany 

• On booth 350 in hall 9, visitors can explore the latest passive component and sensor solutions for wind and solar power, industrial drives, railway traction, EV charging, electric mobility, and AI data centers 

TDK Corporation (TSE: 6762) will showcase its recent advancements in passive components and sensor solutions at this year's PCIM on booth 350 in hall 9. The fair will take place from June 9 to 11, 2026, at the NürnbergMesse exhibition center in Nuremberg, Germany. TDK’s theme for the trade show is “The power in your design,” emphasizing how TDK enables partners and customers to design more powerful systems for industrial applications, the green energy sector, automotive, and AI data centers. 

Exhibition highlights 

The power in industrial and green energy

• TDK will showcase an inverter power stack from Ingenieurbüro Hoffmann, powered by 3-kV-rated ModCap capacitors from TDK and 3.3 kV SiC MOSFETs. The system is designed primarily for energy storage systems and heavy-duty vehicles. 

• Another highlight is a 2L-B6I inverter equipped with TDK’s MKP DC-link film capacitors from the B25697* series and Infineon CoolSiC™ 2.3 kV SiC MOSFETs in XHP™ 2 modules. This reference design illustrates how TDK supports customers in developing high-performance solutions for energy storage systems, wind and solar inverters, DC fast chargers, and solid-state transformers (SSTs). 

• To demonstrate TDK’s ability to respond to evolving market needs, visitors can also explore a Dispenser Blade of the EcoG Powerblock for EV charging. Each blade integrates one 4-in-1 HVC module instead of four discrete high-voltage contactors, simplifying assembly and maintenance. 

• Also on display is a 280 kW eCAV (commercial, construction, and agricultural vehicles) traction inverter reference design from Infineon, featuring TDK’s xEVCap in the DC link. 

• Visitors can learn more about how TDK supports efficient and reliable thermal management with its temperature and pressure sensors. These can be implemented directly in fluid circuits, offering fast response times, robust signal stability, and easy integration.

The power in automotive 

• Using a state-of-the-art traction motor, TDK will showcase its temperature and pressure sensors alongside embedded motor controllers and Hall- and TMR-based magnetic-field sensors – including current sensors – supporting a broad range of e-motor functions such as rotor position sensing, resolver replacement, and current measurement. The newly released TMR TAS magnetic sensors deliver zero-latency, high-bandwidth analog sensing in a compact footprint, offering a powerful and cost-effective alternative to inductive and resolver solutions.  

• In cooperation with Infineon and Shin‑Etsu Silicones Europe, TDK will exhibit a 300 kW traction inverter demonstrator, featuring four xEVCap film capacitors in the DC link and the CarXield as an EMC filter. Infineon contributed the reference inverter platform based on EconoDUAL™ 3 power modules, and Shin‑Etsu provided adhesives and gap fillers used for mechanical fixation and thermal coupling. 

• The new smart AlN multilayer substrates demo will give visitors a close-up view of this advanced thermal management technology. Key characteristics of AlN (aluminum nitride) include its high thermal conductivity compared to other ceramic substrate materials and its coefficient of thermal expansion (CTE), which closely matches today’s power semiconductor materials, including silicon and silicon carbide (SiC). 

• On the booth, visitors can see the “Tiny Power Box 2”. This 11-kW bidirectional on-board charging (OBC) unit from Silicon Austria Labs is equipped with dozens of CeraLink capacitors from TDK. This OBC supports both three-phase and single-phase operation (at lower power) and incorporates a DC-DC converter with an isolated 14-V output. 

• Another automotive highlight is Infineon’s cost-competitive IDEA traction inverter reference design, featuring TDK’s xEVCap in the DC link, TDK’s InsuGate transformers for driving the transistor gates, and the IDPAK discrete products from Infineon. 

The power in AI data centers 

The claim “From grid to core” underpins TDK’s approach to serve the entire power infrastructure for AI data centers with passive components, sensor solutions, and DC-DC converters. Besides the core application, the PSU (power supply unit), AI-related UPS (uninterruptible power supply), and BESS (battery energy storage system) are booming. The same applies to the point-of-load conversion next to the processor. For all these sub-applications, TDK has a comprehensive portfolio of solutions. And looking into the future, the solid-state transformer (SST) technology is in the starting blocks. 

• On the booth, visitors can explore how TDK’s ultra-compact aluminum electrolytic snap-in capacitors enable Infineon’s PSU reference designs to deliver 8 kW and 12 kW to AI servers in a very small footprint. 

• TDK will also showcase how the MKP DC-link capacitors align well with the modular concept of SSTs. 

• Another highlight is the high-voltage contactors like the HVC29, ensuring safety in 800 V DC distribution environments. 

• Also on display will be TDK's µPOL converters. This modular point-of-load solution can be stacked to deliver up to 200 A for FPGAs, SoCs, or ASICs, and is suitable for vertical power delivery architectures in AI systems. 

The power in EMC testing 

TDK is in the final phase of constructing a significantly larger EMC lab in Regensburg, Germany. The new accredited site will cover almost 1,700 square meters, including 1,100 square meters dedicated to laboratories and measuring stations. It will also include a showroom and a large customer area with meeting rooms. At PCIM, visitors can learn more about the new lab and TDK’s EMC services. 

At the booth, visitors can also explore TDK’s own absorbers, including tiles and pyramids, as well as sine-wave filters for up to 720 A and 2-line filters for power electronics applications of up to 1500 V/1600 A. 

The power in expertise 

TDK experts will share detailed technical insights into key technologies for e-mobility, energy storage, AI data centers, and solid-state transformers. The presentations demonstrate how TDK’s component and system expertise helps customers address design challenges and accelerate the development of next-generation power electronics.  

• David Olalla, xEVCap Next Level: Capacitor Bank and Thermo-Mechanical Evaluation of a Powertrain Inverter, June 10, 4:15 PM, E-Mobility & Energy Storage Stage, Hall 6, Booth 220 

• Anirban Roy, Technologies Powering the Shift to Solid-State Transformers: How TDK Technologies Enable the Transition, June 11, 10:00 AM, AI & Data Centers Stage, Hall 5, Booth 320 

• Alberto Espinar, xEVCap Next Level: Capacitor Bank and Thermo-Mechanical Evaluation of a Powertrain Inverter, June 11, 11:15 AM, Poster Session, Hall 4A 
   

Further information on TDK’s appearance at PCIM can be found at www.tdk-electronics.tdk.com/en/3474864/company/tradeshows-events/pcim