TDK Electronics · TDK Europe

2D piezo MEMS µ‑mirror

for projection systems

 mMirror SM
 mMirror XL

The new 2D piezo-based MEMS µ‑mirror results from TDK’s extensive experience in actuation and sensing technology, offering cutting-edge technology for laser beam scanning systems (LBS). The 2D piezo MEMS µ‑mirror offers the best solution for augmented reality and other projection applications in terms of the most compact footprint, lowest power consumption, huge field of view (FOV), high resolution, and reliability on the market.

Learn more about this outstanding technology and the applications that can be achieved with it.

Actuation principle of a piezo-electric mirror

Motion

The piezo-electric (lead zirconate titanate, PZT) thin film deforms an actuation ring. This ring movement leads to a mechanical motion of the reflective area in the center of the mirror. A laser beam is focused on this mirror area and gets deflected due to this movement.

Function

By generating a deflection of a laser beam in two orthogonal directions due to the rotation around two sets of torsional beams an image can be projected on a surface. 

Advantages of MEMS µ‑mirrors scanning

Conventional 1D projection systems with two separate mirrors feature one fast-moving and one slow-moving mirror.

A projection with TDK’s MEMS µ‑mirror only needs one 2D mirror. The two resonant high-frequency axes lead to a very compact projection module with a Lissajous scan pattern and excellent image quality, especially for fast-moving objects.

Lissajous scanning provides key advantages over raster scanning:

  • Reduced complexity, size, and power consumption of the MEMS mirror
  • Higher FOV in the vertical axis
  • Higher refresh rate
  • Better perceived quality of the image (assuming that optimal scanning patterns are selected)
  • Good fill rate at the edges of the FOV
  • High system-level yield (multiple solutions for frequency ratios)

Overview of MEMS µ-mirror-based projection system

These building blocks show the main components of a projection system including the picture-forming unit (MEMS µ‑mirror) from TDK:  

 mmirror_schema_auto
Figure 1:

AR-HUD

 mmirror_schema_ar
Figure 2:

AR/VR Smart Glasses

TDK’s MEMS µ‑mirror characteristics

Discover MEMS µ‑mirror current specification range ① and future development targets ②:

Optics

 1 _Optics Pic

Field of view

  1. Up to 32° (horizontal),
    up to 32° (vertical)
  2. Up to 66° (horizontal),
    up to 44° (vertical)

Frame rate

  1. Up to 60 Hz
  2. Up to 120 Hz

Reflectivity (visible light)

  1. > 91%
  2. > 98%

Sensing

Integrated

Scanning

 2 _Scanning Pic

Scanning type

Lissajous scanning

Resonance frequency

  1. 37 kHz (horizontal),
    17 kHz (vertical)
  2. 30 - 39 kHz (horizontal),
    17 - 20 kHz (vertical)

Static deformation

  1. Better than a radius of 2.4  5 m
  2. Better than a radius of 10 m

Dynamic deformation

  1. Amplitude < 300 - 600 nm
  2. < 300 nm

Dimensions

 3 _Dimensions Pic

Mirror diameter

  1. 1.5 - 1.7 mm
  2. 1.4 - 1.8 mm

Die size

  1. 8.5 x 7.8 mm
  2. 7 x 5.5 - 9.5 x 7.7 mm

Image resolution

  1. Full HD (1.920 x 1.080) 
  2. Up to 8K

Packaging

  1. No packaging
  2. Low-pressure atmosphere 

Power

 4 _Power Pic

Actuation voltage AC

<10 V

Power consumption

  1. Max. 90 mW*
  2. Max. 30 mW*  

* With recuperation of reactive power by appropriate recovery strategy

Development kit

 Devkit

Discover the potential and literally “see” the benefits of our MEMS µ‑mirror with the development kit.

Contents:

  • TDK MEMS µ‑mirror mounted on a testing PCB
  • TDK MEMS µ‑mirror driver
  • STM programmer
  • Adapter PCB
  • USB to UART adapter
  • USB stick including documentation, applications, firmware binary, and datasheets
  • STDC14 cortex ribbon cable for the STM programmer
  • Extension cable for extending the mounting range of the MEMS µ‑mirror
     

Order now

TDK – your reliable partner

Expertise

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 PicPool_Dlb_Micro_mirror_wafer_3_2024
 PicPool_Dlb_Micro_mirror_wafer_5_2024
 PicPool_Dlb_Micro_mirror_wafer_6_2024
 PicPool_Dlb_Spin_coating_1_2024
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In-house production including a MEMS process at FB

Technology
TDK develops customer-specific MEMS µ‑mirrors for the automotive and wearable industries.

Production
In-house production including a MEMS process at the TDK foundry. These customer-specific developed MEMS µ‑mirror designs were produced and manufactured directly in the same plant in Europe.

Engineering
TDK has a team of engineers optimizing your design and bringing out the best projection solution. In addition, TDK offers design rules for optimized design.

Quality from Europe

 Quality Pic

TDK is a market leader in passive components utilizing also semiconductor production processes in its foundry for next-generation products such as the MEMS µ‑mirror.

Everything from one hand, tested, verified, and released for further steps, produced and developed in the heart of Europe.

Get in contact

Are you interested in solutions with MEMS µ‑mirror? 

TDK’s expert Keyvan Ghanaviztchi will be glad to help you.

First name is required Vorname wird benötigt 名字是必需的 お名前は必須項目です。
Last name is required Nachname wird benötigt 需要填写姓氏 姓は必須項目です
E-mail is required E-Mail wird benötigt 需要使用电子邮件 電子メールは必須項目です。
Company is required Unternehmen wird benötigt 公司需要 会社名は必須項目です。
Country is required Land wird benötigt 所需国家 国名は必須項目です。
Message is required Nachricht wird benötigt 所需信息 メッセージは必須項目です。
Accepting the data usage is required Datennutzung muss akzeptiert werden 必须接受数据使用 データ利用を承諾することが必要
More information Weitere Informationen 了解更多 詳細情報

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