Press Center

TDK Corporation has introduced the MT40 series of ThermoFuse varistors (ordering code B72240M), a new generation of surge protection components (SPC) that combine a compact design with advanced safety features. Thanks to their patented overmolding technology and integrated thermal disconnecting system, these SPCs provide robust protection up to 50 kA while minimizing size (38.0 x 15.2 x 40.9 mm; L x W x H). 

TDK Corporation announces its participation at the 2026 Applied Power Electronics Conference (APEC) highlighting solutions for a broad range of applications on March 23-25, 2026, at Henry B. Gonzalez Convention Center in San Antonio, Texas. TDK Corporation of America and TDK-Lambda Americas will be located at booth #1419. 

TDK Corporation announces the establishment of its Asia-Pacific Regional Headquarters (APAC RHQ) in Bengaluru, India—the company’s fifth regional headquarters alongside Japan, Europe, the Americas, and China. The new legal entity, TDK Asia-Pacific Pvt. Ltd., together with TDK Singapore Pte. Ltd., will govern more than 20 TDK entities across India, Southeast Asia and Oceania—representing nearly 17 percent of TDK’s 105,000 team members.

TDK Corporation announces its participation in embedded world 2026, held from March 10 to 12 in Nuremberg, Germany. At booth 505 in hall 1, TDK will showcase a wide range of embedded solutions designed to meet evolving application demands. Visitors can engage directly with TDK experts to learn more about current technologies and system-level approaches. 

TDK Corporation extends its X2 safety film capacitor portfolio with the new B3292xU/V series, now supporting higher voltages and offering compact lead spacings of 15 mm and 22.5 mm, with capacitance values from 47 nF to 1.8 µF. 

TDK Corporation introduces the new B43655 and B43656 series of aluminum electrolytic capacitors designed specifically for DC links in on-board chargers (OBCs) of electric vehicles. Both series are optimized for forced cooling operation, supporting the growing trend toward higher voltages and currents in next-generation OBC platforms.

TDK Corporation announced today that it has expanded its NTCSP series of NTC thermistors. These components are designed for conductive‑glue mounting for operation in high‑temperature environments up to +175 °C. 

TDK Corporation will serve as the title partner of the "Formula E Tokyo E-Prix" (hereinafter, “Tokyo E‑Prix”), to be held as a night race in Tokyo on July 25 and 26. This edition of the race will be held under the title “2026 TDK Tokyo E-Prix”.

TDK Corporation announces the B3271xP series of DC link film capacitors, offering high thermal robustness for demanding automotive and industrial power electronics. With a maximum operating temperature of +125 °C and no power derating up to +105 °C, the series ensures stable capacitance and reliable energy buffering even in tightly packed inverter environments. 

TDK Corporation expanded its µPOL family of non-isolated DC-DC power modules by adding the FS1525. This just 3.82 mm high point-of-load (PoL) converter delivers up to 25 A and is engineered to meet the demanding requirements of AI servers, edge computing, and data center systems. 

TDK Corporation was recently named a 2026 Clarivate Top 100 Global Innovator, receiving particularly high evaluations for influence and rarity. For TDK, this is the twelfth time in total, and the ninth time in a row to receive this prestigious award.

TDK Corporation announces the extension of its high-performance MEMS inertial sensors portfolio with Tronics AXO315®T1, a high-temperature MEMS accelerometer with ±14 g input range and a digital interface for measurement while drilling (MWD) applications operating up to +175 °C.

TDK Corporation announces the new ModCap UHP (B25648A) series of DC link capacitors, setting a new benchmark for power electronic applications. 'UHP' stands for 'Ultra-High Performance', and this series enables continuous operation at hotspot temperatures of up to +105 °C without power derating.

TDK Corporation (TSE:6762) announces a suite of InvenSense SmartMotion® custom sensing solutions for more intuitive user experiences with TWS ear buds, AI glasses, augmented reality eyewear, smart watches, fitness bands, and other IoT devices.

TDK Corporation (TSE:6762) announces a customer partnership of InvenSense, a TDK group company with Engo, a new brand of performance sports eyewear using TDK custom sensing solutions to give athletes the power to train smarter without breaking focus. 

TDK Corporation (TSE:6762) announces the establishment of a new TDK group company, which will operate as TDK AIsight to address the intersection of physical AI (artificial intelligence) and generative AI, empowering AI glasses with intuitive and compelling user experiences.

TDK Corporation (TSE: 6762) announces its presence at the annual Consumer Electronics Show (CES) in Las Vegas, Nevada, from January 6–9, 2026, bringing its “In Everything, Better” tagline to life across its solutions for the entire AI ecosystem.

TDK Corporation announces the HVC27*MC series—compact high-voltage DC contactors equipped with a mechanically linked, normally-closed auxiliary contact (mirror contact) compliant with IEC 60947-4-1. This enhancement provides precise contact position feedback for safety-critical applications in electric mobility and industrial energy systems. 

TDK Corporation (TSE: 6762) announced it has been recognized for its leadership in corporate transparency and performance on water security by global environmental non-profit CDP, securing a place on its annual ‘A List’. Being recognized as an ‘A List’ company by CDP for the sixth time is a significant achievement for TDK.  

TDK Corporation expands its B409x series of SMD hybrid polymer aluminum electrolytic capacitors with a design that can withstand mechanical vibrations of up to 30 g (MIL-STD-202, Method 204). This is achieved by four posts that come out of the base plate of the component and stabilize the can in the event of mechanical shocks and vibrations.