TDK Corporation (TSE: 6762) has introduced the compact B3201*A5/B5/C5 series of Y1 safety capacitors designed to suppress EMI in demanding automotive and industrial applications. The metallized polypropylene (MKP) film capacitors are rated for AC voltages of 500 V and DC voltages of up to 1500 V. Featuring a maximum operating temperature of up to +125 °C (with derating), they combine a space-saving footprint with AEC-Q200 Rev. E compliance and high robustness under severe ambient conditions. Typical applications include xEV power electronics, on-board chargers, EV charging infrastructure, industrial drives, power supplies, renewable energy converters, and energy storage systems.

This series offers capacitance values ranging from 0.47 to 33 nF and is available with lead spacings of 15 and 22.5 mm. The smaller B32012 variants measure 5.0 x 10.5 x 18.0 mm, and the B32013 types extend the capacitance range to 33 nF. The compact dimensions help developers implement reliable line-to-ground filtering where PCB space is limited. Parallel wire leads support conventional through-hole mounting. The components are available untaped or in ammo-pack and reel configurations.

The capacitors are rated for continuous operation at 500 V (AC) and 1500 V (DC), respectively, at temperatures of up to +110 °C. At operating temperatures above +110 °C and up to the maximum of +125 °C, the operating voltage must be derated by 1.5% per degree Celsius. Operation within this elevated temperature range is limited to a maximum of 1000 hours.

For applications exposed to heat and humidity, the B3201*A5/B5/C5 series is tested at +85 °C, 85% relative humidity, and 500 V (AC) for 500 hours (THB test). Their self-healing MKP construction supports reliable operation under electrical stress, while the plastic case and epoxy resin sealing meet UL 94 V-0 flammability requirements. The series is approved according to IEC/EN/UL 60384-14, CSA E60384-14, and GB/T 6346.14.

• Delivers high impedance at frequencies up to 2 GHz
• Provides 1.7 to 2 times higher impedance than conventional components
• Compact 1608 size using multilayer processing technologies

TDK Corporation (TSE:6762) expands the MLJ1608-G series (1.6 x 0.8 x 0.8 mm; L x W x T) of multilayer inductors for automotive power-over-coax (PoC) circuits. Mass production of these new components began in October 2026.

Automotive PoC enables power and data to be transmitted simultaneously over a single coaxial cable. It is used primarily in automotive cameras that form part of advanced driver-assistance systems (ADAS). Multiple cameras installed at the front, rear, sides, and other areas of a vehicle detect the surrounding environment, and the resulting information is processed by an electronic control unit (ECU) to support safe driving. Traditionally, two cables—one for power and one for data—were required to connect an automotive camera to an ECU. PoC consolidates these functions into just one coaxial cable. This reduces the number of cables in a vehicle, offering benefits such as higher reliability, more compact wiring, reduced vehicle weight, and lower CO₂ emissions.

Before the signals can be processed, PoC systems require a wideband filter consisting of multiple inductors to separate the data signal and the power. Through its proprietary material and structural designs, the MLJ1608-G series achieves high impedance across the frequency range from 300 MHz to 2 GHz, owing to its high inductance of 1.2 μH, compared with 0.56 μH for conventional products. In the 100–700 MHz range, it provides 1.7 to 2 times higher impedance than conventional components, thereby delivering effective noise suppression. With its size of 1608, the component also helps to make camera modules smaller.

For the development of inductors for automotive PoC applications, TDK will continue to expand its lineup to meet evolving market needs through optimized designs utilizing multilayer, wire-wound, and thin-film technologies. In doing so, TDK will contribute to improving the quality of PoC transmission signals.

TDK Corporation (TSE: 6762) presents the B3272*A/G/T series of DC-link film capacitors. These are qualified for continuous operation at case temperatures of up to +135 °C, with no derating required up to +105 °C. These components feature an EPN dielectric. This blend of polypropylene (PP) and cyclic olefin copolymer (COC) has already been proven in TDK’s ModCap UHP power capacitors. This allows DC-link designs for demanding automotive and industrial power electronics applications to have greater thermal headroom.

On-board charging units, xEV traction inverters, DC-DC converters, industrial drives, and high-end power supplies must operate reliably even as power density increases, in confined spaces, and at higher ambient temperatures. These constraints subject passive components to growing thermal and electrical stress. The B3272*A/G/T series is designed to meet the demands of such applications.

The series spans rated DC voltages from 800 to 1200 V and rated capacitance values from 1.0 to 60 µF, with three lead spacings: 27.5 mm, 37.5 mm, and 52.5 mm (B32728G, 4-pin). The 4-pin G-types support low-inductance busbar interfaces and help reduce parasitic loop area in fast-switching inverter stages, while the low-profile T variant addresses height-constrained layouts in compact automotive and industrial assemblies.

The flame-retardant plastic case and epoxy resin sealing both comply with UL 94 V-0. The series is AEC-Q200E qualified and RoHS-compatible, supporting global use in automotive and industrial converters where thermal headroom, reliability, and compact integration must be optimized together.

For the B3272*A/G/T series, TDK provides various SPICE model libraries and the web-based Capacitor Life And Rating Application (CLARA) tool.

TDK Corporation (TSE: 6762) has expanded its axial/soldering star-aluminum electrolytic capacitor lineup with 125 V-rated components to the B43693/B43793 series (125 V to 250 V) and upgraded the 63-V series of existing B41687/B41787 (25 V to 63 V). This complements the product spectrum, addressing the increasing demand for compact and high-ripple-current DC-link capacitor banks with battery voltages ranging from 48-V battery systems to 120 V. These are frequently used in applications such as small xEVs and micromobility platforms, as well as industrial systems like forklifts, electric boats, and humanoid robots.

The B43693/B43793 series eliminates the need for connecting capacitors in series by supporting higher DC-link voltages within a single component. This can simplify capacitor-bank design and enhance system robustness and efficiency. Supporting ripple currents of up to 21.6 A, the components operate at temperatures of up to +140 °C. Capacitance values range from 56 µF to 650 µF, housed in can sizes from 16 x 25 mm to 21 x 49 mm (diameter x length). The 125-V variant is generally used for 96-V system designs constrained by space, exposed to high thermal stress, and subject to dynamic load conditions requiring stable energy buffering.

The B41687/B41787 series shares the same axial/soldering-star construction, providing design standardization across voltage classes. They operate at up to +150 °C and offer capacitance values from 510 µF to 4800 µF.

All four series are characterized by low equivalent series resistances (ESR) and high ripple current capabilities, reducing power losses and improving thermal efficiency within the DC-link stage of inverters, for example. Their mechanical design supports harsh environmental conditions, offering standard vibration resistance up to 20 g, with options for up to 60 g upon request. Axial-lead and soldering star terminals provide flexible mounting configurations, including horizontal and vertical mounting on PCBs and busbars.

Furthermore, by optimized mounting to a heat sink, 125-V capacitors of the B43693/B43793 series achieve more than double the standard ripple currents, allowing customers to drastically reduce the size and cost of capacitor banks. For example, the specified ripple current of an 18 x 30 mm component jumps from 5.2 A (at +105 °C ambient temperature) to 11.1 A when the aluminum case is maintained at +105 °C via a heat sink. This offers designers critical advantages in power density, reduced ESR, fewer pieces per bank, and consequently lower assembly costs without sacrificing reliability.

TDK Corporation (TSE:6762) presents the EP21 series (ordering code: B82552J*J021) of flat-wire double chokes. These components are designed for common-mode EMI filtering and are available in an SMD format with dimensions of only 23.8 x 17.7 mm and heights ranging from 21.6 to 22.3 mm. To minimize board space, these components feature underbody termination. They can be used as common-mode chokes for applications such as DC-DC converters or other low-voltage EMC protection circuits. Their four-pin design enhances mechanical reliability.

They can handle rated voltages of 48 V (AC) or 80 V (DC) and rated currents of 20.3 to 35 A without derating up to +70 °C. However, if the temperature exceeds +70 °C, derating is required. The DC resistance is as low as 0.44 mΩ, while the rated inductance ranges from 160 to 640 µH, with an average stray inductance as low as 200 nH. Depending on the type, the maximum impedance occurs at frequencies between 500 kHz and 3 MHz.

TDK Corporation (TSE:6762) introduces the E13 EM series (ordering code: B8280*F*). These IGBT/FET gate drive transformers are designed for automotive 500-V battery systems, enabling reliable isolation in traction inverters and compact DC-DC converters. By meeting stringent creepage and clearance requirements, this new series supports safe and efficient power conversion in xEV platforms, where robust insulation and space-efficient design are crucial to next-generation electrified mobility.

The E13 EM series features a compact SMD design built on a MnZn ferrite core, with a footprint of 18.6 x 14.6 mm and a height of up to 12 mm. The components support typical operating frequencies between 100 kHz and 400 kHz and are available for either flyback or push-pull topologies. They have inductance values ranging from approximately 1.8 µH to 240 µH and saturation currents of up to 9 A. This enables design flexibility across various power architectures. Low leakage inductance and optimized winding structures ensure stable signal transmission and high efficiency in applications with fast-switching power semiconductors.

A key feature of the E13 EM series is its advanced insulation system. The transformers have creepage distances of up to 6.3 mm and clearance distances of up to 5.5 mm and meet the requirements for basic insulation at 500 V (DC) and reinforced insulation at 300 V, compliant with IEC 60664-1 and IEC 61558-2-16. The components are specified for transient overvoltages up to 2500 V and a partial discharge extinction voltage of 900 V. They are qualified to AEC-Q200 Rev. E and designed for operation from -40 °C to +150 °C, meeting the reliability requirements of automotive applications.

• State-of-the-art solutions for measuring electromagnetic compatibility (EMC)

• Focus on automotive and industrial electronics

After nine months of construction, the new EMC laboratory of TDK Electronics in Regensburg is celebrating its topping-out ceremony. This traditional event marks the completion of the building’s rough construction, and includes a heartfelt thank you to the craftspeople involved for their work, as well as a light meal for everyone. A total of about 50 guests attended, including employees from the architectural firm, various construction companies, and the City of Regensburg’s Economic Development Office.

Dr. Stefan Weber, project manager for the construction of the new EMC laboratory, thanked everyone involved for their work and support. “I am very pleased that we are able to celebrate the topping-out ceremony for our new EMC laboratory here today. The interior work is also progressing well, so I am confident that we will be able to officially open the laboratory this fall.” 

Juergen Roumen, Deputy General Manager of the Magnetics Business Group, to which the laboratory belongs, went on to emphasize that the new facility would serve as a central hub for working with customers to quickly and efficiently resolve any electromagnetic compatibility (EMC) issues. “The new laboratory will thus serve as a starting point for many innovative projects.” 

EMC as an indicator of safety and quality 

Covering an area of approximately 1,700 square meters, the new facility offers both internal and external customers state-of-the-art capabilities for measuring electromagnetic compatibility. EMC refers to the ability of electrical devices to function properly in their environment without interfering with other devices or being interfered with by them. The increasing amount of electronics in both the private and industrial sectors makes EMC a critical factor in safety and quality. 

The laboratory comprises three anechoic chambers of different sizes, in which vehicles, industrial applications, and RF and wireless applications can be tested. All chambers utilize state-of-the-art TDK anechoic technology and measurement systems. The EMC laboratory thus also serves as a showroom for the technologies and services TDK offers in this field, ranging from the design and planning of the facilities and their equipment to turnkey solutions.