• Investment of a double-digit million amount
• State-of-the-art capabilities for measuring electromagnetic compatibility (EMC)
• Focus on automotive and industrial applications

TDK Corporation builds a new EMC laboratory in Regensburg. It replaces the existing accredited laboratory, which is more than 60 years old, at a new location. The facility will offer internal and external customers state-of-the-art capabilities for measuring electromagnetic compatibility (EMC). The groundbreaking ceremony for the new laboratory has now taken place.

TDK is investing a double-digit million amount in the construction of the new EMC laboratory and thus also in Germany as a business location. The new laboratory will have a total area of almost 1,700 square meters, 1,100 square meters of which will be used for laboratories and measuring stations. A showroom and a large customer area with meeting rooms are also planned.

The new facility replaces the existing 700-square-meter laboratory, which was developed from the semi-absorber hall built by Siemens in 1962, the first hall of its kind in Europe at the time. “The size and equipment of the new laboratory alone will enable significantly more measurement projects,” says Dr. Stefan Weber, project manager for the construction of the new EMC laboratory. “With the new EMC laboratory, we are ideally positioned for the next 60 years of successful development in Europe. It creates a central location for designing products and solving problems together with customers. It is therefore an important tool for customer retention.”

Focus on automotive and industrial applications

The heart of the laboratory is a new ten-meter semi-anechoic chamber in which vehicles and high-power industrial applications can be measured. It is complemented by a new three-meter full absorber chamber for RF and radio applications, which offers the fastest measurement methods at the highest frequencies, and by a compact chamber for measuring automotive components such as control units or onboard chargers. This chamber is equipped with absorbers that are only ten centimeters deep—the most compact design currently available on the market.

Showroom for TDK absorber technology

All chambers feature state-of-the-art TDK absorber technology and measurement systems. The EMC laboratory thus also serves as a showroom for the technologies and services offered by TDK in this field, ranging from the dimensioning and design of the halls to their equipment and ready-to-use concepts.

The new EMC laboratory is scheduled to be completed in the middle of 2026. TDK operates further accredited EMC laboratories in Austin (Texas), Tokyo, and Shanghai. 

Dr. Stefan Weber, Project Manager for the new EMC laboratory, Dr. Werner Lohwasser, CEO & COO TDK Electronics, Gertrud Maltz-Schwarzfischer, Lord Mayor of Regensburg, Christoph Michl, Office for Economy and Science Regensburg, architect Thomas Bauer, and building contractor Johann Feldbauer.

• New 1000 V product with a capacitance of 22 nF in the 3225 case size with C0G characteristics of low-resistance soft termination type for automotive and general applications
• Contributes to greater reliability in applications, reduction of component count, and miniaturization
• Qualified based on AEC-Q200

TDK Corporation (TSE:6762) announced today it expanded its CN series of low-resistance soft-termination MLCCs. This product achieves an industry-leading* 22 nF capacitance in the 3225 case size (3.2 x 2.5 x 2.5 mm – L x W x T) and C0G characteristics at 1000 V. Mass production of the product series began in September 2025. The capacitors of the CN series are industry-first products that are equivalent to regular products in terms of their terminal resistance due to the optimization of their resin electrode structure.

In recent years, there has been an increase in the use of multiple resonance capacitors placed in series-parallel circuits for resonance applications such as LLC resonant circuits and wireless charging. As applications become more powerful, they require more resonance capacitance, which increases the demand for high-voltage, large-volume capacitors. To improve reliability in these applications, components with resin electrodes effectively prevent placement cracks resulting from external stress. However, the increased resistance value of resin electrodes has been an issue.

This led TDK to develop the CN series with optimized resin electrode structures, resulting in significantly lower resistance values. In addition to the low losses and capacitance stability over temperature and voltage variations of C0G products, these resin electrode structures achieve both high reliability against external stress and reduced loss, making them ideal for use as resonator and snubber capacitors. 

The optimization of product and process designs has made it possible to manufacture these products, which helps increase reliability and application to high-voltage circuits and enhances the reliability of the applications. TDK will continue to expand its product line to meet the needs of its customers.

* As of September 2025, according to TDK
 

TDK Corporation (TSE:6762) presents CarXield (ordering code: B84252x), a standardized EMC filter series for automotive inverters for 500 V and 1000 V, which can significantly reduce development time for system integrators. This product enables rapid market entry for mid-sized e-mobility manufacturers with validated, compact EMI solutions that meet automotive standards and are immediately available through streamlined, standardized manufacturing processes. By mitigating inverter-to-battery interference, CarXield enhances overall powertrain EMC performance and simplifies compliance for electric drivetrain applications.

Designed to suppress inverter-generated noise on battery lines, which is crucial for both electromagnetic immunity and emission compliance, CarXield ensures stable performance in xEV platforms. The components measure 140 x 59 x 50.0 mm (L x W x H) and cover 500 V and 1000 V systems with rated currents up to 400 A at ambient temperatures of +85 °C, and transient peak currents up to 1000 A. The typical DC resistance is only 0.1 mΩ. Based on nanocrystalline core technology and incorporating X2 or Y2 class capacitors with integrated passive discharge, these filters are engineered for durability under severe ambient conditions.

Thanks to its availability with or without copper busbars and optional passivated finishes, CarXield supports flexible system integration, allowing developers to adapt thermal and spatial designs without compromise. It is certified to automotive standards such as AEC-Q200 and validated against MBN LV 124 profiles.

Further information on the products can be found at www.tdk-electronics.tdk.com/en/carxield

• The component achieves a high inductance of 10 μH despite a small 1206 case size 

• High impedance characteristics over a wide frequency range of 10 MHz to 200 MHz 

• DC resistance reduced by approximately 70%, rated current increased by 1.7 times 

TDK Corporation (TSE: 6762) has expanded its PLEC69B series (1.2 x 0.6 x 0.95 mm – L x W x H) of thin-film inductors, used for separating the data signal from the power in optical transceivers in AI data centers. Mass production of these components began in August 2025. 

The widespread adoption of AI led to a skyrocketing demand for high-speed and high-capacity optical transceivers. Bias-tee circuits, which are used in these transceivers, are designed to superimpose signals and power on a single transmission line. Because of the impedance characteristics, inductors like the PLEC69B separate the signal from the power in bias-tee circuits, preventing the signal from flowing into the power side. 

The new component achieves the highest standard performance* for an inductor with 10 μH in 1206 size with TDK’s proprietary metallic magnetic materials and structural designs. With a wide frequency range of 10 MHz to 200 MHz, signals can be separated from power with high impedance, which improves communication quality. Additionally, the DC resistance of 1.4 Ω (typ.) is approximately 70% lower than that of similar products on the market. This reduces power loss and heat generation. The rated current (I_sat) of 0.2 A is also 1.7 times higher than that of similar products. In addition, the smaller dimensions require less space on the PCB. The PLEC69B ensures high reliability with an upper operating temperature limit of +125 °C.  

TDK will continue contributing to its extensive lineup by developing products to meet market needs for lower power consumption and high-speed communications designed for data centers, servers, as well as optical communication devices and edge devices, supporting the AI market in anticipation of significant future growth.  

*Source: TDK, as of August 2025 

TDK Corporation (TSE:6762) has significantly extended its EPCOS InsuGate series of SMT gate drive transformers, introducing new variants rated for a DC working voltage of up to 1000 V (ordering code: B78541A25). These components meet the IEC 61558-1/2-16 standard for basic insulation and enable more compact gate driver designs for full-bridge inverter modules, particularly in demanding e-mobility and industrial environments. The triple-insulated winding structure, combined with a MnZn ferrite core and optimized coil architecture, allows for robust isolation in high-switching-frequency applications without compromising board space or reliability.

With a footprint of just 13.85 x 10.5 x 9.2 mm (L x W x H), the new 1 kV-rated components reduce PCB floor space requirements by approximately 30% compared to traditional single gate drive transformer designs supporting equivalent insulation. They offer a flat inductance profile up to +150 °C, with a nominal inductance of 75 µH and a coupling capacitance of only 4 pF, making them a good choice for fast-switching IGBT and SiC devices. SPICE models are available upon request.

The series is qualified to AEC-Q200 Rev. E and has undergone extended mechanical vibration testing in line with AQG 324 requirements based on standard Eurocard PCB, proving its resilience in powertrain-mounted modules. With a partial discharge extinction voltage of ≥1.2 kV (V_peak), reinforced insulation voltage capability of 300 V (AC), and high voltage test performance at 3 kV (AC) for 60 seconds, these new transformers offer a reliable solution for galvanic isolation in next-generation power electronics.

• Wide frequency range beyond 1 GHz to enable high impedance characteristics
• Reduced footprint by minimizing the number of power-over-coax (PoC) filter inductors to one component
• Suitable for high temperature environments; supports a wide operation range of -55 °C and +155 °C

TDK Corporation (TSE: 6762) has expanded its ADL4524VL series (4.5 x 2.4 x 2.6 mm – L x W x H) of wire-wound inductors for automotive power-over-coax (PoC). Mass production of these components began in July 2025.

With automotive PoC technology, a single coaxial cable can simultaneously carry both power and data. PoC is widely used in automotive camera systems as ADAS for safe driving has become more widespread. Using a single coaxial cable for power and signal lowers the vehicle’s weight by reducing cabling, which in turn helps to improve fuel and power consumption. Simplified cabling within the vehicle also allows for a more effective use of the space.

The PoC system requires a filter incorporating multiple inductors to separate power from the data signal before processing effectively. This product enables high impedance at a wide frequency range from 10 MHz to 1 GHz with its proprietary materials and structural design innovation. This reduces the number of inductors used to save space. By covering a wide frequency range, this product can handle applications with fewer inductors. For example, where conventional solutions might require three inductors, this solution requires only one. The inductor ensures high reliability with an upper operation temperature range limit of +155 °C.

Looking ahead, TDK is committed to developing inductors for automotive PoC applications by pursuing optimized design by refining multilayer, wire-wound, and thin-film technologies to address market needs. TDK will expand its lineup of products to improve the quality of PoC transmission signals.

• 16% higher rated current and 31% lower DC resistance compared to conventional products
• Highly reliable for use in high-temperature environments up to +150 °C

TDK Corporation (TSE: 6762) has expanded its TFM201612BLEA series (2.0 x 1.6 x 1.2 mm – L x W x H) of thin-film power inductors for automotive power circuits to higher currents up to 5.6 A. The two new components have a rated inductance of 0.33 µH and 0.47 µH, respectively. Mass production of this product series began in July 2025.

In recent years, demand for inductors for automotive power circuits has continued to increase as electric vehicles and ADAS for safe driving have become more widespread. Highly efficient power supply circuits are necessary to lower energy consumption, driving the development of low-loss, high-efficiency inductors. Inductors for power supply circuits must be compact, as they need to be installed within the limited space of ECUs. High reliability is also crucial, as they must operate in harsh, high-temperature environments.

Compared to the conventional TFM-ALMA series of the same size with an inductance of 0.47 µH, this new product achieves a 16% higher rated current of 5.6 A and a 31% lower DC resistance of 22 mΩ, offering the highest standard* of electrical performance. This helps to reduce loss and to improve efficiency for power supply circuits, enabling support for high-current applications within the same footprint as conventional models. Additionally, the inductor ensures high reliability with an upper operation temperature range limit of +150 °C, thanks to a product design assuming use in high-temperature environments in automotive applications.

With TDK’s proprietary materials and structural designs adapted to the diverse needs of automotive power circuits, TDK will work to expand its comprehensive lineup, utilizing not only thin-film technology but also wire-winding and multilayer processing technologies, thereby contributing to the enhancement of the quality of automotive power circuits.

*Source: TDK, as of July 2025