TDK Solutions for Software-Defined Vehicles (SDV)

Confidence, Engineered.

… means you don’t have to start from zero with every hard question. TDK is already involved. We work on standards, reference designs, new platforms, and validation. So, when a challenge reaches your desk, we often already know what works, what doesn’t, and where the risks are.

We apply this engineering knowledge in three key areas of SDV development: in‑vehicle networking, power management for high-performance computing, and steer‑by‑wire.

Across all three, our component portfolio helps tackle the signal, power, EMC, and reliability challenges that determine whether a design works reliably in the vehicle.

Fewer unknowns.
Fewer late surprises.
A stronger starting point.

Explore where TDK fits into your SDV architecture:

High-Performance Computing –— In-Vehicle Networking

Design with Confidence. Across Network Interfaces.

Camera / SerDes Connections

TDK supports automotive Power-over-Coax (PoC) links with wire-wound and multilayer inductors for different inductance, current, and footprint requirements.

Stable Power‑over‑Coax

PoC inductors support power injection and signal filtering on the link segment where current and high-speed data share the coax connection.

Wire-wound and multilayer options

Choose ADL wire-wound or MLJ-G multilayer PoC solutions to match impedance, current, and footprint requirements.

Compact options for tight layouts

PoC filters can contain one or several components based on the current requirements.

Wire-Wound PoC Inductors

High-current wire-wound inductors for high-resolution camera networks.

ADL wire-wound inductors for automotive PoC applications, with options from 0.47 µH up to 22 µH.

ADL2012

0.47 µH up to 4.4 µH wire-wound PoC Inductor in an IEC 2012. AEC‑Q200; operating temperature up to +135 °C, including self-heating.

ADL32VHC

10, 15, 18, or 22 µH wire-wound PoC inductor. AEC‑Q200; operating temperature up to +150 °C, including self-heating.

Multilayer PoC Inductors

MLJ-G provides a compact multilayer PoC option where high frequency impedance matching is needed.

MLJ-G

560 nH in a 1.6 x 0.8 mm multilayer package. AEC‑Q200; 500 mA maximum temperature-rise current.

Ethernet & CAN

CAN, CAN FD, and Automotive Ethernet place different demands on filtering. TDK covers these interfaces with application-specific common-mode chokes built on the ACT1210 platform.

One platform. Multiple interfaces.

ACT1210 variants support CAN, CAN FD, 10BASE‑T1S, 100BASE‑T1, and 1000BASE‑T1.

Same footprint. Different requirements.

A common 3.2 x 2.5 mm (EIA 1210) case size gives designers one layout, while the ACT1210 variant can change with the interface.

Network standard compliance.

ACT1210E, ACT1210L and ACT1210G comply with the relevant OPEN Alliance, ACT1210D with CiA and IEC requirements.

Automotive Ethernet

Scalable common-mode noise suppression from 10BASE‑T1S to 1000BASE‑T1.

ACT1210 variants cover 10BASE‑T1S, 100BASE‑T1, and 1000BASE‑T1 in the same EIA 1210 platform.

ACT1210E

For 10BASE‑T1S. Available in 130 µH and 240 µH variants.

ACT1210L

For 100BASE‑T1. OPEN Alliance compliant.

ACT1210G

For 1000BASE‑T1. OPEN Alliance compliant. -40 to +125 °C operating temperature range.

Optimized signal integrity and ringing suppression for CAN FD networks.

ACT1210D is designed for CAN FD applications, with reduced stray capacitance, improved common-mode rejection, and mode-conversion characteristics that can contribute to ringing suppression.

ACT1210D

Optimized for CAN FD. 51, 100, or 130 µH. Operation up to +150 °C.

High-Performance Computing –— Power Management

Stable Power for Powerful SoCs.

48/12 V Power Conversion

High power conversion requirements in limited board space put conduction losses, ripple current handling, and thermal behavior under pressure.

High Power Density

Flat-wire coupled SMD inductors enable the highest power density in an ultra-compact design.

Ripple-Current Capability

Low-ESR capacitors help handle high ripple currents in demanding automotive power stages.

48 V-Ready Reliability

Engineered for harsh automotive environments, these 75 V and 100 V MLCCs maintain high effective capacitance and stability at 48 V.

High-Current Flat-Wire SMD Inductors

High currents with very low DC resistance.

Inductive coupling reduces the ripple current, which lowers the switching losses of the power transistors and improves overall system efficiency.

ERUC23

Up to 97 A (typ.) rated current and 0.88 mΩ (typ.) DCR.

High ripple-current capability. Low ESR.

TDK hybrid polymer SMD capacitors combine bulk capacitance, ultra-low ESR, and high ripple-current capability with a robust voltage margin, delivering reliable 48 V DC‑link buffering and efficient DC‑DC conversion in demanding automotive power applications.

B40910

220 µF / 63 V with 5.5 A rated ripple current at +125 °C.

Reliable voltage headroom and low ESR for 48 V systems.

TDK 75 V and 100 V MLCCs support high-efficiency filtering and smoothing in space-constrained 48 V power conversion stages.

CGA Series

Up to 15 µF. 100 V rating with high DC bias stability. AEC‑Q200.

SoC Power Management

Multiple rails, fast load jumps, and limited board space demand compact components with ultra-low losses across a wide temperature range.

Lower Losses

State-of-the-art materials deliver ultra-low resistive losses as current rises across demanding SoC power rails.

Stable Power Delivery

Powerful inductors and high-capacitance MLCCs keep power rails stable as compute loads rapidly change.

Higher Power Density

High current and high capacitance in compact packages help fit demanding SoC power rails into limited board space.

Power Inductors

High current. Low DCR. Compact rail design.

High-efficiency inductors deliver stable power with excellent DC-bias performance and ultra-low DCR across the full temperature range.

CLT32

Up to 60 A (typ.) saturation current with 0.39 mΩ (typ.) DCR in a 3.2 x 2.5 x 2.5 mm package.

CLT42

Up to 125 A (typ.) saturation current with 0.20 mΩ (typ.) DCR in a 4.2 x 4.2 x 4.2 mm package.

BCM

115 A (typ.) saturation current with 0.32 mΩ (typ.) DCR in a 5.8 x 5.0 x 3.8 mm package.

High capacitance range for compact compute power rails.

TDK CGA MLCCs provide 47 µF automotive-grade capacitance in compact 1206 and 1210 case sizes for low-voltage compute power rails.

CGA6

47 µF / 10 V in EIA 1210. AEC‑Q200.

CGA5

47 µF / 4 V in EIA 1206. AEC‑Q200.

SoC Decoupling & Filtering

Fast load jumps, switching power supplies, and dense layouts create voltage transients and high-frequency noise close to the SoCs.

Local Voltage Stability

Decoupling close to the SoC helps buffer short voltage dips and spikes as compute load changes.

High-Frequency Noise Suppression

Filtering close to the SoC helps control high-frequency noise on power rails.

Fewer Components. Less Board Space.

YFF 3-terminal filters and CGAE flip-type MLCCs combined reduce decoupling-component count and board space for compact designs.

YFF 3-Terminal Filters

High-frequency power-line filtering with fewer decoupling components.

TDK YFF feed-through filters suppress high-frequency noise on power lines and can reduce decoupling-component count and board space.

YFF-AC

1 µF / 2 A. 40 dB (typ.) insertion loss from 1 MHz to 2.6 GHz.

Lower ESL for high-frequency decoupling in compact layouts.

TDK CGAE reverse-geometry MLCCs use a wider, shorter current path to lower ESL and ESR, supporting noise suppression and decoupling in space-constrained designs.

CGAE

100 nF / 6.3 V in EIA 0204. Low-ESL reverse geometry. AEC‑Q200.

Local decoupling and voltage stabilization close to the SoC.

TDK automotive MLCCs support decoupling and voltage stabilization on power rails close to the SoCs.

CGA2

1 µF / 6.3 V in EIA 0402. AEC‑Q200.

CGA3

10 µF / 4 V in EIA 0603. AEC‑Q200.

PMICs & Voltage Regulators

Stable Power Delivery for General Power Management ICs.

Across an HPC board, local PMIC and buck stages feed different loads with very different current, voltage, noise, and space constraints. Power management must work rail by rail, not only around the main SoC.

Rail-by-Rail Power Design

Different inductor technologies support a wide range of current and inductance requirements, enabling flexible designs in terms of performance, space, or cost.

Optimized Board Design by Best Products Combination

The combination of low-DCR power inductors and a wide range of high-capacitance MLCCs supports the most demanding requirements.

Power-Line Noise Control

Automotive power-line chip beads support high-frequency noise suppression on local supply lines.

Power Inductors

With different sizes, current and voltage capabilities, every requirement is covered.

TDK thin-film, overmolded and metal composite power inductors address different inductance and current requirements in local DC‑DC regulation stages across the HPC board.

TFM3225

Up to 14 A (typ.) saturation current, max. with L-range between 100 nH and 10 µH in a compact 3.2 x 2.5 mm footprint and just 1.2 mm height, with operation up to +150 °C.

HPL505032

60 to 80 nH, up to 63 A (typ.) current capability with 700 µΩ (typ.) DCR.

SPM4020

100 nH to 2.2 µH, up to 24.6 A (typ.) current capability and 4.5 mΩ (typ.) DCR.

High-current noise suppression on local power rails.

TDK MPZ power-line chip beads are designed for power-line noise reduction with low DC resistance and high current capability in automotive applications.

MPZ

Up to 12 A rated current with 7 Ω at 100 MHz, 1.25 mΩ (max.) DCR in a 2.5 x 2.0 x 0.85 mm package. AEC‑Q200.

High-Performance Computing –— Motion & Positioning Sensing

Precision in Motion. Confidence in Position.

Inertial Measurement Unit (IMU)

Navigation aids, dead reckoning, vehicle location, telematics, camera stabilization, inertial-visual odometry, and HUD functions all depend on reliable inertial motion data.

Compact 6-Axis Motion Sensing

Compact form factor for seamless integration into automotive modules, including ADAS and vision systems (camera, radar, LIDAR).

Automotive-Grade Thermal Performance

IAM-20685HP is qualified according to AEC‑Q100 Grade 2 for automotive non-safety applications, with an operating range up to +105 °C.

Accurate Motion Sensing

TDK Automotive balanced gyro design improves vibration rejection for stable vehicle-state sensing.

Automotive 6-axis IMUs for safety applications

Monolithic gyroscope & accelerometer IMU for improved performance and reliability

TDK InvenSense automotive IMUs provide inertial motion data for both safety and in-cabinn applications, including navigation aids, vehicle location, telematics, camera stabilization, head-up displays, ADAS, and safety.

IAM-20685HP

6-axis automotive IMU with 3-axis gyroscope + 3-axis accelerometer in a 3 x 3 x 0.75 mm package. AEC‑Q100 Grade 2.

Development kit for IAM-20680HT

A comprehensive development platform that includes an on-board IAM‑20680HT sensor.

Physical AI Positioning & Mapping

Inertial at the Core.

Low-power always-on inertial navigation (accelerometer and gyroscope) fused with GNSS is the core of our Physical AI Positioning & Mapping Software.

AI Optimization

On edge or cloud training and re-training software for positioning augmentation.

Scalable

Uses low-cost sensors, permits Tier1’s and OEMs to scale across mass market platforms.

Crowdsource Mapping

Digital map crowdsourcing and building magnetic and perception sensor maps.

Highly Portable

Software is hardware and sensor agnostic.

Physical AI Positioning and Mapping Software

Decimeter accuracy even when GNSS is lost (tunnels, underground) or degraded (heavy multipath).

Software is designed for endless applications, ADAS, Autonomy, telematics, and In-vehicle Infotainment.

Positioning Software for Vehicles, Fleets & Autonomous Platforms

Reliable, scalable, and cost-effective software that delivers continuous positioning – no extra hardware required.

Assisted Driving –— Steer-by-Wire

Precision Where Steer-by-Wire Gets Critical.

Steering Input & Feedback

Steering input sensing must remain accurate across angle, torque-related, and HWA motor-position measurements despite temperature, mechanical tolerances, magnetic stray fields and safety-related redundancy requirements.

Performance Under Real Vehicle Conditions

Hall and TMR sensing options are designed for accurate feedback across demanding temperatures, mechanical tolerances and magnetic environments.

Stray-Field Robustness

Selected sensor families are designed for robust measurement under external magnetic disturbance, with ISO 11452‑8:2015 robustness available on validated variants.

Redundancy & Functional Safety Options

Single- and dual-die architectures plus product-specific ISO 26262 SEooC ASIL-ready variants support different safety-related steering concepts.

Steering Angle Sensors

Contactless 360° steering-position measurement.

TDK Hall and TMR angle sensors cover steering-angle measurement with digital-interface, stray-field and accuracy options across selected variants.

HAL/R 3550/39x0

Hall angle sensing for 360° steering-position measurement, with digital interface options and optional active stray-field compensation.

HAL/R 39x0

TAS 214x/4240

Analog TMR angle sensing for high-resolution, low-noise steering-position measurement; TAS4240 allows fail-operational support for higher availability requirements.

TAD 214x

Digital TMR angle sensing for steering-position measurement with compensated angle output options.

Low-noise torque-related sensing with redundant options.

TDK linear Hall sensors measure magnetic-field amplitude for steering-torque applications, with low-noise, low-offset-drift and single- or dual-die options.

HAL/R 24xy

Dual-die linear Hall sensing with in-package redundancy for steering-torque measurement.

Position feedback for precise control of the steering-feel motor.

Motor-position feedback supports control of the hand-wheel actuator (HWA) motor that generates steering feel in steer-by-wire systems.

HAL 3025

Fast, stray-field-robust position sensing with amplified analog outputs. Available as a single-die variant for ASIL‑D fail-safe systems.

TAS 4240

High-accuracy analog TMR sensing for motor-position feedback.

TAS 8240

High-reliability TMR position sensing for high-ASIL, fail-operational architectures.

TAD 4140

Redundant digital TMR sensing for high-reliability, high-resolution, high-speed motor-position feedback.

SbW Motor ECU

Steering ECUs and actuator stages face ripple current, heat, vibration, and power-line noise alongside demanding packaging constraints.

Robust Power Delivery

Hybrid polymer capacitors help stabilize and buffer power in stressed steering and actuator electronics.

Power-Line Noise Suppression

Common-mode filtering helps reduce power-line noise around actuator, inverter, and DC-DC converter environments.

Scalable High-Current DC-DC Conversion

Power inductors help manage high currents and support efficient, compact DC-DC conversion across steering and actuator power classes.

Hybrid Polymer Capacitors

Low ESR and high ripple-current capability for stressed steering electronics.

TDK hybrid polymer aluminum capacitors combine low ESR and high ripple-current capability for demanding automotive power environments.

B40940 (SMD) & B40620 (Axial)

Automotive hybrid polymer capacitor family for high ripple-current power applications.

Power-line filtering for EMC-critical steering electronics.

TDK common-mode filtering solutions help reduce power-line noise around actuator and control electronics.

Ring Core CMC

Ring-core common-mode filtering for power lines, available as SMD or leaded variants, in standard and application-specific designs.

Low-loss power inductors for high-current EPS, sensor, and actuation circuits.

Power inductors help manage high currents and support efficient, compact DC-DC conversion across steering and actuator power classes.

TFM Series

Ultra-compact, low-profile thin-film inductors for high-frequency PoL buck converters powering EPS microcontrollers and sensors.

SPM Series

High-saturation, low‑DCR molded metal inductors for the primary EPS DC‑DC stage, minimizing conduction and thermal losses.

BCL Series

Rugged, high-temperature metallic magnetic inductors for compact, on-motor or under-the-hood EPS DC‑DC conversion.

Road-Wheel Actuation & Position

Road-wheel actuator sensing must deliver reliable commutation and precise motor-position feedback under thermal, magnetic, and safety-related constraints.

Low-Power Commutation Sensing

Selected Hall switches combine fast switching and low currents for BLDC motor commutation.

High-Resolution Position Feedback

TMR sensing provides high-resolution motor-position feedback with strong temperature stability.

Redundancy & Functional Safety Options

Selected TMR architectures provide redundant signal paths and product-specific functional-safety options for demanding motor-control concepts.

BLDC Motor Commutation

Low-power Hall switching for steering-motor commutation.

TDK Hall switches provide rotor-state switching information for BLDC motor commutation in steering-motor applications.

HAL 15xy 3-wire

Hall-switch family for BLDC motor commutation; HAL1502 draws 1.6 mA (typ.) in the 3-wire version.

TAS 214x/4240

TMR for accurate, ultra-fast, and reliable analog position sensing for motor commutation.

High-resolution angle feedback with temperature-stable and redundant options.

TDK TMR angle sensors and fast Hall angle sensors provide end-of-shaft motor-position feedback for steering-motor control, with analog, digital, and redundant architectures across selected variants.

TAS 214x/414x/4240/8240

Analog TMR angle sensing for motor-shaft position feedback; TAS414x adds redundant sensing variants. TAS4240 & TAS8240 add fail-operational support per ISO 26262, with 4 or 8 half-bridges to keep operating in the event of a single failure.

TAD 214x

Digital TMR angle sensing for end-of-shaft motor-position feedback, with compensated digital output options.

TAA 6140

High-redundancy analog TMR angle sensing with amplified differential outputs for remote motor-position applications.

HAL-R 3025

Fast, stray-field-robust position sensing with amplified analog outputs. Available as a single-die variant for ASIL‑D fail-safe systems (HAL3025) or fully redundant for ASIL‑D fail-operational concepts (HAR3025).

Close

High-Performance Computing

Power Management

Stable Power for Powerful SoCs.

48/12 V Power Conversion

SoC Power Management

SoC Decoupling & Filtering

PMICs & Voltage Regulators

In-Vehicle Networking

Design with Confidence. Across Network Interfaces.

Camera / SerDes Connections

Ethernet & CAN

Motion & Positioning Sensing

Precision in Motion. Confidence in Position.

Inertial Measurement Unit (IMU)

Physical AI Positioning & Mapping

Steer-by-Wire

Precision Where Steer-by-Wire Gets Critical.

Steering Input & Feedback

SbW Motor ECU

Road‑Wheel Actuation & Position

Why TDK for SDV –— Confidence, Engineered.

The right component is only part of the answer.

A head start –— Don’t start from zero.

TDK works on reference designs, standards, and new applications early. So, when technology reaches your program, your team can build on what we’ve already learned.

The right fit –— Choose the technology around the requirement. Not the other way around.

Across networking, power, and sensing, TDK offers different technologies, variants, and form factors to match different interface, current, noise, space, and sensing requirements.

Built for the real vehicle –— Performance must hold up where it matters.

TDK technologies address the thermal, electrical, magnetic, and packaging constraints that determine whether a design works reliably in the vehicle.

IVN / E/E Architecture –— Multiple interfaces. Application‑specific solutions.

Interface-specific filtering across CAN, CAN FD, Automotive Ethernet, and SerDes
Same-footprint ACT1210 variants
PoC options matched to current, impedance, and footprint

Power Management for HPC –— Power technology from conversion to the SoC.

Lower losses
Stable power delivery
Higher power density
Rail-by-rail technology choice
High-frequency noise control

Steer-by-Wire –— Precision under real steering conditions.

Stray-field-robust sensing
Redundancy & Functional Safety options
High-resolution position feedback
Power stability under voltage transients, heat, and vibration
Power-line noise suppression

Expert Voices –— SDV in Focus

Short expert perspectives on technologies, challenges, and design decisions shaping the Software-Defined Vehicle.

The Big Shift in Ethernet Isn’︎t Speed.

Leopoldo Bertossi · Head of Application Marketing

PoDL. No Slides. Just Proof.

Julian Dörfler · Expert Semiconductor Partnership

EMC Problems - Leopoldo Bertossi - Thumb

EMC Problems. Now or Later.

Leopoldo Bertossi · Head of Application Marketing

Continue the Conversation –— Let’s talk SDV.

Tell us what you’re working on –
and where it gets difficult.

Leopoldo Bertossi

Deputy General Manager, Semiconductor Partnership

Head of Application Marketing

Connect on LinkedIn

First name* Vorname* 名字* お名前*

First name is required Vorname wird benötigt 名字是必需的お名前は必須項目です。

Last name* Nachname* 姓* 電子メール

Last name is required Nachname wird benötigt 需要填写姓氏姓は必須項目です

E-mail* E-Mail* 电邮* 電子メール*

E-mail is required E-Mail wird benötigt 需要使用电子邮件電子メールは必須項目です。

Company* Unternehmen* 公司* 会社名*

Company is required Unternehmen wird benötigt 公司需要会社名は必須項目です。

Country* Land* 国家* 国名*

Country is required Land wird benötigt 所需国家国名は必須項目です。

Main interest*

Interest is required

What are you working on?

What can we help with?

Message is required

Confidence, Engineered.

TDK Solutions for Software-Defined Vehicles (SDV)

TDK Solutions for SDV

High-Performance Computing (HPC)

In-Vehicle Networking

Power Management

Motion & Positioning Sensing

Assisted Driving

Steer-By-Wire

Confidence, Engineered.

Explore where TDK fits into your SDV architecture:

High-Performance Computing (HPC)

In-Vehicle Networking

Back

Camera / SerDes Connections

Ethernet & CAN

Power Management

Back

48/12 V Power Conversion

SoC Power Management

SoC Decoupling & Filtering

PMICs & Voltage Regulators

Motion & Positioning Sensing

Back

Inertial Measurement Unit (IMU)

Physical AI Positioning & Mapping

Assisted Driving

Steer-by-Wire

Back

Steering Input & Feedback

SbW Motor ECU

Road‑Wheel Actuation & Position

High-Performance Computing –— In-Vehicle Networking

Camera / SerDes Connections

Stable Power‑over‑Coax

Wire-wound and multilayer options

Compact options for tight layouts

Wire-Wound PoC Inductors

High-current wire-wound inductors for high-resolution camera networks.

ADL2012

ADL32VHC

Multilayer PoC Inductors

MLJ-G

Ethernet & CAN

One platform. Multiple interfaces.

Same footprint. Different requirements.

Network standard compliance.

Automotive Ethernet

Scalable common-mode noise suppression from 10BASE‑T1S to 1000BASE‑T1.

ACT1210E

ACT1210L

ACT1210G

CAN / CAN FD

Optimized signal integrity and ringing suppression for CAN FD networks.

ACT1210D

High-Performance Computing –— Power Management

48/12 V Power Conversion

High Power Density

Ripple-Current Capability

48 V-Ready Reliability

High-Current Flat-Wire SMD Inductors

High currents with very low DC resistance.

ERUC23

Hybrid Polymer Capacitors

High ripple-current capability. Low ESR.

B40910

75 V & 100 V Automotive MLCCs

Reliable voltage headroom and low ESR for 48 V systems.

CGA Series

SoC Power Management

Lower Losses

Stable Power Delivery

Higher Power Density

Power Inductors

High current. Low DCR. Compact rail design.

CLT32

CLT42

BCM

Automotive MLCCs

High capacitance range for compact compute power rails.

Physical AI Positioning & Mapping

AI Optimization

Crowdsource Mapping

Highly Portable

Physical AI Positioning and Mapping Software