TDK launches high‑reliability automotive NTC thermistors rated for +175 °C

• Guarantees operation in high‑temperature environments up to +175 °C
• Adopts AgPd terminals compatible with conductive‑glue mounting
• AEC‑Q200 compliant (automotive grade)

TDK Corporation (TSE:6762) announced today that it has expanded its NTCSP series of NTC thermistors. These components are designed for conductive‑glue mounting for operation in high‑temperature environments up to +175 °C. Mass production of this series began in February 2026.

To drive higher automotive performance, more powerful and heat-resistant power semiconductors are required. Consequently, electronic components mounted in these power modules must also be able to withstand higher temperatures. While the maximum guaranteed operating temperature for TDK's existing products was +150 °C, the company has now expanded its range to cover up to +175 °C.

This product is a high‑reliability device compliant with AEC‑Q200 and realizes a wide operating temperature range of -55 °C to +175 °C. It can be used for various temperature detection and temperature compensation applications across low to high temperature ranges. It is suitable for automotive applications such as anti‑lock braking systems (ABS), transmissions, and engines. By adopting AgPd (silver‑palladium) terminals compatible with conductive‑glue mounting, this series can operate at +175 °C; this was difficult to achieve with conventional solder mounting.

The NTCSP series offers 10 kΩ and 100 kΩ types in a 1.6 x 0.8 mm package.

TDK will continue to develop NTC thermistors to meet a wide variety of needs, including expansion of chip sizes, thermistor characteristics, and operating temperature ranges.