TDK Corporation (TSE: 6762) has expanded its axial/soldering star-aluminum electrolytic capacitor lineup with 125 V-rated components to the B43693/B43793 series (125 V to 250 V) and upgraded the 63-V series of existing B41687/B41787 (25 V to 63 V). This complements the product spectrum, addressing the increasing demand for compact and high-ripple-current DC-link capacitor banks with battery voltages ranging from 48-V battery systems to 120 V. These are frequently used in applications such as small xEVs and micromobility platforms, as well as industrial systems like forklifts, electric boats, and humanoid robots.

The B43693/B43793 series eliminates the need for connecting capacitors in series by supporting higher DC-link voltages within a single component. This can simplify capacitor-bank design and enhance system robustness and efficiency. Supporting ripple currents of up to 21.6 A, the components operate at temperatures of up to +140 °C. Capacitance values range from 56 µF to 650 µF, housed in can sizes from 16 x 25 mm to 21 x 49 mm (diameter x length). The 125-V variant is generally used for 96-V system designs constrained by space, exposed to high thermal stress, and subject to dynamic load conditions requiring stable energy buffering.

The B41687/B41787 series shares the same axial/soldering-star construction, providing design standardization across voltage classes. They operate at up to +150 °C and offer capacitance values from 510 µF to 4800 µF.

All four series are characterized by low equivalent series resistances (ESR) and high ripple current capabilities, reducing power losses and improving thermal efficiency within the DC-link stage of inverters, for example. Their mechanical design supports harsh environmental conditions, offering standard vibration resistance up to 20 g, with options for up to 60 g upon request. Axial-lead and soldering star terminals provide flexible mounting configurations, including horizontal and vertical mounting on PCBs and busbars.

Furthermore, by optimized mounting to a heat sink, 125-V capacitors of the B43693/B43793 series achieve more than double the standard ripple currents, allowing customers to drastically reduce the size and cost of capacitor banks. For example, the specified ripple current of an 18 x 30 mm component jumps from 5.2 A (at +105 °C ambient temperature) to 11.1 A when the aluminum case is maintained at +105 °C via a heat sink. This offers designers critical advantages in power density, reduced ESR, fewer pieces per bank, and consequently lower assembly costs without sacrificing reliability.

TDK Corporation (TSE:6762) presents the EP21 series (ordering code: B82552J*J021) of flat-wire double chokes. These components are designed for common-mode EMI filtering and are available in an SMD format with dimensions of only 23.8 x 17.7 mm and heights ranging from 21.6 to 22.3 mm. To minimize board space, these components feature underbody termination. They can be used as common-mode chokes for applications such as DC-DC converters or other low-voltage EMC protection circuits. Their four-pin design enhances mechanical reliability.

They can handle rated voltages of 48 V (AC) or 80 V (DC) and rated currents of 20.3 to 35 A without derating up to +70 °C. However, if the temperature exceeds +70 °C, derating is required. The DC resistance is as low as 0.44 mΩ, while the rated inductance ranges from 160 to 640 µH, with an average stray inductance as low as 200 nH. Depending on the type, the maximum impedance occurs at frequencies between 500 kHz and 3 MHz.

TDK Corporation (TSE:6762) introduces the E13 EM series (ordering code: B8280*F*). These IGBT/FET gate drive transformers are designed for automotive 500-V battery systems, enabling reliable isolation in traction inverters and compact DC-DC converters. By meeting stringent creepage and clearance requirements, this new series supports safe and efficient power conversion in xEV platforms, where robust insulation and space-efficient design are crucial to next-generation electrified mobility.

The E13 EM series features a compact SMD design built on a MnZn ferrite core, with a footprint of 18.6 x 14.6 mm and a height of up to 12 mm. The components support typical operating frequencies between 100 kHz and 400 kHz and are available for either flyback or push-pull topologies. They have inductance values ranging from approximately 1.8 µH to 240 µH and saturation currents of up to 9 A. This enables design flexibility across various power architectures. Low leakage inductance and optimized winding structures ensure stable signal transmission and high efficiency in applications with fast-switching power semiconductors.

A key feature of the E13 EM series is its advanced insulation system. The transformers have creepage distances of up to 6.3 mm and clearance distances of up to 5.5 mm and meet the requirements for basic insulation at 500 V (DC) and reinforced insulation at 300 V, compliant with IEC 60664-1 and IEC 61558-2-16. The components are specified for transient overvoltages up to 2500 V and a partial discharge extinction voltage of 900 V. They are qualified to AEC-Q200 Rev. E and designed for operation from -40 °C to +150 °C, meeting the reliability requirements of automotive applications.

• State-of-the-art solutions for measuring electromagnetic compatibility (EMC)

• Focus on automotive and industrial electronics

After nine months of construction, the new EMC laboratory of TDK Electronics in Regensburg is celebrating its topping-out ceremony. This traditional event marks the completion of the building’s rough construction, and includes a heartfelt thank you to the craftspeople involved for their work, as well as a light meal for everyone. A total of about 50 guests attended, including employees from the architectural firm, various construction companies, and the City of Regensburg’s Economic Development Office.

Dr. Stefan Weber, project manager for the construction of the new EMC laboratory, thanked everyone involved for their work and support. “I am very pleased that we are able to celebrate the topping-out ceremony for our new EMC laboratory here today. The interior work is also progressing well, so I am confident that we will be able to officially open the laboratory this fall.” 

Juergen Roumen, Deputy General Manager of the Magnetics Business Group, to which the laboratory belongs, went on to emphasize that the new facility would serve as a central hub for working with customers to quickly and efficiently resolve any electromagnetic compatibility (EMC) issues. “The new laboratory will thus serve as a starting point for many innovative projects.” 

EMC as an indicator of safety and quality 

Covering an area of approximately 1,700 square meters, the new facility offers both internal and external customers state-of-the-art capabilities for measuring electromagnetic compatibility. EMC refers to the ability of electrical devices to function properly in their environment without interfering with other devices or being interfered with by them. The increasing amount of electronics in both the private and industrial sectors makes EMC a critical factor in safety and quality. 

The laboratory comprises three anechoic chambers of different sizes, in which vehicles, industrial applications, and RF and wireless applications can be tested. All chambers utilize state-of-the-art TDK anechoic technology and measurement systems. The EMC laboratory thus also serves as a showroom for the technologies and services TDK offers in this field, ranging from the design and planning of the facilities and their equipment to turnkey solutions. 

TDK Corporation (TSE:6762) extends its X2 safety film capacitor portfolio with the new B3292xU/V series, 
now supporting higher voltages and offering compact lead spacings of 15 mm and 22.5 mm, with capacitance values from 47 nF to 1.8 µF. Rated at 350 V (AC) and robust against peak voltage pulses up to 2.5 kV 
(IEC 60384-14), the series is designed for interference suppression in demanding, space-constrained industrial and automotive environments in series with the mains. Typical applications are on-board chargers, EV charging systems, PV inverters, energy meters, and capacitive power supplies.

The entire series is now available with lead spacings from 15 mm to 52.5 mm, covering capacitance values from 47 nF to 20 µF. It passed the THB (temperature, humidity, bias) test at +85 °C, 85% RH, and rated voltage for 1000 h, meeting Grade III, Test Condition B requirements. In addition, the series offers AEC-Q200 compliance, excellent self-healing properties, and a maximum operating temperature of +110 °C, ensuring durability even under severe ambient conditions.

With their compact dimensions and high DC testing voltage (1505 V for 2 s), the B3292xU/V series provides a balanced solution of performance and size for next-generation industrial drives and automotive power electronics, supporting the growing need for efficient and space-optimized EMI suppression solutions.

For the B3292xU/V series, TDK offers a range of design tools and SPICE models.

TDK Corporation (TSE: 6762) introduces the new B43655 and B43656 series of aluminum electrolytic capacitors designed specifically for DC links in on-board chargers (OBCs) of electric vehicles. Both series are optimized for forced cooling operation, supporting the growing trend toward higher voltages and currents in next-generation OBC platforms. Due to their compact design and high ripple current capability, such capacitors are commonly used in applications requiring maximum efficiency and reliability in confined spaces. 

With a high voltage rating of 475 V and 500 V, as well as capacitances ranging from 110 µF to 880 µF, the B43655 series meets the requirements of 800 V battery architectures for modern e-mobility applications. Designed for base cooling and high ripple current density, these components offer a useful life of more than 3,000 hours at +105 °C. They also feature a maximum ripple current of 3.29 A at +105 °C and ESR values down to 100 mΩ to minimize power losses. The B43656 series, rated at 450 V, handles even higher currents of up to 4.42 A at +105 °C for demanding high-power OBC topologies. 

Both series are qualified according to AEC-Q200 Rev. E and are made with RoHS-compliant materials. They are available in compact snap-in designs ranging in diameter from 22 mm to 35 mm and in length from 25 mm to 60 mm, depending on the capacitance and voltage class. The B43655 and B43656 capacitors provide design engineers with robust, future-ready solutions for on-board chargers in electric vehicles, thanks to their enhanced electrical performance and reliability. 

The new B43655 and B43656 series will also be implemented in TDK’s web-based AlCap Useful Life Calculation Tool. 

• Guarantees operation in high‑temperature environments up to +175 °C
• Adopts AgPd terminals compatible with conductive‑glue mounting
• AEC‑Q200 compliant (automotive grade)

TDK Corporation (TSE:6762) announced today that it has expanded its NTCSP series of NTC thermistors. These components are designed for conductive‑glue mounting for operation in high‑temperature environments up to +175 °C. Mass production of this series began in February 2026.

To drive higher automotive performance, more powerful and heat-resistant power semiconductors are required. Consequently, electronic components mounted in these power modules must also be able to withstand higher temperatures. While the maximum guaranteed operating temperature for TDK's existing products was +150 °C, the company has now expanded its range to cover up to +175 °C.

This product is a high‑reliability device compliant with AEC‑Q200 and realizes a wide operating temperature range of -55 °C to +175 °C. It can be used for various temperature detection and temperature compensation applications across low to high temperature ranges. It is suitable for automotive applications such as anti‑lock braking systems (ABS), transmissions, and engines. By adopting AgPd (silver‑palladium) terminals compatible with conductive‑glue mounting, this series can operate at +175 °C; this was difficult to achieve with conventional solder mounting.

The NTCSP series offers 10 kΩ and 100 kΩ types in a 1.6 x 0.8 mm package.

TDK will continue to develop NTC thermistors to meet a wide variety of needs, including expansion of chip sizes, thermistor characteristics, and operating temperature ranges.